CN202633283U - Lead wire framework with high connectivity - Google Patents
Lead wire framework with high connectivity Download PDFInfo
- Publication number
- CN202633283U CN202633283U CN 201220152371 CN201220152371U CN202633283U CN 202633283 U CN202633283 U CN 202633283U CN 201220152371 CN201220152371 CN 201220152371 CN 201220152371 U CN201220152371 U CN 201220152371U CN 202633283 U CN202633283 U CN 202633283U
- Authority
- CN
- China
- Prior art keywords
- pin
- lead frame
- high connectivity
- chip region
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a lead wire framework with high connectivity, which is composed of a plurality of framework units horizontally arranged side by side. Each framework unit comprises a radiating zone, a chip zone and a pin zone; the upper side of the chip zone is in connection with the radiating zone with a radiating hole; the lower side of the chip zone is in connection with the pin zone; the radiating zone is provided with at least one loop of a second groove winding the radiating hole. The lead wire framework with high connectivity has the characteristics of a simple structure, convenient use, strong adherence, good product quality and high safety performance.
Description
Technical field
The utility model relates to a kind of semiconductor element, relates in particular to a kind of high connectivity lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The lead frame chip region carries and is connected chip, and chip normally is bonded to chip region, chip region smooth surface; When bonding silver slurry dropped on the chip region, chip region and chip chamber were prone to residual air, behind the resin-encapsulated lead frame; Product work heating makes resin, air thermal expansion, because both thermal coefficient of expansions are different, thereby damages product; And the ganoid lead frame adherence of resin-encapsulated is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, it is a kind of simple in structure, easy to use that the utility model provides, and adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of high connectivity lead frame; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area; The radiating area of chip region top connecting band heat radiation through hole, the chip region below connects pin area, it is characterized in that: said radiating area is provided with above second groove around the heat radiation through hole of a circle.
Further; Said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its end is connected the weld zone, and the below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward and connects described chip region.
Further, be provided with first groove identical in the said chip region with contained chip outline.
Further, said chip region dual-side is equipped with the above step edge of one deck.
Further, said chip region plane is lower than pin area plane 1-1.5mm.
Further, said several frame units radiating area separately connects through the last muscle more than.
Further, said muscle down is provided with the position in the corresponding manhole of middle pin.
Further, said second groove is around heat radiation through hole sealing or towards radiating area either side hatch frame, second groove is smooth curve groove or multistage straight-line groove.
Further, said pin area of facing two frame units mutually connects through lower connecting plate.
Further, said muscle down is provided with the corresponding gap of lower connecting plate.
Adopt above technical characterictic, the beneficial effect of the utility model is:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, first groove of chip region can strengthen the adherence of chip and chip region, improves serviceability; Can establish the connection groove between chip region and the radiating area, and the step edge of chip region both sides, when encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevent that encapsulation from coming off, and guarantees Stability Analysis of Structures, good product quality;
3, radiating area is provided with the overlap heat radiation through hole of combination bore shape of circular hole or rectangular opening or circular hole and rectangular opening; Cooperate around second groove of heat radiation through hole; Increase the resin-encapsulated contact area, improve radiating efficiency, further increase the service life;
4, the corresponding following muscle of lower connecting plate of connection lead frame is provided with gap, when the segmentation framework unit, is convenient to operation, and is time saving and energy saving, increases work efficiency, and guarantees installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model.
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, the second grooves 12, chip region 2, groove 21, step edge 22, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, last muscle 4, middle muscle 5, following muscle 6, lower connecting plate 7, gap 8, through hole 9.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical scheme of the utility model is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of high connectivity lead frame is provided with several frame units by a plurality of horizontal Tiles and forms; Each frame unit comprises radiating area 1, chip region 2 and pin area 3; The radiating area 1 of chip region 2 top connecting band heat radiation through holes 11, several frame units radiating area 1 separately connects through the last muscle more than one 4, and radiating area 1 is provided with above second groove 12 around heat radiation through hole 11 of a circle; Second groove 12 is around 11 sealings of heat radiation through hole or towards radiating area 1 either side hatch frame, second groove 12 is smooth curve groove or multistage straight-line groove; Be provided with first groove 21 identical in the chip region 21 with contained chip outline; Chip region 2 dual-sides are equipped with the above step edge 22 of one deck; Chip region 2 planes are lower than pin area 3 plane 1-1.5mm, and pin area 3 comprises left side pin 32, middle pin 31 and right side pin 33, and the left side pin links to each other through middle muscle 5 symmetrically with the right side pin and is positioned at the both sides of middle pin; The left side pin stretches out middle muscle and its terminal weld zone 34 that is connected with the top of right side pin; The below of left side pin and right side pin is connected in down on the muscle 6, and middle pin extends upward and connects described chip region 2, and following muscle 6 is provided with the manhole 9 of position in middle pin 31 correspondences; The pin area 3 of facing two frame units mutually connects through lower connecting plate 7, and following muscle 6 is provided with the gap 8 of lower connecting plate 7 correspondences.
What should explain at last is: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification has carried out detailed explanation to the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of the spirit and the scope of the utility model, and it all should be encompassed in the claim scope of the utility model.
Claims (10)
1. one kind high connectivity lead frame; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area; The radiating area of chip region top connecting band heat radiation through hole, the chip region below connects pin area, it is characterized in that: said radiating area is provided with above second groove around the heat radiation through hole of a circle.
2. a kind of high connectivity lead frame according to claim 1; It is characterized in that: said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its end is connected the weld zone, and the below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward and connects described chip region.
3. a kind of high connectivity lead frame according to claim 1 is characterized in that: be provided with first groove identical with contained chip outline in the said chip region.
4. a kind of high connectivity lead frame according to claim 1 is characterized in that: said chip region dual-side is equipped with the above step edge of one deck.
5. according to claim 1 or 3 or 4 described a kind of high connectivity lead frames, it is characterized in that: said chip region plane is lower than pin area plane 1-1.5mm.
6. a kind of high connectivity lead frame according to claim 1 is characterized in that: said several frame units radiating area separately connects through the last muscle more than.
7. a kind of high connectivity lead frame according to claim 2 is characterized in that: said muscle down is provided with the position in the corresponding manhole of middle pin.
8. a kind of high connectivity lead frame according to claim 1 is characterized in that: said second groove is around the sealing of heat radiation through hole or towards radiating area either side hatch frame, second groove is smooth curve groove or multistage straight-line groove.
9. a kind of high connectivity lead frame according to claim 1 and 2, it is characterized in that: said pin area of facing two frame units mutually connects through lower connecting plate.
10. a kind of high connectivity lead frame according to claim 9 is characterized in that: said muscle down is provided with the corresponding gap of lower connecting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152371 CN202633283U (en) | 2012-04-12 | 2012-04-12 | Lead wire framework with high connectivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152371 CN202633283U (en) | 2012-04-12 | 2012-04-12 | Lead wire framework with high connectivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633283U true CN202633283U (en) | 2012-12-26 |
Family
ID=47386441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220152371 Expired - Fee Related CN202633283U (en) | 2012-04-12 | 2012-04-12 | Lead wire framework with high connectivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633283U (en) |
-
2012
- 2012-04-12 CN CN 201220152371 patent/CN202633283U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Taizhou Yourun Electronic Co., Ltd. Assignor: Zhang Xuan Contract record no.: 2013320000563 Denomination of utility model: High connectivity lead frame Granted publication date: 20121226 License type: Exclusive License Record date: 20130619 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20150412 |
|
| EXPY | Termination of patent right or utility model |