CN202905698U - Square bump rectifier bridge connecting piece - Google Patents
Square bump rectifier bridge connecting piece Download PDFInfo
- Publication number
- CN202905698U CN202905698U CN2012205974213U CN201220597421U CN202905698U CN 202905698 U CN202905698 U CN 202905698U CN 2012205974213 U CN2012205974213 U CN 2012205974213U CN 201220597421 U CN201220597421 U CN 201220597421U CN 202905698 U CN202905698 U CN 202905698U
- Authority
- CN
- China
- Prior art keywords
- square
- chip
- connecting piece
- rectifier bridge
- brace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
The utility model relates to a square bump rectifier bridge connecting piece, which comprises a chip, a frame and a connecting piece, wherein the frame and the chip are of a square structure, the chip is welded on the lower half part of the square structure of the frame, the connecting piece is of a step-like structure and divided into a lower plane and an upper plane, the front half part of one side, which is away from the upper plane, of the lower plane is provided with a bump, the bump is of a square shape, and the connecting piece is welded with the chip through the bump. According to the utility model, improvement on the structure of the rectifier bridge reduces deviation of crystal grains, increases the reliability, and prolongs the service life of products.
Description
Technical field
The utility model relates to a kind of square salient point rectifier bridge brace.
Background technology
Easily cause failure welding during existing structure welding, easily form the crystal grain off normal; Chip damages electrical yield and descends.Affect product reliability, product ability in useful life descends.
The utility model content
Technical problem to be solved in the utility model provides a kind of square salient point rectifier bridge brace, and this novel improvement to the rectifier bridge structure reduces the crystal grain off normal, strengthens product reliability and useful life.
The technical scheme that the utility model solves the problems of the technologies described above is as follows: a kind of square salient point rectifier bridge brace, comprise chip, framework and brace, described framework and chip are square structure, described chips welding is in the latter half of framework square structure, described brace is step structure, and described brace is divided into lower plane and upper plane, and described lower plane is provided with salient point away from the first half of a side on upper plane, described salient point is square, and described brace is by salient point and described chips welding.
The beneficial effects of the utility model are: the salient point of this Novel connection contact pin is square configuration, easily cooperates with crystal grain is square when welding, corrects the position, can not weigh the ambetti limit wounded, reduce the failure welding rate, promote yield, can improve reliability and the usability of product.
Description of drawings
Fig. 1 is the structural representation of the utility model brace;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is the structural representation of the square salient point rectifier bridge of the utility model brace;
In the accompanying drawing, the list of parts of each label representative is as follows:
1, framework, 2, chip, 3, brace, 3-1, lower plane, 3-2, upper plane, 4, salient point.
Embodiment
Below in conjunction with accompanying drawing principle of the present utility model and feature are described, institute gives an actual example and only is used for explaining the utility model, is not be used to limiting scope of the present utility model.
As described in Fig. 1～3, a kind of square salient point rectifier bridge brace, comprise chip 2, framework 1 and brace 3, described framework 1 is square structure with chip 2, and described chip 2 is welded on the latter half of framework 1 square structure, and described brace 3 is step structure, described brace 3 is divided into lower plane 3-1 and upper plane 3-2, described lower plane 3-1 is provided with salient point 4 away from the first half of the side of upper plane 3-2, and described salient point 4 is square, and described brace 3 is by salient point 4 and described chip 2 welding.
The above only is preferred embodiment of the present utility model, and is in order to limit the utility model, not all within spirit of the present utility model and principle, any modification of doing, is equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (1)
1. square salient point rectifier bridge brace, it is characterized in that, comprise chip (2), framework (1) and brace (3), described framework (1) is square structure with chip (2), described chip (2) is welded on the latter half of framework (1) square structure, described brace (3) is step structure, described brace (3) is divided into lower plane (3-1) and upper plane (3-2), described lower plane (3-1) is provided with salient point (4) away from the first half of a side of upper plane (3-2), described salient point (4) is square, and described brace (3) is by salient point (4) and described chip (2) welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205974213U CN202905698U (en) | 2012-11-14 | 2012-11-14 | Square bump rectifier bridge connecting piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205974213U CN202905698U (en) | 2012-11-14 | 2012-11-14 | Square bump rectifier bridge connecting piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202905698U true CN202905698U (en) | 2013-04-24 |
Family
ID=48126330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205974213U Expired - Lifetime CN202905698U (en) | 2012-11-14 | 2012-11-14 | Square bump rectifier bridge connecting piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202905698U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3584829A4 (en) * | 2017-02-20 | 2021-03-10 | Shindengen Electric Manufacturing Co., Ltd. | Electronic device |
-
2012
- 2012-11-14 CN CN2012205974213U patent/CN202905698U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3584829A4 (en) * | 2017-02-20 | 2021-03-10 | Shindengen Electric Manufacturing Co., Ltd. | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130424 |
|
| CX01 | Expiry of patent term |