CN202633279U - Novel lead wire framework - Google Patents
Novel lead wire framework Download PDFInfo
- Publication number
- CN202633279U CN202633279U CN 201220152346 CN201220152346U CN202633279U CN 202633279 U CN202633279 U CN 202633279U CN 201220152346 CN201220152346 CN 201220152346 CN 201220152346 U CN201220152346 U CN 201220152346U CN 202633279 U CN202633279 U CN 202633279U
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- CN
- China
- Prior art keywords
- pin
- lead wire
- muscle
- novel lead
- wire framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a novel lead wire framework, comprising a plurality of framework units horizontally arranged side by side and being in series connection by a middle bar and a lower bar. Each framework unit comprises a radiating zone, a chip zone, an intermediate pin and left side and right side pins respectively located on two sides of the intermediate pin; the upper side of the chip zone is in connection with the radiating zone which is provided with a radiating through hole; the lower side of the chip zone is in connection with an upper end of the intermediate pin; the lower ends of the intermediate pin and the left side and right side pins are in connection with the lower bar; the central parts of the intermediate pin and the left side and right side pins are in series connection through the middle bar; the radiating through hole is open to the top edge or a side edge of the radiating zone. The novel lead wire framework has the characteristics of a simple structure, convenient use, strong adherence, good product quality and high safety performance.
Description
Technical field
The utility model relates to a kind of semiconductor element, relates in particular to a kind of novel lead wire framework.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The radiating area of connection-core section plays thermolysis, and after resin-encapsulated, radiating area separates resin-encapsulated, and whole adherence is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, it is a kind of simple in structure, easy to use that the utility model provides, and adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle; Frame unit comprises radiating area, chip region, middle pin and lays respectively at left side, the right side pin of middle pin both sides, chip region top connection radiating area, and radiating area is provided with the heat radiation through hole; Pin upper end in the middle of the chip region below connects; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle, and middle pin middle part and left side, right side pin middle part are by middle muscle serial connection, and it is characterized in that: said heat radiation through hole is opening-like towards radiating area top margin or side.
Further, said heat radiation through hole is the semicircle opening towards the radiating area top margin, and the opening both sides of radiating area top margin all are connected with pin.
Further, said left side pin and muscle and its terminal weld zone that is connected during stretch out the top of right side pin.
Further, said chip region plane is lower than pin area plane 1-3mm.
Further, the said pin plane of going up is below or above radiating area plane 1-2mm.
Further, said muscle down is provided with the through hole of corresponding middle pin.
Further, said muscle down is provided with and faces the corresponding gap in center between two frame units mutually.
Adopt above technical characterictic, the beneficial effect of the utility model is:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, the step edge of chip region dual-side when encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevents that encapsulation from coming off, and guarantees Stability Analysis of Structures, good product quality;
3, radiating area is provided with the heat radiation through hole of opening towards top margin or side, increases the resin-encapsulated contact area, improves encapsulation adherence and radiating efficiency, further increases the service life;
4, muscle is provided with gap down, when the segmentation framework unit, is convenient to operation, and is time saving and energy saving, increases work efficiency, and guarantees installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is the utility model structural representation.
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, last pin 12, chip region 2, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, middle muscle 4, following muscle 5, through hole 6, gap 7.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical scheme of the utility model is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of novel lead wire framework by a plurality of horizontal Tiles be provided with several frame units through in muscle 4 compose in series with following muscle 5; Each frame unit comprises radiating area 1, chip region 2, middle pin 31 and lays respectively at left side, the right side pin 32,33 of middle pin both sides; Chip region 2 tops connect radiating area 1; Radiating area 1 is provided with towards radiating area top margin or the opening-like heat radiation through hole 11 of side, and heat radiation through hole 11 opening both sides all are connected with pin 12, and last pin 12 planes are below or above radiating area 1 plane 1-2mm; Chip region 2 planes are lower than pin area 3 plane 1-3mm; Pin 31 upper ends in the middle of chip region 2 belows connect; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle 5, and middle pin middle part and left side, right side pin middle part are by middle muscle 4 serial connections, and the left side pin stretches out middle muscle and its terminal weld zone 34 that is connected with the top of right side pin; Following muscle 5 is provided with the through hole 6 of corresponding middle pin 31, and following muscle 5 is provided with and faces the corresponding gap 7 in center between two frame units mutually.
What should explain at last is: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification has carried out detailed explanation to the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of the spirit and the scope of the utility model, and it all should be encompassed in the claim scope of the utility model.
Claims (7)
1. novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle; Frame unit comprises radiating area, chip region, middle pin and lays respectively at left side, the right side pin of middle pin both sides, chip region top connection radiating area, and radiating area is provided with the heat radiation through hole; Pin upper end in the middle of the chip region below connects; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle, and middle pin middle part and left side, right side pin middle part are by middle muscle serial connection, and it is characterized in that: said heat radiation through hole is opening-like towards radiating area top margin or side.
2. a kind of novel lead wire framework according to claim 1 is characterized in that: said heat radiation through hole is the semicircle opening towards the radiating area top margin, and the opening both sides of radiating area top margin all are connected with pin.
3. a kind of novel lead wire framework according to claim 1 is characterized in that: said left side pin stretches out middle muscle and its terminal weld zone that is connected with the top of right side pin.
4. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region plane is lower than pin area plane 1-3mm.
5. a kind of novel lead wire framework according to claim 1 is characterized in that: the said pin plane of going up is below or above radiating area plane 1-2mm.
6. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with the through hole of corresponding middle pin.
7. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with and faces the corresponding gap in center between two frame units mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152346 CN202633279U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152346 CN202633279U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633279U true CN202633279U (en) | 2012-12-26 |
Family
ID=47386437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220152346 Expired - Fee Related CN202633279U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633279U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409806A (en) * | 2016-12-06 | 2017-02-15 | 四川富美达微电子有限公司 | IC lead bracket |
| CN106409805A (en) * | 2016-12-06 | 2017-02-15 | 四川富美达微电子有限公司 | Five-pin IC structure |
-
2012
- 2012-04-12 CN CN 201220152346 patent/CN202633279U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409806A (en) * | 2016-12-06 | 2017-02-15 | 四川富美达微电子有限公司 | IC lead bracket |
| CN106409805A (en) * | 2016-12-06 | 2017-02-15 | 四川富美达微电子有限公司 | Five-pin IC structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Taizhou Yourun Electronic Co., Ltd. Assignor: Zhang Xuan Contract record no.: 2013320000563 Denomination of utility model: Novel lead frame Granted publication date: 20121226 License type: Exclusive License Record date: 20130619 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20150412 |
|
| EXPY | Termination of patent right or utility model |