CN102637665A - Lead frame with grooves in chip areas - Google Patents
Lead frame with grooves in chip areas Download PDFInfo
- Publication number
- CN102637665A CN102637665A CN 201210105873 CN201210105873A CN102637665A CN 102637665 A CN102637665 A CN 102637665A CN 201210105873 CN201210105873 CN 201210105873 CN 201210105873 A CN201210105873 A CN 201210105873A CN 102637665 A CN102637665 A CN 102637665A
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- China
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- area
- chip
- pin
- chip region
- lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a lead frame with grooves in chip areas. The lead frame comprises a plurality of frame units horizontally arranged side by side, wherein each frame unit comprises a radiation area, a chip area and a pin area; the radiation area is connected above the chip area; a chip positioning area with an electroplated metal layer on the surface is arranged in the chip area; the pin area is connected below the chip positioning area; and a circle of closed groove the same as the profile of a carried chip is arranged in the chip positioning area. The lead frame has the advantages of simple structure, strong adherence, good product quality and high safety performance and is convenient to use.
Description
Technical field
The present invention relates to a kind of semiconductor element, relate in particular to a kind of lead frame of chip area band groove.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The lead frame chip region carries and is connected chip, and chip normally is bonded to chip region, chip region smooth surface; When bonding silver slurry dropped on the chip region, chip region and chip chamber were prone to residual air, behind the resin-encapsulated lead frame; Product work heating makes resin, air thermal expansion, because both thermal coefficient of expansions are different, thereby damages product; And the ganoid lead frame adherence of resin-encapsulated is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, the invention provides a kind of simple in structurely, easy to use, adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of lead frame of chip region band groove; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area, and the chip region top connects radiating area, is provided with the surface in the chip region and is the chip positioning area of electroplated metal layer; Chip positioning area below connects pin area, it is characterized in that being provided with in the said chip positioning area circle closed pockets identical with contained chip outline.
Further, the groove inner plane of said chip positioning area is less than or equal to the outer plane of chip positioning area groove.
Further, the dual-side of said chip region is equipped with the above step edge of one deck.
Further, said radiating area is provided with the heat radiation through hole more than.
Further, said heat radiation through hole is circular hole or rectangular opening or circular hole and the rectangular opening combination bore of overlapping.
Further; Said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its terminal surface that is connected is the electroplated metal layer weld zone, and the below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward described chip region of connection or chip positioning area.
Further, said chip region plane is lower than pin area plane 1-3mm.
Further; Said several frame units are connected through the last muscle more than by radiating area separately; Or connect through lower plate, or connect through lower connecting plate through the last muscle connection more than one and by separately pin area by separately radiating area by pin area separately.
Further, the pin area of said several frame units is provided with along the lower connecting plate of pin area pin direction slotted hole through a solid connecting plate and and is connected at interval.
Further, said chip positioning area is provided with the above groove that connects between radiating area.
Adopt above technical characterictic, the invention has the beneficial effects as follows:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, the chip positioning area is installed chip, and the accurate location of guaranteeing chip, and chip positioning area electroplated metal layer, and the groove of chip positioning area can strengthen the adherence of chip and chip region, raising serviceability;
3, the step edge that is connected groove and chip region dual-side between chip positioning area and the radiating area; When encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevent that encapsulation from coming off; Guarantee Stability Analysis of Structures, good product quality;
4, radiating area is provided with the overlap heat radiation through hole of combination bore shape of circular hole or rectangular opening or circular hole and rectangular opening, increases the resin-encapsulated contact area, improves radiating efficiency, further increases the service life;
5, offer the gap of slotted hole and following muscle on the lower connecting plate of connection lead frame, when the segmentation framework unit, be convenient to operation, time saving and energy saving, increase work efficiency, guarantee installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is a structural representation of the present invention.
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, chip region 2, chip positioning area 21, groove 22 connects groove 23; Step edge 24, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34; Last muscle 4, middle muscle 5, following muscle 6, lower connecting plate 7, gap 8, slotted hole 9.
Embodiment
Below in conjunction with embodiment shown in the drawings technical scheme of the present invention is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of lead frame of chip region band groove is provided with several frame units by a plurality of horizontal Tiles and forms; Each frame unit comprises radiating area 1, chip region 2 and pin area 3; Chip region 2 tops connect radiating area 1, and radiating area 1 is provided with the heat radiation through hole 11 more than, and the heat radiation through hole is circular hole or rectangular opening or circular hole and the rectangular opening combination bore of overlapping; Be provided with the surface in the chip region 2 and be the chip positioning area 21 of electroplated metal layer; Be provided with the groove 22 of a circle sealing identical in the chip positioning area 21 with contained chip outline; Groove 22 inner planes are less than or equal to the outer plane of chip positioning area 21 grooves; The dual-side of chip region 2 is equipped with the above step edge 24 of one deck, and chip positioning area 21 is provided with the above groove 23 that connects between radiating area 1, and chip region 2 planes are lower than pin area 3 plane 1-3mm; Pin area 3 comprises left side pin 32, middle pin 31 and right side pin 33; The left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle 5 with the top of right side pin and its terminal surface that is connected is electroplated metal layer weld zone 34; The below of left side pin and right side pin is connected in down on the muscle 6, and middle pin extends upward and connects described chip region or chip positioning area; Several frame units are connected through the last muscle more than one 4 by radiating area 1 separately; Or connect through lower plate by pin area separately; Or connect through lower connecting plate through the last muscle connection more than one and by separately pin area by separately radiating area; The pin area 3 of several frame units is provided with along the lower connecting plate of pin area pin direction slotted hole 9 is separated through a solid connecting plate 7 and and is connected, and following muscle 6 is provided with and faces the corresponding gap 8 in center between two frame units mutually.
What should explain at last is: above embodiment only in order to the explanation the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification has carried out detailed explanation to the present invention with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the present invention; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the present invention, and it all should be encompassed in the claim scope of the present invention.
Claims (10)
1. the lead frame of a chip region band groove; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area, and the chip region top connects radiating area, is provided with the surface in the chip region and is the chip positioning area of electroplated metal layer; Chip positioning area below connects pin area, it is characterized in that: be provided with a circle closed pockets identical with contained chip outline in the said chip positioning area.
2. the lead frame of a kind of chip region band groove according to claim 1 is characterized in that: the groove inner plane of said chip positioning area is less than or equal to the outer plane of chip positioning area groove.
3. the lead frame of a kind of chip region band groove according to claim 1 is characterized in that: the dual-side of said chip region is equipped with the above step edge of one deck.
4. the lead frame of a kind of chip region band groove according to claim 1 is characterized in that: said radiating area is provided with the heat radiation through hole more than.
5. the lead frame of a kind of chip region band groove according to claim 4 is characterized in that: said heat radiation through hole is circular hole or rectangular opening or circular hole and the rectangular opening combination bore of overlapping.
6. the lead frame of a kind of chip region band groove according to claim 1; It is characterized in that: said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its terminal surface that is connected is the electroplated metal layer weld zone; The below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward and connects described chip region or chip positioning area.
7. according to the lead frame of claim 1 or 2 or 3 described a kind of chip region band grooves, it is characterized in that: said chip region plane is lower than pin area plane 1-3mm.
8. the lead frame of a kind of chip region band groove according to claim 1; It is characterized in that: said several frame units are connected through the last muscle more than by radiating area separately; Or connect through lower plate, or connect through lower connecting plate through the last muscle connection more than one and by separately pin area by separately radiating area by pin area separately.
9. the lead frame of a kind of chip region band groove according to claim 8 is characterized in that: the pin area of said several frame units is provided with along the lower connecting plate of pin area pin direction slotted hole through a solid connecting plate and and is connected at interval.
10. the lead frame of a kind of chip region band groove according to claim 1 is characterized in that: said chip positioning area is provided with the above groove that connects between radiating area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105873 CN102637665A (en) | 2012-04-12 | 2012-04-12 | Lead frame with grooves in chip areas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105873 CN102637665A (en) | 2012-04-12 | 2012-04-12 | Lead frame with grooves in chip areas |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102637665A true CN102637665A (en) | 2012-08-15 |
Family
ID=46622008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210105873 Pending CN102637665A (en) | 2012-04-12 | 2012-04-12 | Lead frame with grooves in chip areas |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102637665A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956599A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN104253093A (en) * | 2013-06-26 | 2014-12-31 | 深圳赛意法微电子有限公司 | Module group packaging frame of power device, and manufacturing method of power device |
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
| CN111090058A (en) * | 2019-11-22 | 2020-05-01 | 珠海格力电器股份有限公司 | Frame, preparation method thereof and high-temperature reverse bias test |
| CN111180412A (en) * | 2020-01-03 | 2020-05-19 | 长电科技（宿迁）有限公司 | Lead frame with grooves on side edges and manufacturing method thereof |
| CN112444717A (en) * | 2019-08-29 | 2021-03-05 | 珠海格力电器股份有限公司 | Verification method for matching degree of plastic package material and chip |
| CN112786558A (en) * | 2019-11-05 | 2021-05-11 | 珠海格力电器股份有限公司 | Semiconductor device and reliability verification method thereof |
-
2012
- 2012-04-12 CN CN 201210105873 patent/CN102637665A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956599A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN104253093A (en) * | 2013-06-26 | 2014-12-31 | 深圳赛意法微电子有限公司 | Module group packaging frame of power device, and manufacturing method of power device |
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
| CN112444717A (en) * | 2019-08-29 | 2021-03-05 | 珠海格力电器股份有限公司 | Verification method for matching degree of plastic package material and chip |
| CN112786558A (en) * | 2019-11-05 | 2021-05-11 | 珠海格力电器股份有限公司 | Semiconductor device and reliability verification method thereof |
| CN112786558B (en) * | 2019-11-05 | 2023-02-28 | 珠海格力电器股份有限公司 | Semiconductor device and reliability verification method thereof |
| CN111090058A (en) * | 2019-11-22 | 2020-05-01 | 珠海格力电器股份有限公司 | Frame, preparation method thereof and high-temperature reverse bias test |
| CN111180412A (en) * | 2020-01-03 | 2020-05-19 | 长电科技（宿迁）有限公司 | Lead frame with grooves on side edges and manufacturing method thereof |
| CN111180412B (en) * | 2020-01-03 | 2021-05-04 | 长电科技（宿迁）有限公司 | Lead frame with grooves on side edges and manufacturing method thereof |
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| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120815 |