CN102956600A - Lead frame structure - Google Patents
Lead frame structure Download PDFInfo
- Publication number
- CN102956600A CN102956600A CN2012104713371A CN201210471337A CN102956600A CN 102956600 A CN102956600 A CN 102956600A CN 2012104713371 A CN2012104713371 A CN 2012104713371A CN 201210471337 A CN201210471337 A CN 201210471337A CN 102956600 A CN102956600 A CN 102956600A
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- CN
- China
- Prior art keywords
- lead frame
- middle pin
- frame structure
- casting groove
- bonding region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a lead frame structure. The upper part of a middle pin is additionally provided with a bonding area structure, a frame bottom plate between the middle pin and the bonding area structure is provided with a casting groove, solder is cast into the casting groove, and the middle pin is conducted with the bonding area structure. The lead frame structure provided by the invention has the advantages that the casting groove is additionally arranged, so the middle pin can be conducted with the bonding area structure; and the solder in the casting groove difficultly oxides and ages, so the stability is high.
Description
Technical field
The present invention relates to the semi-conductor discrete device sealed in unit, particularly a kind of lead frame structure.
Background technology
Lead frame structure at first to file 201120002305-middle pin, a kind of lead frame structure by going between at middle pin and connecting is disclosed, owing to adopt the mode of lead-in wire to exist the problem of steadiness, particularly after using after a while, the welding position of lead-in wire is loosening, damage or aging easily, causes semiconductor to work.
Summary of the invention
In order to solve the lead frame structure of prior art, the welding position of lead-in wire is loosening, damage or aging easily, and the problem that causes semiconductor to work the invention provides a kind of lead frame structure.
Purpose of the present invention is come specific implementation by the following technical programs:
A kind of lead frame structure increases the bonding region domain structure on middle pin top, has the casting groove on the chassis base between middle pin and the bonding region domain structure, pours into a mould scolding tin in described casting groove, makes conducting between middle pin and the bonding region domain structure.
Lead frame structure provided by the invention, the casting groove of increase can be realized conducting between middle pin and the bonding region domain structure, and because the scolding tin in the casting groove is not easy oxidation and aging, steadiness is good.
Description of drawings
The below is described in further detail the present invention with embodiment with reference to the accompanying drawings.
Fig. 1 is the structure chart of the described lead frame structure of the embodiment of the invention.
Embodiment
As shown in Figure 1, the described a kind of lead frame structure of the embodiment of the invention, increase bonding region domain structure 11 on middle pin top, have casting groove 111 on the chassis base 1 between middle pin and the bonding region domain structure, in described casting groove 111, pour into a mould scolding tin, make conducting between middle pin and the bonding region domain structure 11.
Lead frame structure provided by the invention, the casting groove of increase can be realized conducting between middle pin and the bonding region domain structure, and because the scolding tin in the casting groove is not easy oxidation and aging, steadiness is good.
Claims (1)
1. lead frame structure, it is characterized in that, increase the bonding region domain structure on middle pin top, have the casting groove on the chassis base between middle pin and the bonding region domain structure, in described casting groove, pour into a mould scolding tin, make conducting between middle pin and the bonding region domain structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104713371A CN102956600A (en) | 2012-11-20 | 2012-11-20 | Lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104713371A CN102956600A (en) | 2012-11-20 | 2012-11-20 | Lead frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102956600A true CN102956600A (en) | 2013-03-06 |
Family
ID=47765207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104713371A Pending CN102956600A (en) | 2012-11-20 | 2012-11-20 | Lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102956600A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060196412A1 (en) * | 2005-03-03 | 2006-09-07 | Atmel Germany Gmbh | Method and casting mold for producing an optical semiconductor module |
| JP2008028154A (en) * | 2006-07-21 | 2008-02-07 | Sumitomo Metal Mining Package Materials Co Ltd | Lead frame for optical semiconductor device |
| CN102064151A (en) * | 2010-11-08 | 2011-05-18 | 宁波康强电子股份有限公司 | Lead frame for manufacturing discrete semiconductor and manufacturing method thereof |
| CN201956341U (en) * | 2011-01-06 | 2011-08-31 | 无锡市玉祁红光电子有限公司 | Lead framework structure of middle pin |
| CN102637669A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
-
2012
- 2012-11-20 CN CN2012104713371A patent/CN102956600A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060196412A1 (en) * | 2005-03-03 | 2006-09-07 | Atmel Germany Gmbh | Method and casting mold for producing an optical semiconductor module |
| JP2008028154A (en) * | 2006-07-21 | 2008-02-07 | Sumitomo Metal Mining Package Materials Co Ltd | Lead frame for optical semiconductor device |
| CN102064151A (en) * | 2010-11-08 | 2011-05-18 | 宁波康强电子股份有限公司 | Lead frame for manufacturing discrete semiconductor and manufacturing method thereof |
| CN201956341U (en) * | 2011-01-06 | 2011-08-31 | 无锡市玉祁红光电子有限公司 | Lead framework structure of middle pin |
| CN102637669A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130306 |
|
| RJ01 | Rejection of invention patent application after publication |