CN2927319Y - Electric connector for installing LED chip - Google Patents
Electric connector for installing LED chip Download PDFInfo
- Publication number
- CN2927319Y CN2927319Y CNU2006201049177U CN200620104917U CN2927319Y CN 2927319 Y CN2927319 Y CN 2927319Y CN U2006201049177 U CNU2006201049177 U CN U2006201049177U CN 200620104917 U CN200620104917 U CN 200620104917U CN 2927319 Y CN2927319 Y CN 2927319Y
- Authority
- CN
- China
- Prior art keywords
- electrode lead
- out tablet
- chip
- led chip
- hearth electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
The utility model discloses an electricity connector for LED chip installation, relating to the LED chip packaging technology, in particular to a device which facilitates the electrical connection between the chip and the external circuit. The prior art is deficient in that the chips cannot be connected in series and the practical operating requirements cannot be met. The utility model comprises an insulated substrate, and a chip installation seat, a bottom electrode extraction tablet, and an upper electrode extraction tablet, all of which are arranged on the insulated substrate; the chip installation seat is connected with the bottom electrode extraction tablet through a conductive strip, the upper electrode extraction tablet and the bottom electrode extraction tablet are insulated from each other. By improving the electrical connection structure of the LED chips, the LED chips can be conveniently connected in series with each other, the practical operating requirements can be met better, the connection is convenient, and the work is reliable.
Description
[technical field]
The utility model relates to the encapsulation technology of led chip, specifically is a kind of device of being convenient to chip and external circuit electrical connection.
[background technology]
In the current lighting field, the method that adopts high-power colored led replacement conventional incandescent to add color filtering mean is obtained coloured light and is had energy-saving and environmental protection, advantage that utilance is high, and application prospect is good.But the common led chip that can send coloured light (as ruddiness, gold-tinted, orange light etc.), its single electrical power that can bear is about about 1w, can't reach the requirement of illumination, a plurality of chip portfolios need be used during therefore actual the use.
Colored led chip adopts gallium arsenide phosphide to make more, and two electrode is located at the substrate and the chip top of chip bottom respectively.In the existing encapsulating structure, usually a plurality of chips are installed on the metab, this metab plays electric action and links to each other with external circuit.In this structure, can only adopt compound mode in parallel between a plurality of led chips, but mode low pressure, current state in parallel, as its input current of red-light LED lamp of adopting the 10W that parallel way makes up to 3.5A, and its input voltage 2.8V only can't drop into practical application.
[utility model content]
In order to overcome the above-mentioned defective that exists in the prior art, the utility model provides a kind of arrangements of electric connection that is used to install led chip, so that chip adopts the compound mode of polyphone, satisfies requirement of actual application.
For this reason, the utility model is by the following technical solutions: the arrangements of electric connection that is used to install led chip, it is characterized in that: it comprises insulated substrate and is located at chip mount pad, hearth electrode lead-out tablet and top electrode lead-out tablet on the insulated substrate, described chip mount pad is connected with the hearth electrode lead-out tablet by a conducting strip, and described top electrode lead-out tablet and hearth electrode lead-out tablet mutual insulating are provided with.During encapsulation, the bottom surface (being hearth electrode) of led chip is connected on the chip mount pad, another electrode (top electrode) of chip end face then is connected on the top electrode lead-out tablet by lead, when chip being contacted as need, as long as several jockeys are set, and the top electrode lead-out tablet of each jockey linked to each other successively with the hearth electrode lead-out tablet of next device get final product.By means of the utility model, can realize the polyphone between the led chip easily, when satisfying actual the use to the requirement of voltage, electric current.
Described hearth electrode lead-out tablet and top electrode lead-out tablet are positioned at the both sides of chip mount pad, and this structure is convenient to connect.
Described chip mount pad, hearth electrode lead-out tablet and conducting strip are integral structure, form a hearth electrode lead body, rule is provided with a plurality of hearth electrode lead bodies on the described insulated substrate, and integral structure is convenient to processing, can a plurality of chips be installed at a substrate like this.
Described insulated substrate is provided with plurality of electrodes and draws group, and each electrode is drawn a plurality of hearth electrode lead bodies and the top electrode lead-out tablet that group comprises that rule is provided with.In this case, when needs are connected a plurality of chips, the top electrode of every group end chip is connected to the top electrode lead-out tablet by lead, and the top electrode of other chip then can be realized by the hearth electrode lead body that lead directly is connected to next chip successively.
Described hearth electrode lead-out tablet and top electrode lead-out tablet are all and are flat " mountain " font sheet metal, are electric connecting terminal in the middle of it, and both sides are exit, are convenient to use wire bonds, reliable operation.
The beneficial effects of the utility model are: make it easy to mutual polyphone by the electric connection structure that improves led chip, can satisfy the actual needs that use well, easy to connect, reliable operation.
[description of drawings]
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is a chip scheme of installation of the present utility model.
Fig. 3 is a kind of embodiment schematic diagram of the present utility model.
Fig. 4 is an another kind of embodiment schematic diagram of the present utility model.
[embodiment]
The arrangements of electric connection that is used to install led chip as shown in Figure 1, insulated substrate 1 is provided with chip mount pad 3, hearth electrode lead-out tablet 2 and top electrode lead-out tablet 4, chip mount pad 3 is connected with hearth electrode lead-out tablet 4 by conducting strip 5, insulating material such as substrate usable resins are made, chip mount pad 3, hearth electrode lead-out tablet 2 and conducting strip 5 available metal sheet integral body are stamped to form, similarly, top electrode lead-out tablet 4 also can be made by sheet metal.(see figure 2) during encapsulation, on chip mount pad 3, the top electrode of led chip 6 is connected on the hearth electrode lead-out tablet 4 with lead 7 with the floor mounted of led chip 6.Hearth electrode lead-out tablet and top electrode lead-out tablet can adopt and be flat " mountain " font sheet metal, are electric connecting terminal in the middle of it, and both sides are exit.
When chip being connected, then need use devices a plurality of as that preceding segmented mode connects, successively the top electrode lead-out tablet 4 of each device be linked to each other (as Fig. 3) with the hearth electrode lead-out tablet 2 of next device then, can constitute series connection as need.
In addition, the utility model also can adopt structure as shown in Figure 4, promptly on a substrate 1, a plurality of electrodes are set and draw group, each electrode is drawn a plurality of hearth electrode lead bodies 8 and the top electrode lead-out tablet 4 that group comprises that rule is provided with, and hearth electrode lead body 8 comprises chip mount pad 3, hearth electrode lead-out tablet 2 and the conducting strip 5 of integral type.During encapsulation, the top electrode of every group end chip is connected to the top electrode lead-out tablet by lead, and the top electrode of other chip then gets final product by the hearth electrode lead body that lead directly is connected to next chip successively.So setting can realize series connection, can realize parallel connection again, satisfies the requirement of user to electric current, voltage better.
Claims (5)
1, is used to install the arrangements of electric connection of led chip, it is characterized in that: it comprises insulated substrate and is located at chip mount pad, hearth electrode lead-out tablet and top electrode lead-out tablet on the insulated substrate, described chip mount pad is connected with the hearth electrode lead-out tablet by a conducting strip, and described top electrode lead-out tablet and hearth electrode lead-out tablet mutual insulating are provided with.
2, the arrangements of electric connection that is used to install led chip according to claim 1 is characterized in that: described hearth electrode lead-out tablet and top electrode lead-out tablet are positioned at the both sides of chip mount pad.
3, the arrangements of electric connection that is used to install led chip according to claim 1, it is characterized in that: described chip mount pad, hearth electrode lead-out tablet and conducting strip are integral structure, form a hearth electrode lead body, rule is provided with a plurality of hearth electrode lead bodies on the described insulated substrate.
4, the arrangements of electric connection that is used to install led chip according to claim 3, it is characterized in that: described insulated substrate is provided with plurality of electrodes and draws group, and each electrode is drawn a plurality of hearth electrode lead bodies and the top electrode lead-out tablet that group comprises that rule is provided with.
5, according to each described arrangements of electric connection that is used to install led chip of claim 1 to 4, it is characterized in that: described hearth electrode lead-out tablet and top electrode lead-out tablet are all and are flat " mountain " font sheet metal, in the middle of it is electric connecting terminal, and both sides are exit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201049177U CN2927319Y (en) | 2006-06-20 | 2006-06-20 | Electric connector for installing LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201049177U CN2927319Y (en) | 2006-06-20 | 2006-06-20 | Electric connector for installing LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2927319Y true CN2927319Y (en) | 2007-07-25 |
Family
ID=38281571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006201049177U Expired - Fee Related CN2927319Y (en) | 2006-06-20 | 2006-06-20 | Electric connector for installing LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2927319Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101819967A (en) * | 2009-02-27 | 2010-09-01 | 夏普株式会社 | Led module and led light source device |
| WO2010105492A1 (en) * | 2009-03-20 | 2010-09-23 | 浙江迈勒斯照明有限公司 | Method for encapsulating multiple led chips with vertical structure on base to fabricate led lihgt source |
| CN102064248A (en) * | 2010-11-29 | 2011-05-18 | 浙江九星科技有限公司 | High-power LED chip packaging method |
| CN102403306A (en) * | 2010-09-10 | 2012-04-04 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
| CN102900972A (en) * | 2011-07-25 | 2013-01-30 | 京瓷连接器制品株式会社 | Semiconductor light-emitting element module, semiconductor light-emitting element module mounting module and manufacturing method of semiconductor light-emitting element module |
-
2006
- 2006-06-20 CN CNU2006201049177U patent/CN2927319Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101819967A (en) * | 2009-02-27 | 2010-09-01 | 夏普株式会社 | Led module and led light source device |
| CN101819967B (en) * | 2009-02-27 | 2012-08-15 | 夏普株式会社 | Led module and led light source apparatus |
| WO2010105492A1 (en) * | 2009-03-20 | 2010-09-23 | 浙江迈勒斯照明有限公司 | Method for encapsulating multiple led chips with vertical structure on base to fabricate led lihgt source |
| CN102037559B (en) * | 2009-03-20 | 2012-05-30 | 浙江迈勒斯照明有限公司 | Method for encapsulating multiple LED chips with vertical structure on base to fabricate LED lihgt source |
| CN102403306A (en) * | 2010-09-10 | 2012-04-04 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
| CN102064248A (en) * | 2010-11-29 | 2011-05-18 | 浙江九星科技有限公司 | High-power LED chip packaging method |
| CN102064248B (en) * | 2010-11-29 | 2012-06-27 | 浙江九星科技有限公司 | High-power LED chip packaging method |
| CN102900972A (en) * | 2011-07-25 | 2013-01-30 | 京瓷连接器制品株式会社 | Semiconductor light-emitting element module, semiconductor light-emitting element module mounting module and manufacturing method of semiconductor light-emitting element module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070725 Termination date: 20140620 |
|
| EXPY | Termination of patent right or utility model |