CN102637667A - Novel lead frame - Google Patents
Novel lead frame Download PDFInfo
- Publication number
- CN102637667A CN102637667A CN 201210105875 CN201210105875A CN102637667A CN 102637667 A CN102637667 A CN 102637667A CN 201210105875 CN201210105875 CN 201210105875 CN 201210105875 A CN201210105875 A CN 201210105875A CN 102637667 A CN102637667 A CN 102637667A
- Authority
- CN
- China
- Prior art keywords
- pin
- muscle
- lead wire
- novel lead
- chip region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a novel lead frame. The lead frame is formed by connecting a plurality of frame units which are horizontally arranged side by side by a middle rib and a lower rib in series, wherein each frame unit comprises a radiation area, a chip area, a middle pin and left and right pins respectively arranged on the two sides of the middle pin; the radiation area is connected above the chip area; a radiation through hole is arranged on the radiation area; the upper end of the middle pin is connected below the chip area; the lower ends of the middle, left and right pins are connected on the lower rib; the middle parts of the middle, left and right pins are connected in series by the middle rib; and more than one layer of step edge is arranged on the top edge of the radiation area. The lead frame has simple structure, strong adherence, good product quality and high safety performance and is convenient to use.
Description
Technical field
The present invention relates to a kind of semiconductor element, relate in particular to a kind of novel lead wire framework.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop; It has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority, and lead frame is a basic material important in the electronics and information industry.Lead frame need utilize resin plastic-sealed chip to be fixed into holistic half guiding element at its chip region surface mount chip again.Traditional die portion is a planar structure, adopts the strip plating mode, stays the little solder joint of out-of-flatness protrusion easily, can produce friction between when lead frame is stacked together, and causes the chip section plating area to produce and scratches, and influences product quality; The lead frame chip region carries and is connected chip, and chip normally is bonded to chip region, chip region smooth surface; When bonding silver slurry dropped on the chip region, chip region and chip chamber were prone to residual air, behind the resin-encapsulated lead frame; Product work heating makes resin, air thermal expansion, because both thermal coefficient of expansions are different, thereby damages product; And the ganoid lead frame adherence of resin-encapsulated is not strong, and obscission is peeled off in easy generation, normal, the safe handling of influence; When single frame unit cutting, integrally-built connecting plate excision operating difficulties, waste time and energy, be prone to cause lead frame damage and distortion simultaneously, can't use.
Summary of the invention
In order to address the above problem, the invention provides a kind of simple in structurely, easy to use, adherence is strong, good product quality, the lead frame of the chip area band groove that security performance is high.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle; Frame unit comprises radiating area, chip region, middle pin and lays respectively at left side, the right side pin of middle pin both sides, chip region top connection radiating area, and radiating area is provided with the heat radiation through hole; Pin upper end in the middle of the chip region below connects; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle, and middle pin middle part and left side, right side pin middle part are by middle muscle serial connection, and it is characterized in that: said radiating area top margin is provided with the above step edge of one deck.
Further, the step edge zero lap that said heat radiation through hole and one deck are above, the heat radiation through hole overlaps with the above step edge of one deck, or the step edge more than heat radiation through hole and one deck is overlapping fully.
Further, said left side pin and muscle and its terminal weld zone that is connected during stretch out the top of right side pin.
Further, said chip region is provided with the above groove identical with contained chip outline of a circle.
Further, said chip region plane is lower than pin area plane 1-3mm.
Further, said heat radiation through hole is circle or waist shape or ellipse.
Further, said step edge is towards the radiating area front or the back side.
Further, said muscle down is provided with the manhole of the middle pin of corresponding each frame unit pin area.
Further, said following muscle top or the bottom that faces mutually between frame unit is provided with gap.
Further, said muscle down is provided with the impression perpendicular to upper and lower muscle corresponding with the gap position.
Adopt above technical characterictic, the invention has the beneficial effects as follows:
1, chip region is lower than pin area, in the time of can guaranteeing to stack lead frame, reduces friction between layer and the layer, and chip region can not produce scuffing, advances to go on foot and improves product quality;
2, the groove of chip region can strengthen the adherence of chip and chip region, improves serviceability;
3, the top side at the radiating area front or the back side or both sides are provided with step edge, when encapsulating lead, can strengthen the adherence between encapsulating material and lead frame, prevent that encapsulation from coming off, and guarantees Stability Analysis of Structures, good product quality;
4, radiating area is provided with circle or waist shape or oval-shaped heat radiation through hole, increases the resin-encapsulated contact area, improves radiating efficiency, further increases the service life;
5, the gap and the impression of following muscle when the segmentation framework unit, are convenient to operation, and be time saving and energy saving, increases work efficiency, and guarantees installation quality simultaneously.
Description of drawings
Accompanying drawing 1 is a structural representation of the present invention.
Accompanying drawing 2 is accompanying drawing 1 left views.
In the accompanying drawing: radiating area 1, heat radiation through hole 11, step edge 12, chip region 2, groove 21, pin area 3, middle pin 31, left side pin 32, right side pin 33, weld zone 34, middle muscle 4, following muscle 5, through hole 6, gap 7, impression 8.
Embodiment
Below in conjunction with embodiment shown in the drawings technical scheme of the present invention is done following detailed description the in detail:
Fig. 1, shown in 2; A kind of novel lead wire framework by a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle; Each frame unit comprises radiating area 1, chip region 2, middle pin 31 and lays respectively at left side, the right side pin 32,33 of middle pin both sides, connection heat radiation 1 district, chip region 2 tops, and radiating area 1 is provided with heat radiation through hole 11; Heat radiation through hole 11 is circle or waist shape or ellipse; Radiating area 11 top margins or any side are provided with the above step edge 12 of one deck, and step edge 12 is towards radiating area 1 front or the back side, and through hole 11 and above step edge 12 zero laps of one deck dispel the heat; Or heat radiation through hole 11 overlaps with the above step edge 12 of one deck, or the above step edge 12 of heat radiation through hole 11 and one deck is overlapping fully; Chip region 2 is provided with the above groove 21 identical with contained chip outline of a circle; Chip region 21 planes are lower than pin area 3 plane 1-3mm; Pin 31 upper ends in the middle of chip region 2 belows connect; Middle pin 31 lower ends and left side, right side pin 32,33 lower ends all are connected in down on the muscle 5; By middle muscle 4 serial connections, the left side pin stretches out middle muscle 4 and its terminal weld zone 34 that is connected with the top of right side pin in the middle part of middle pin middle part and left side, the right side pin, and following muscle 5 is provided with the manhole 6 of the middle pin 31 of corresponding each frame unit pin area; Following muscle 5 tops or the bottom that face mutually between frame unit are provided with gap 7, and following muscle 5 is provided with the impression 8 perpendicular to upper and lower muscle corresponding with gap 7 positions.
What should explain at last is: above embodiment only in order to the explanation the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification has carried out detailed explanation to the present invention with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the present invention; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the present invention, and it all should be encompassed in the claim scope of the present invention.
Claims (10)
1. novel lead wire framework; By a plurality of horizontal Tiles be provided with several frame units through in muscle compose in series with following muscle; Frame unit comprises radiating area, chip region, middle pin and lays respectively at left side, the right side pin of middle pin both sides, chip region top connection radiating area, and radiating area is provided with the heat radiation through hole; Pin upper end in the middle of the chip region below connects; Middle pin lower end and left side, pin lower end, right side all are connected in down on the muscle, and middle pin middle part and left side, right side pin middle part are by middle muscle serial connection, and it is characterized in that: said radiating area top margin is provided with the above step edge of one deck.
2. a kind of novel lead wire framework according to claim 1; It is characterized in that: the step edge zero lap that said heat radiation through hole and one deck are above; Or the above step edge of heat radiation through hole and one deck overlaps, or the step edge more than heat radiation through hole and one deck is overlapping fully.
3. a kind of lead frame according to claim 1 is characterized in that: said left side pin stretches out middle muscle and its terminal weld zone that is connected with the top of right side pin.
4. a kind of novel lead wire framework according to claim 1 is characterized in that: said chip region is provided with the above groove identical with contained chip outline of a circle.
5. according to claim 1 or 4 described a kind of lead frames, it is characterized in that: said chip region plane is lower than pin area plane 1-3mm.
6. a kind of novel lead wire framework according to claim 1 and 2 is characterized in that: said heat radiation through hole is circle or waist shape or ellipse.
7. a kind of novel lead wire framework according to claim 1, it is characterized in that: said step edge is towards the radiating area front or the back side.
8. a kind of novel lead wire framework according to claim 1 is characterized in that: said muscle down is provided with the manhole of the middle pin of corresponding each frame unit pin area.
9. according to claim 1 or 8 described a kind of novel lead wire frameworks, it is characterized in that: said following muscle top or the bottom that faces mutually between frame unit is provided with gap.
10. a kind of novel lead wire framework according to claim 9 is characterized in that: said muscle down is provided with the impression perpendicular to upper and lower muscle corresponding with the gap position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105875 CN102637667A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210105875 CN102637667A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102637667A true CN102637667A (en) | 2012-08-15 |
Family
ID=46622010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210105875 Pending CN102637667A (en) | 2012-04-12 | 2012-04-12 | Novel lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102637667A (en) |
-
2012
- 2012-04-12 CN CN 201210105875 patent/CN102637667A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120815 |