CN102637669A - Novel lead frame - Google Patents
Novel lead frame Download PDFInfo
- Publication number
- CN102637669A CN102637669A CN 201210105887 CN201210105887A CN102637669A CN 102637669 A CN102637669 A CN 102637669A CN 201210105887 CN201210105887 CN 201210105887 CN 201210105887 A CN201210105887 A CN 201210105887A CN 102637669 A CN102637669 A CN 102637669A
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- CN
- China
- Prior art keywords
- pin
- area
- lead wire
- chip region
- novel lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a novel lead frame. The lead frame comprises a plurality of frame units horizontally arranged side by side, wherein each frame unit comprises a radiation area, a chip area and a pin area; the radiation area is connected above the chip area; an electroplated metal layer is arranged on the surface of the chip area; the pin area is connected below the chip area and comprises a left pin, a middle pin and a right pin; the left and right pins are symmetric, are connected by a middle rib and are arranged on the two sides of the middle pin; the upper parts of the left and right pins extend out of the middle rib and the tail ends of the upper parts are connected with a welding area with an electroplated metal layer on the surface; the lower parts of the left and right pins are connected with a lower rib; and the middle pin extends upwards and is connected with the chip area by a connecting part with an electroplated metal layer on the surface. The lead frame has the advantages of simple structure, strong adherence, good product quality and high safety performance and is convenient to use.
Description
Technical field
The present invention relates to a kind of semiconductor element, relate in particular to a kind of novel lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The ganoid lead frame adherence of resin-encapsulated is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, the invention provides a kind of simple in structurely, easy to use, adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of novel lead wire framework; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area, and the chip region top connects radiating area, and the chip region surface is an electroplated metal layer; The chip region below connects pin area; It is characterized in that: said pin area comprises left side pin, middle pin and right side pin, and described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin, and described left side pin stretches out middle muscle with the top of right side pin and its terminal surface that is connected is the weld zone of electroplated metal layer; The below of left side pin and right side pin is connected in down on the muscle, and it is that the connecting portion of electroplated metal layer connects described chip region that described centre pin extends upward through the surface.
Further, said radiating area is provided with the heat radiation through hole more than.
Further, said heat radiation through hole is circular hole or rectangular opening or circular hole and the rectangular opening combination bore of overlapping.
Further, said several frame units by separately radiating area through the last muscle connection more than.
Further, the dual-side of said chip region is equipped with the boss more than.
Further, said chip region plane is lower than pin area plane 1-3mm.
Further, said pin area of facing mutually between frame unit connects through lower connecting plate.
Further, said connecting plate center is provided with through hole.
Further, said muscle down is provided with and faces the corresponding gap in two frame unit centers mutually.
Adopt above technical characterictic, the invention has the beneficial effects as follows:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, the chip region radiating area is provided with the overlap heat radiation through hole of combination bore shape of circular hole or rectangular opening or circular hole and rectangular opening, increases the resin-encapsulated contact area, improves radiating efficiency, further increases the service life;
3, the boss of chip region dual-side when encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevents that encapsulation from coming off, and guarantees Stability Analysis of Structures, improves the quality of products;
4, offer the gap of through hole and following muscle on the lower connecting plate of connection lead frame, when the segmentation framework unit, be convenient to operation, time saving and energy saving, increase work efficiency, guarantee installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is a structural representation of the present invention.
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, chip region 2, boss 21, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, last muscle 4, middle muscle 5, following muscle 6, lower connecting plate 7, gap 8, through hole 9.
Embodiment
Below in conjunction with embodiment shown in the drawings technical scheme of the present invention is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of novel lead wire framework is provided with several frame units by a plurality of horizontal Tiles to be formed, and each frame unit comprises radiating area 1, chip region 2 and pin area 3, and chip region 2 tops connect radiating area 1; Chip region 2 surfaces are electroplated metal layer, and chip region 2 belows connect pin area 3.Radiating area 1 is provided with the heat radiation through hole 11 more than, and heat radiation through hole 11 is circular hole or rectangular opening or circular hole and the rectangular opening combination bore of overlapping, several frame units by separately radiating area 1 through 4 connections of the last muscle more than; The dual-side of chip region 2 is equipped with the boss 21 more than, and chip region 2 planes are lower than pin area 3 plane 1-3mm; Pin area 3 comprises left side pin 32, middle pin 31 and right side pin 33; The left side pin links to each other through middle muscle 5 symmetrically with the right side pin and is positioned at the both sides of middle pin; The left side pin stretches out middle muscle with the top of right side pin and its terminal surface that is connected is the weld zone 34 of electroplated metal layer; The below of left side pin and right side pin is connected in down on the muscle 6, and it is that the connecting portion of electroplated metal layer connects described chip region 2 that middle pin extends upward through the surface, faces pin area 3 between frame unit mutually through lower connecting plate 7 connections; Connecting plate 7 centers are provided with through hole 9, and following muscle 6 is provided with the gap 8 corresponding with facing two frame unit centers mutually.
What should explain at last is: above embodiment only in order to the explanation the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification has carried out detailed explanation to the present invention with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the present invention; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the present invention, and it all should be encompassed in the claim scope of the present invention.
Claims (9)
1. novel lead wire framework; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area, and the chip region top connects radiating area, and the chip region surface is an electroplated metal layer; The chip region below connects pin area; It is characterized in that: said pin area comprises left side pin, middle pin and right side pin, and described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin, and described left side pin stretches out middle muscle with the top of right side pin and its terminal surface that is connected is the weld zone of electroplated metal layer; The below of left side pin and right side pin is connected in down on the muscle, and it is that the connecting portion of electroplated metal layer connects described chip region that described centre pin extends upward through the surface.
2. a kind of novel lead wire framework according to claim 1 is characterized in that: said radiating area is provided with the heat radiation through hole more than.
3. a kind of novel lead wire framework according to claim 2 is characterized in that: said heat radiation through hole is circular hole or rectangular opening or circular hole and the rectangular opening combination bore of overlapping.
4. a kind of novel lead wire framework according to claim 1 is characterized in that: said several frame units are connected through the last muscle more than by radiating area separately.
5. a kind of novel lead wire framework according to claim 1, it is characterized in that: the dual-side of said chip region is equipped with the boss more than.
6. according to claim 1 or 5 described a kind of novel lead wire frameworks, it is characterized in that: said chip region plane is lower than pin area plane 1-3mm.
7. a kind of novel lead wire framework according to claim 1 is characterized in that: said pin area of facing mutually between frame unit connects through lower connecting plate.
8. a kind of novel lead wire framework according to claim 7 is characterized in that: said connecting plate center is provided with through hole.
9. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with and faces the corresponding gap in two frame unit centers mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105887 CN102637669A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105887 CN102637669A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102637669A true CN102637669A (en) | 2012-08-15 |
Family
ID=46622012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210105887 Pending CN102637669A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102637669A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956600A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN103943594A (en) * | 2014-03-26 | 2014-07-23 | 张轩 | Lead framework suitable for high-power electric appliance |
-
2012
- 2012-04-12 CN CN 201210105887 patent/CN102637669A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956600A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN103943594A (en) * | 2014-03-26 | 2014-07-23 | 张轩 | Lead framework suitable for high-power electric appliance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120815 |