CN202633281U - Novel lead wire framework - Google Patents
Novel lead wire framework Download PDFInfo
- Publication number
- CN202633281U CN202633281U CN 201220152349 CN201220152349U CN202633281U CN 202633281 U CN202633281 U CN 202633281U CN 201220152349 CN201220152349 CN 201220152349 CN 201220152349 U CN201220152349 U CN 201220152349U CN 202633281 U CN202633281 U CN 202633281U
- Authority
- CN
- China
- Prior art keywords
- pin
- side pin
- chip region
- lead wire
- muscle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a novel lead wire framework, comprising a plurality of framework units horizontally arranged side by side. Each framework unit comprises a radiating zone, a chip zone and a pin zone; the upper side of the chip zone is in connection with the radiating zone which is provided with a radiating through hole; the lower side of the chip zone is in connection with the pin zone; the pin zone comprises a left side pin, an intermediate pin and a right side pin; the left side pin and the right side pin are mutual symmetrical and are connected on two sides of the intermediate pin through a middle bar; the upper sides of the left side pin and the right side pin extend out of the middle bar and the tail ends are in connection with a welding zone; the lower sides of the left side pin and the right side pin are in connection with a lower bar; the intermediate pin extends upwards to be in connection with the chip zone; left and right connecting plates are respectively symmetrically arranged between the left side pin and the intermediate pin, and the right side pin and the intermediate pin; upper and lower ends of the left and right connecting plates are respectively in connection with the middle bar and the lower bar. The novel lead wire framework has the characteristics of a simple structure, convenient use, strong adherence, good product quality and high safety performance.
Description
Technical field
The utility model relates to a kind of semiconductor element, relates in particular to a kind of novel lead wire framework.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The lead frame chip region carries and is connected chip, and chip normally is bonded to chip region, chip region smooth surface; When bonding silver slurry dropped on the chip region, chip region and chip chamber were prone to residual air, behind the resin-encapsulated lead frame; Product work heating makes resin, air thermal expansion, because both thermal coefficient of expansions are different, thereby damages product; And the ganoid lead frame adherence of resin-encapsulated is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, it is a kind of simple in structure, firm, easy to use that the utility model provides, and adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of novel lead wire framework; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area; The radiating area of chip region top connecting band heat radiation through hole, the chip region below connects pin area, and said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its end is connected the weld zone, and the below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward and connects described chip region; It is characterized in that: between said left side pin and the middle pin, be arranged with left and right connecting plate respectively between right side pin and the middle pin, during the upper and lower end of left and right connecting plate is connected on muscle and the following muscle.
Further, said chip region is provided with the above groove identical with contained chip outline of a circle.
Further, said chip region dual-side is equipped with the above step edge of one deck.
Further, said chip region plane is lower than pin area plane 1-2.5mm.
Further, said several frame units radiating area separately connects through the last muscle more than.
Further, said muscle down is provided with and faces the corresponding gap in center between two frame units mutually.
Further, said step edge and chip region side are not parallel.
Adopt above technical characterictic, the beneficial effect of the utility model is:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality; The groove of chip region can strengthen the adherence of chip and chip region, improves serviceability;
2, the step edge of chip region dual-side when encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevents that encapsulation from coming off, and guarantees Stability Analysis of Structures, good product quality;
3, radiating area is provided with louvre, increases the resin-encapsulated contact area, improves radiating efficiency, further increases the service life;
4, be connected in pin area by left and right connecting plate between middle muscle and following muscle, need not the cutting connecting plate, be provided with the corresponding gap segmentation framework unit that faces center between frame unit mutually along muscle down; Be convenient to operation; Time saving and energy saving, increase work efficiency, guarantee installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model.
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, chip region 2, groove 21, step edge 22, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, left connecting plate 35, right connecting plate 36, last muscle 4, middle muscle 5, following muscle 6, gap 7.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical scheme of the utility model is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of novel lead wire framework is provided with several frame units by a plurality of horizontal Tiles and forms; Each frame unit comprises radiating area 1, chip region 2 and pin area 3, the radiating area 1 of chip region 2 top connecting band heat radiation through holes 11, and chip region 2 belows connect pin area 3.Several frame units radiating area 1 separately connects through the last muscle more than one 4; Chip region 2 is provided with the above groove 21 identical with contained chip outline of a circle, chip region 2 dual-sides be equipped with more than one deck with the uneven step edge 22 of chip region side, chip region 2 planes are lower than pin area 3 plane 1-2.5mm; Pin area 3 comprises left side pin 32, middle pin 31, right side pin 33, left connecting plate 35 and right connecting plate 36; The left side pin links to each other through middle muscle 5 symmetrically with the right side pin and is positioned at the both sides of middle pin; The left side pin stretches out middle muscle and its terminal weld zone 34 that is connected with the top of right side pin; The below of left side pin and right side pin is connected in down on the muscle 6; Middle pin 31 extends upward and connects described chip region 2, between left side pin and the middle pin, be arranged with left and right connecting plate 35,36 respectively between right side pin and the middle pin, during the upper and lower end of left and right connecting plate is connected on muscle and the following muscle; Following muscle 6 is provided with and faces the corresponding gap 7 in center between two frame units mutually.
What should explain at last is: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification has carried out detailed explanation to the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of the spirit and the scope of the utility model, and it all should be encompassed in the claim scope of the utility model.
Claims (7)
1. novel lead wire framework; By a plurality of horizontal Tiles several frame units being set forms; Frame unit comprises radiating area, chip region and pin area; The radiating area of chip region top connecting band heat radiation through hole, the chip region below connects pin area, and said pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other through middle muscle symmetrically with the right side pin and is positioned at the both sides of middle pin; Described left side pin stretches out middle muscle with the top of right side pin and its end is connected the weld zone, and the below of left side pin and right side pin is connected in down on the muscle, and described middle pin extends upward and connects described chip region; It is characterized in that: between said left side pin and the middle pin, be arranged with left and right connecting plate respectively between right side pin and the middle pin, during the upper and lower end of left and right connecting plate is connected on muscle and the following muscle.
2. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region is provided with the above groove identical with contained chip outline of a circle.
3. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region dual-side is equipped with the above step edge of one deck.
4. according to claim 1 or 2 or 3 described a kind of novel lead wire frameworks, it is characterized in that: said chip region plane is lower than pin area plane 1-2.5mm.
5. a kind of novel lead wire framework according to claim 1 is characterized in that: said several frame units radiating area separately connects through the last muscle more than.
6. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with and faces the corresponding gap in center between two frame units mutually.
7. a kind of novel lead wire framework according to claim 3 is characterized in that: said step edge and chip region side are not parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152349 CN202633281U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220152349 CN202633281U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633281U true CN202633281U (en) | 2012-12-26 |
Family
ID=47386439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220152349 Expired - Fee Related CN202633281U (en) | 2012-04-12 | 2012-04-12 | Novel lead wire framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633281U (en) |
-
2012
- 2012-04-12 CN CN 201220152349 patent/CN202633281U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102637664A (en) | Novel lead frame | |
| CN102637665A (en) | Lead frame with grooves in chip areas | |
| CN102044517B (en) | Production method of super-high-power IC chip package | |
| CN202633276U (en) | Chip zone lead wire framework with grooves | |
| CN201017876Y (en) | Waterproof type plastic capsulation series lead wire frame | |
| CN202633277U (en) | Novel lead wire framework | |
| CN102637668A (en) | Novel lead frame | |
| CN202633279U (en) | Novel lead wire framework | |
| CN202633274U (en) | Novel lead wire framework | |
| CN202633281U (en) | Novel lead wire framework | |
| CN102637669A (en) | Novel lead frame | |
| CN102637671A (en) | Novel lead frame | |
| CN203165882U (en) | Stacked package structure | |
| CN202633275U (en) | Novel lead wire framework | |
| CN202633282U (en) | Novel lead wire framework | |
| CN102637663A (en) | Novel lead frame | |
| CN102637670A (en) | Novel lead frame | |
| CN202633283U (en) | Lead wire framework with high connectivity | |
| CN202633284U (en) | Novel lead wire framework | |
| CN202633278U (en) | Novel lead wire framework | |
| CN102637673A (en) | Novel lead frame | |
| CN202633280U (en) | Novel lead wire framework | |
| CN102637666A (en) | Novel lead frame | |
| CN102637672A (en) | High connectivity lead frame | |
| CN203085518U (en) | A leading wire frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Taizhou Yourun Electronic Co., Ltd. Assignor: Zhang Xuan Contract record no.: 2013320000563 Denomination of utility model: Novel lead frame Granted publication date: 20121226 License type: Exclusive License Record date: 20130619 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20150412 |
|
| EXPY | Termination of patent right or utility model |