CN209029372U - One kind being used for high-power multi-die packages structure - Google Patents
One kind being used for high-power multi-die packages structure Download PDFInfo
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- CN209029372U CN209029372U CN201822149291.7U CN201822149291U CN209029372U CN 209029372 U CN209029372 U CN 209029372U CN 201822149291 U CN201822149291 U CN 201822149291U CN 209029372 U CN209029372 U CN 209029372U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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Abstract
The utility model belongs to power module technical field, in order to solve the problems, such as that power module maintenance cost is high, it provides a kind of for high-power multi-die packages structure, including substrate, lead frame and plastic shell, the lower surface of substrate is covered with metal conductor plate, the upper surface of substrate, which is covered with, to be spaced apart the first of setting and covers metal conductor plate and second and cover metal conductor plate, first covers metal conductor plate equipped at least one first chip and at least one second chip, and the first chip covers metal conductor plate by wire electrical connection second；Lead frame is located at the top of substrate and the circumferentially extending along substrate, and plastic shell wraps up substrate and lead frame, and the first power terminal, the second power terminal, the first signal terminal and second signal terminal extend plastic shell.The utility model is that the assembly of high-power multi-die packages provides convenience, the maintenance cost advantageously reduced, and can be with the functional reliability of hoisting power module.
Description
Technical field
The utility model belongs to power module technical field, and in particular to one kind is used for high-power multi-die packages structure.
Background technique
In the prior art, for the demand of power module high-voltage large current, it is necessary to it is just able to achieve by the way that multi-chip is in parallel,
In multi-chip parallel connection, the failure of a chips will lead to scrapping for entire module, and the cost of waste is huge, and controller is electricity
One of the core component of dynamic system, power module is the core component of controller, due to the power module electricity of different system requirements
Power modules different with electric current, to encapsulate using plastic packaging is pressed, by the high-power multi-die packages structure mould for combining different number
Block can realize required voltage and current quota easily.
Utility model content
The utility model is high in order to solve the problems, such as power module maintenance cost, provides a kind of for high-power Multi-core
Encapsulating structure.
The technical solution adopted in the utility model is as follows:
One kind is used for high-power multi-die packages structure, including substrate, lead frame and plastic shell, under the substrate
Surface, which is covered with down, covers metal conductor plate, the upper surface of the substrate be covered be spaced apart setting first cover metal conductor plate and
Second covers metal conductor plate, and described first covers metal conductor plate equipped at least one first chip and at least one second core
Piece, first chip are electrically connected described second by wire and cover metal conductor plate；The lead frame is located at the substrate
Top and along the circumferentially extending of the substrate, the lead frame is equipped with that metal conductor plate is covered in electrical connection described first
The first signal terminal of metal conductor plate is covered in one power terminal and electrical connection described second, is additionally provided with interval on the lead frame
The second power terminal and second signal terminal of arrangement are opened, second power terminal and the second signal terminal are electrically connected
First chip and second chip；The plastic shell wraps up the substrate and the lead frame, and described first
Power terminal, second power terminal, first signal terminal and the second signal terminal extend outside the plastic packaging
Shell.
One embodiment according to the present utility model, the upper surface shape of at least one of at least one described first chip
At having the first signaling zone, second signal area and the third signaling zone that are spaced apart setting, first signaling zone is located at described second
Between signaling zone and the third signaling zone, and first signaling zone covers metal by wire electrical connection described second
Conductor plate.
One embodiment according to the present utility model, the substrate be insulating layer add single side cover metallic conductor laminar substrate, absolutely
Edge layer adds any one two-sided covered in metallic conductor laminar substrate or metallic conductor substrate.
One embodiment according to the present utility model, the second signal terminal and second power terminal pass through connection
Piece connects first chip and second chip, the lower surface of the connection sheet bend downward to form four points of connection, and four
A tie point is respectively the first tie point, the second tie point, third tie point and the 4th tie point, first tie point
The second signal area is connected, second tie point connects the third signaling zone, the third tie point and the described 4th
Tie point connects the upper surface of second chip.
One embodiment according to the present utility model, first tie point and second tie point are welded to connect in institute
It states in the second signal area and third signaling zone of the first chip, the third tie point and the 4th tie point are welded to connect
On the upper surface of second chip.
One embodiment according to the present utility model, the second signal terminal and second power terminal (12) and institute
It states between the first chip and second chip by aluminium wire bonding, copper wire bonding, aluminium strip welding or copper strips welding manner
Any one.
One embodiment according to the present utility model, first chip are electrically connected described second by wire and cover metal
Conductor plate, the wire are aluminium wire or copper wire.
One embodiment according to the present utility model, first power terminal, second power terminal, described first
Signal terminal and the second signal terminal stretch out the package casing part can upward, downward, towards a left side or towards right bending.
The utility model has the beneficial effects that the utility model is used in high-power multi-die packages structure, each plastic packaging
A substrate and a lead frame are only encapsulated in shell, by covering metal conductor plate between a substrate and a lead frame
With multiple chips with a power module is combined into, it is possible thereby to the independence in hoisting power module routine, work people
Member can select an appropriate number of power module according to the voltage or current requirements of system, for the assembly side of providing of power module
Just.When some power module in circuit system is damaged, it can individually be replaced, advantageously reduce the maintenance of system
Cost, and can be with the functional reliability of hoisting power module entirety.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the encapsulation power module of the utility model；
Fig. 2 is the top view of the encapsulation power module of the utility model；
Fig. 3 is the bottom view of the encapsulation power module of the utility model；
Fig. 4 is the structural schematic diagram before the encapsulation power module package of the utility model；
Fig. 5 is the main view of structure in Fig. 4；
Fig. 6 is the partial structural diagram of the encapsulation power module of the utility model；
Fig. 7 is the bottom view of structure in Fig. 6；
Fig. 8 is the side sectional view of structure in Fig. 6.
In figure, 100: encapsulation power module；1: substrate；2: lead frame；3: plastic shell；4: under cover metal conductor plate；
Cover metal conductor plate at 5: the first；Cover metal conductor plate at 6: the second；7: the first chips；8: the second chips；9: wire；10: the first
Power terminal；11: the first signal terminals；12: the second power terminals；13: second signal terminal；14: connection sheet.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in figures 1-8, high-power multi-die packages structure 100, including base are used for according to the utility model embodiment
Plate 1, lead frame 2 and plastic shell 3, which is characterized in that the lower surface of substrate 1, which is covered with down, covers metal conductor plate 4, substrate 1
Upper surface be covered with and be spaced apart the first of setting and cover metal conductor plate 5 and second and cover metal conductor plate 6, first covers metallic conductor
Plate 5 is equipped at least one the first chip 7 and at least one second chip 8, and the first chip 7 passes through the electrical connection of wire 9 second
Cover metal conductor plate 6；Lead frame 2 is located at the top of substrate 1 and along the circumferentially extending of substrate 1, and lead frame 2 is equipped with and is electrically connected
The first power terminal 10 and be electrically connected the second the first signal terminal 11 for covering metal conductor plate 6 that first covers metal conductor plate 5 are connect,
The second power terminal 12 and second signal terminal 13 arranged spaced apart, 12 He of the second power terminal are additionally provided on lead frame 2
Second signal terminal 13 is electrically connected the first chip 7 and the second chip 8；The package substrate 1 of plastic shell 3 and lead frame 2, and the
One power terminal 10, the second power terminal 12, the first signal terminal 11 and second signal terminal 13 extend plastic shell 3.
According to being used in high-power multi-die packages structure 100 for the utility model embodiment, in each plastic shell 3 only
A substrate 1 and a lead frame 2 are encapsulated, by covering metal conductor plate and more between a substrate 1 and a lead frame 2
A chip is with a power module is combined into, it is possible thereby to which the independence in hoisting power module routine, staff can
To select an appropriate number of power module according to the voltage of system or current requirements, provided convenience for the assembly of power module.
When some power module in circuit system is damaged, can individually be replaced, advantageously reduce the maintenance of system at
This, and can be with the functional reliability of hoisting power module entirety.
Wherein, it can be respectively provided with one by the first chip 7 of setting and the second chip 8, multiple first cores also can be set
Piece 7 and second chip 8, also can be set first chip 7 and multiple second chips 8, equally can be set multiple
One chip 7 and multiple second chips 8.The first chip 7 and the second chip 8 cooperated by setting diversified forms, can be product
It is laid out a variety of circuit structures to provide conveniently, has expanded the layout type of product.
The upper surface of one embodiment according to the present utility model, at least one of at least one first chip 7 is formed
There are the first signaling zone, second signal area and the third signaling zone for being spaced apart setting, the first signaling zone is located at second signal area and the
Between three signaling zones, and the first signaling zone covers metal conductor plate 6 by the electrical connection of wire 9 second.By on the first chip 7
First signaling zone, second signal area and third signaling zone are set, the function of the first chip 7 can be increased, improve power module
Performance.
One embodiment according to the present utility model, substrate 1 are that insulating layer adds single side to cover metallic conductor laminar substrate, insulating layer
Add any one two-sided covered in metallic conductor laminar substrate or metallic conductor substrate.
One embodiment according to the present utility model, second signal terminal 13 and the second power terminal 12 pass through connection sheet 14
The first chip 7 and the second chip 8 are connected, the lower surface of connection sheet bends downward to form four points of connection, four points of connection difference
For the first tie point, the second tie point, third tie point and the 4th tie point, the first tie point connects second signal area, and second
Tie point connects third signaling zone, and third tie point and the 4th tie point connect the upper surface of the second chip 8.The company of above structure
Contact pin 14 can be made of two sink structures interconnected, and the first tie point is formed on the bottom of one of sink structures
Third tie point and the 4th tie point are formed with the bottom of the second tie point, another sink structures.Thus it not only can simplify
The structure of connection sheet 14 designs, and can promote the stable connection between connection sheet 14 and the first chip 7 and the second chip 8
Property.
Wherein, the first tie point and the second tie point are welded to connect second signal area and third signal in the first chip 7
Qu Shang, third tie point and the 4th tie point are welded to connect on the upper surface of the second chip 8.Be weldingly connected simple process, behaviour
Facilitate, and the stability of the first tie point and the connection of the second tie point second signal area and third signaling zone can be promoted,
The connective stability of third tie point and the 4th tie point and the second chip 8 can similarly be promoted
One embodiment according to the present utility model, the first tie point can connect with welding in second signal area, and second
Tie point can connect with welding on third signaling zone, and third tie point and the 4th tie point can be connected with welding in the second chip
On 8 upper surface.The operating procedure of welded connecting is simple, and connective stability is strong, can prevent in welding process to first
Chip 7 damages, and improves the yield rate of encapsulation power module 100.
Wherein, pass through aluminium wire between second signal terminal 13 and the second power terminal 12 and the first chip 7 and the second chip 8
Bonding, copper wire bonding, aluminium strip welding or copper strips welding manner in any one.
One embodiment according to the present utility model, wire 9 are aluminium wire or copper wire, utilize aluminium wire or copper wire connection second
Metal conductor plate 6 and the first signaling zone are covered, structure is simple, and it is easy to operate, and also the electric conductivity of aluminium wire or copper wire is stronger, is telecommunications
Number transmitting provides convenience.
One embodiment according to the present utility model, the first power terminal 10, the second power terminal 12, the first signal terminal
11 and second signal terminal 13 stretch out package casing part can upward, downward, towards a left side or towards right bending.By to the first function
Rate terminal 10, the second power terminal 12, the first signal terminal 11 and second signal terminal 13 carry out bending process, can reduce function
The volume of rate module not only reduces the occupied space of power module, and can connect circuit board provider for power module
Just.
One embodiment according to the present utility model, encapsulation 100 bottom of power module be under cover metal conductor plate 4 play it is scattered
Hot plate effect promotes the radiating efficiency of encapsulation power module 100 for connecting radiator.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (8)
1. one kind is used for high-power multi-die packages structure (100), including substrate (1), lead frame (2) and plastic shell (3),
It is characterized in that, the lower surface of the substrate (1) is covered with down and covers metal conductor plate (4), the upper surface covering of the substrate (1)
There is be spaced apart and be arranged first to cover metal conductor plate (5) and second to cover metal conductor plate (6), described first covers metal conductor plate
(5) it is equipped at least one first chip (7) and at least one second chip (8), first chip (7) passes through wire
(9) metal conductor plate (6) are covered in electrical connection described second；
The lead frame (2) is located at the top of the substrate (1) and the circumferentially extending along the substrate (1), the lead frame
Frame (2), which is equipped with electrical connection described first and covers the first power terminal (10) of metal conductor plate (5) and be electrically connected described second, to be covered
The first signal terminal (11) of metal conductor plate (6) is additionally provided with the second power end arranged spaced apart on the lead frame (2)
Sub (12) and second signal terminal (13), second power terminal (12) and the second signal terminal (13) are electrically connected institute
State the first chip (7) and second chip (8)；
The plastic shell (3) wraps up the substrate (1) and the lead frame (2), and first power terminal (10), institute
The second power terminal (12), first signal terminal (11) and the second signal terminal (13) is stated to extend outside the plastic packaging
Shell (3).
2. according to claim 1 be used for high-power multi-die packages structure (100), which is characterized in that at least one institute
The upper surface for stating at least one of first chip (7) is formed with the first signaling zone for being spaced apart setting, second signal area and the
Three signaling zones, and first signaling zone covers metal conductor plate (6) by the wire (9) electrical connection described second.
3. according to claim 1 be used for high-power multi-die packages structure (100), which is characterized in that the substrate (1)
Metallic conductor laminar substrate is covered for insulating layer plus single side, insulating layer adds two-sided cover in metallic conductor laminar substrate or metallic conductor substrate
Any one.
4. according to claim 2 be used for high-power multi-die packages structure (100), which is characterized in that second letter
Number terminal (13) and second power terminal (12) connect first chip (7) and described second by connection sheet (14)
The lower surface of chip (8), the connection sheet (14) bends downward to form four points of connection, and four tie points are respectively first
Tie point, the second tie point, third tie point and the 4th tie point, first tie point connect the second signal area, institute
It states the second tie point and connects the third signaling zone, the third tie point connects second chip with the 4th tie point
(8) upper surface.
5. according to claim 4 be used for high-power multi-die packages structure (100), which is characterized in that described first connects
Contact and second tie point are welded to connect in the second signal area and third signaling zone of first chip (7), described
Third tie point and the 4th tie point are welded to connect on the upper surface of second chip (8).
6. according to claim 1 be used for high-power multi-die packages structure (100), which is characterized in that second letter
Number pass through aluminium between terminal (13) and second power terminal (12) and first chip (7) and second chip (8)
Silk bonding, copper wire bonding, aluminium strip welding or copper strips welding manner in any one.
7. according to claim 1 be used for high-power multi-die packages structure (100), which is characterized in that the wire
It (9) is aluminium wire or copper wire.
8. according to claim 1 be used for high-power multi-die packages structure (100), which is characterized in that first function
Rate terminal (10), second power terminal (12), first signal terminal (11) and the second signal terminal (13) are stretched
Out the part of the plastic shell can upward, downward, towards a left side or towards right bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822149291.7U CN209029372U (en) | 2018-12-19 | 2018-12-19 | One kind being used for high-power multi-die packages structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822149291.7U CN209029372U (en) | 2018-12-19 | 2018-12-19 | One kind being used for high-power multi-die packages structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209029372U true CN209029372U (en) | 2019-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822149291.7U Active CN209029372U (en) | 2018-12-19 | 2018-12-19 | One kind being used for high-power multi-die packages structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117154898A (en) * | 2023-10-30 | 2023-12-01 | 广东仁懋电子有限公司 | Quick-charging chip based on gallium nitride |
-
2018
- 2018-12-19 CN CN201822149291.7U patent/CN209029372U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117154898A (en) * | 2023-10-30 | 2023-12-01 | 广东仁懋电子有限公司 | Quick-charging chip based on gallium nitride |
| CN117154898B (en) * | 2023-10-30 | 2024-02-20 | 广东仁懋电子有限公司 | Quick-charging chip based on gallium nitride |
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