CN102637670A - Novel lead frame - Google Patents
Novel lead frame Download PDFInfo
- Publication number
- CN102637670A CN102637670A CN 201210105888 CN201210105888A CN102637670A CN 102637670 A CN102637670 A CN 102637670A CN 201210105888 CN201210105888 CN 201210105888 CN 201210105888 A CN201210105888 A CN 201210105888A CN 102637670 A CN102637670 A CN 102637670A
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- CN
- China
- Prior art keywords
- pin
- area
- lead wire
- chip region
- novel lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a novel lead frame. The lead frame comprises a plurality of frame units horizontally arranged side by side, wherein each frame unit comprises a radiation area, a chip area and a pin area; the radiation area with a radiation through hole is connected above the chip area; the pin area is connected below the chip area; and a concentric circular truncated cone facing the front or back of the radiation area is arranged on the radiation through hole. The lead frame has the advantages of simple structure, strong adherence, good product quality and high safety performance and is convenient to use.
Description
Technical field
The present invention relates to a kind of semiconductor element, relate in particular to a kind of novel lead wire framework.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The lead frame chip region carries and is connected chip, and chip normally is bonded to chip region, chip region smooth surface; When bonding silver slurry dropped on the chip region, chip region and chip chamber were prone to residual air, behind the resin-encapsulated lead frame; Product work heating makes resin, air thermal expansion, because both thermal coefficient of expansions are different, thereby damages product; And the ganoid lead frame adherence of resin-encapsulated is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, the invention provides a kind of simple in structurely, easy to use, adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of novel lead wire framework; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area; The radiating area of chip region top connecting band heat radiation through hole, the chip region below connects pin area, and it is characterized in that: said heat radiation through hole is provided with the concentric round platform towards the radiating area front or the back side.
Further; Said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its end is connected the weld zone, and the below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward and connects described chip region.
Further, said chip region is provided with the above groove identical with contained chip outline of a circle.
Further, said chip region dual-side is equipped with the above step edge of one deck.
Further, said chip region plane is lower than pin area plane 1-1.5mm.
Further, said several frame units radiating area separately connects through the last muscle more than.
Further, said pin area of facing two frame units mutually connects through lower connecting plate.
Further, said muscle down is provided with the corresponding gap that faces center between two frame units mutually.
Further, said muscle down is provided with the position in the corresponding manhole of middle pin.
Adopt above technical characterictic, the invention has the beneficial effects as follows:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, the groove of chip region can strengthen the adherence of chip and chip region, improves serviceability;
3, the step edge of chip region dual-side cooperates the heat radiation through hole to be provided with the concentric round platform towards the radiating area front or the back side; When encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevent that encapsulation from coming off; Guarantee Stability Analysis of Structures, good product quality;
4, radiating area is provided with louvre and concentric round platform, increases the resin-encapsulated contact area, improves radiating efficiency, further increases the service life;
5, the gap that descends muscle to be provided with when the segmentation framework unit, is convenient to operation, and is time saving and energy saving, increases work efficiency, and guarantees installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is a structural representation of the present invention.
Accompanying drawing 2 is accompanying drawing 1 left cutaway views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, concentric round platform 12, chip region 2, groove 21, step edge 22, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, last muscle 4, middle muscle 5, following muscle 6, lower connecting plate 7, gap 8, through hole 9.
Embodiment
Below in conjunction with embodiment shown in the drawings technical scheme of the present invention is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of novel lead wire framework is provided with several frame units by a plurality of horizontal Tiles and forms; Each frame unit comprises radiating area 1, chip region 2 and pin area 3, the radiating area 1 of chip region 2 top connecting band heat radiation through holes 11, and chip region 2 belows connect pin area 3.Heat radiation through hole 11 is provided with the concentric round platform 12 towards radiating area 1 front or the back side, and several frame units radiating area 1 separately connects through the last muscle more than one 4; Chip region 2 is provided with the above groove 21 identical with contained chip outline of a circle, and chip region 2 dual-sides are equipped with the above step edge 22 of one deck, and chip region 2 planes are lower than pin area 3 plane 1-1.5mm; Pin area 3 comprises left side pin 32, middle pin 31 and right side pin 33; The left side pin links to each other through middle muscle 5 symmetrically with the right side pin and is positioned at the both sides of middle pin; The left side pin stretches out middle muscle and its terminal weld zone 34 that is connected with the top of right side pin; The below of left side pin and right side pin is connected in down on the muscle 6, and middle pin extends upward and connects described chip region; The pin area 3 of facing two frame units mutually connects through lower connecting plate 7, and following muscle 6 is provided with the corresponding gap 8 that faces center between two frame units mutually, and following muscle 6 is provided with the manhole 9 of position in middle pin 31 correspondences.
What should explain at last is: above embodiment only in order to the explanation the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification has carried out detailed explanation to the present invention with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the present invention; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the present invention, and it all should be encompassed in the claim scope of the present invention.
Claims (9)
1. novel lead wire framework; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area; The radiating area of chip region top connecting band heat radiation through hole, the chip region below connects pin area, and it is characterized in that: said heat radiation through hole is provided with the concentric round platform towards the radiating area front or the back side.
2. a kind of novel lead wire framework according to claim 1; It is characterized in that: said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its end is connected the weld zone, and the below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward and connects described chip region.
3. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region is provided with the above groove identical with contained chip outline of a circle.
4. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region dual-side is equipped with the above step edge of one deck.
5. according to claim 1 or 3 or 4 described a kind of novel lead wire frameworks, it is characterized in that: said chip region plane is lower than pin area plane 1-1.5mm.
6. a kind of novel lead wire framework according to claim 1 is characterized in that: said several frame units radiating area separately connects through the last muscle more than.
7. a kind of novel lead wire framework according to claim 1 and 2 is characterized in that: said pin area of facing two frame units mutually connects through lower connecting plate.
8. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with the corresponding gap that faces center between two frame units mutually.
9. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with the position in the corresponding manhole of middle pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105888 CN102637670A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105888 CN102637670A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102637670A true CN102637670A (en) | 2012-08-15 |
Family
ID=46622013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210105888 Pending CN102637670A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102637670A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943588A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame for super-power electrical appliance |
-
2012
- 2012-04-12 CN CN 201210105888 patent/CN102637670A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943588A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame for super-power electrical appliance |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120815 |