CN206441721U - A kind of pre-packaged frame structure - Google Patents
A kind of pre-packaged frame structure Download PDFInfo
- Publication number
- CN206441721U CN206441721U CN201621428679.5U CN201621428679U CN206441721U CN 206441721 U CN206441721 U CN 206441721U CN 201621428679 U CN201621428679 U CN 201621428679U CN 206441721 U CN206441721 U CN 206441721U
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- China
- Prior art keywords
- pin
- metal framework
- packaged
- frame structure
- silver paste
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Die Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model is related to a kind of pre-packaged frame structure, and it includes metal framework（1）, the metal framework（1）It is pre-packaged to have insulating materials（2）, the insulating materials（2）Upper and lower surface respectively with metal framework（1）Upper and lower surface flush, the metal framework（1）Including multipair pin（1.1）, at least one pair of pin（1.1）On be provided with becket（3）, the becket（3）Inside it is provided with load glue or silver paste（4）, the load glue or silver paste（4）By electronic device（5）It is mounted on pin（1.1）On.A kind of pre-packaged frame structure of the utility model, it can suppress silver paste occurs in the situation of framework surface flow, diffusion, eliminates the short-circuit risk being likely to occur between pin, increases the reliability of product.
Description
Technical field
The utility model is related to a kind of pre-packaged frame structure, belongs to technical field of semiconductor encapsulation.
Background technology
For the pre-packaged Electronic Packaging product of framework, it is necessary to which when filling electronic device on pin, common practices is straight
It is connected on corresponding position brush coating load on pin.Due to pre-packaged frame structure, framework pin surface is flushed with pre-packaged material,
When causing brush coating load, silver paste is spread in frame pin surface flow, and the risk of short circuit is likely to occur between pin, causes production
Product fail.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of pre-packaged frame structure for above-mentioned prior art,
It can suppress silver paste in framework surface flow, and the situation of diffusion occurs, and eliminates the short-circuit risk being likely to occur between pin,
Increase the reliability of product.
The technical scheme in the invention for solving the above technical problem is：A kind of pre-packaged frame structure, it includes gold
Belong to framework, the metal framework is pre-packaged insulating materials, and the upper and lower surface of the insulating materials is upper with metal framework respectively
Lower surface is flushed, and the metal framework, which includes being provided with becket, the becket on multipair pin, at least one pair of pin, to be set
Load glue or silver paste are equipped with, component is mounted on pin by the load glue or silver paste.
Compared with prior art, the utility model has the advantage of：
A kind of pre-packaged frame structure of the utility model, it forms the becket of projection on pre-packaged framework pin, can
So that the silver paste for mounting component is limited in becket, so as to reduce or eliminate random flowing of the silver paste on framework surface, subtract
Less or short-circuit risks between pin are eliminated, so as to increase the yield of product, improve product reliability.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of pre-packaged frame structure of the utility model.
Fig. 2 is Fig. 1 top view.
Wherein：
Metal framework 1
Pin 1.1
Insulating materials 2
Becket 3
Load glue or silver paste 4
Electronic device 5.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing embodiment.
As shown in Figure 1 and Figure 2, a kind of pre-packaged frame structure in the present embodiment, it includes metal framework 1, the metal
Framework 1 is pre-packaged an insulating materials 2, and the upper and lower surface of the upper and lower surface of the insulating materials 2 respectively with metal framework 1 is flushed,
The metal framework 1, which includes being provided with multipair pin 1.1, at least one pair of pin 1.1 in becket 3, the becket 3, to be set
There are load glue or silver paste 4, electronic device 5 is mounted on pin 1.1 by the load glue or silver paste 4.
In addition to the implementation, the utility model also includes other embodiment, all use equivalents or equivalent
The technical scheme of substitute mode formation, all should fall within the utility model scope of the claims.
Claims (1)
1. a kind of pre-packaged frame structure, it is characterised in that：It includes metal framework（1）, the metal framework（1）It is pre-packaged to have
Insulating materials（2）, the insulating materials（2）Upper and lower surface respectively with metal framework（1）Upper and lower surface flush, the metal
Framework（1）Including multipair pin（1.1）, at least one pair of pin（1.1）On be provided with becket（3）, the becket（3）Inside set
It is equipped with load glue or silver paste（4）, the load glue or silver paste（4）By electronic device（5）It is mounted on pin（1.1）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621428679.5U CN206441721U (en) | 2016-12-24 | 2016-12-24 | A kind of pre-packaged frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621428679.5U CN206441721U (en) | 2016-12-24 | 2016-12-24 | A kind of pre-packaged frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206441721U true CN206441721U (en) | 2017-08-25 |
Family
ID=59647028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621428679.5U Active CN206441721U (en) | 2016-12-24 | 2016-12-24 | A kind of pre-packaged frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206441721U (en) |
-
2016
- 2016-12-24 CN CN201621428679.5U patent/CN206441721U/en active Active
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| GR01 | Patent grant |