CN210927428U - Power supply chip and switching power supply system applying same - Google Patents
Power supply chip and switching power supply system applying same Download PDFInfo
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- CN210927428U CN210927428U CN201922008867.2U CN201922008867U CN210927428U CN 210927428 U CN210927428 U CN 210927428U CN 201922008867 U CN201922008867 U CN 201922008867U CN 210927428 U CN210927428 U CN 210927428U
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Abstract
The utility model discloses a power supply chip and a switch power supply system using the same, wherein the power supply chip comprises a packaging frame and an electric element arranged on the packaging frame, the packaging frame comprises a first base island, a second base island and a plurality of pins, the first base island and the second base island are mutually independent and are made of conductive materials; the electric element comprises a power supply control tube core, a first diode and a second diode, wherein a first connecting gasket and a second connecting gasket are arranged on the power supply control tube core, a substrate of the power supply control tube core is bonded with a first base island, the first connecting gasket is bonded with the first base island, the second connecting gasket is bonded with an anode of the second diode, the substrate of the first diode is bonded with the first base island, and the substrate of the second diode is bonded with the second base island. The utility model discloses an application of the inside integrated form power control tube core of packaging structure and system after optimizing has retrencied the system architecture in the maximum amplitude, has reduced off-the-shelf volume, has improved the production yield of processing enterprise.
Description
Technical Field
The utility model relates to a system of chip and applied this chip particularly, relates to a power chip and applied this chip's switching power supply system with novel packaging structure, belongs to integrated circuit technical field.
Background
With the continuous development of the communication technology of the internet of things in recent years, the enterprise has a great increase in the demand for various internet of things devices, and especially, the demand for short-distance wireless transmission devices such as ZigBee, bluetooth and WiFi and wireless communication devices such as 4G/5G shows a explosive increase.
Under the background of the technical development, the switching power supply system is taken as an indispensable component and a large number of components which are used in various internet of things devices, and the updating iteration of the technology is increasingly frequent. Although the common switch power supply system on the market mainly comprises a preceding stage rectifier filter circuit, a power supply chip, a switch power tube, an inductor, a diode, a power supply capacitor, an output capacitor and the like, the use requirements of the switch power supply system by equipment can be met, technical personnel find that the scheme is high in implementation cost and large in system finished product volume and the overall reliability of the system is seriously reduced due to the fact that the number of components in the system is large in the scheme through long-time application.
In view of the above-mentioned drawbacks of the conventional technical solutions, those skilled in the art also propose some new technical ideas and solutions, wherein typically, the volume of the system product is reduced and the manufacturing cost of the system is reduced by the integrated arrangement of each component in the switch power supply system and the optimization of the overall packaging structure of the system. Despite the possibilities of technical implementation of the above concept, a technical solution that is universally agreed in the industry has not yet emerged.
In view of the defects and the current development situation of the prior art, how to provide a power chip with a novel packaging structure and a switching power supply system using the power chip based on the current research foundation to reduce the volume of a system finished product and improve the overall reliability of the system is also a problem to be solved by technical staff in the industry.
Disclosure of Invention
The utility model aims at providing a switching power supply system of power chip and applied this chip, specifically as follows.
The utility model discloses a power supply chip, which comprises a packaging frame and an electric element arranged on the packaging frame;
the packaging frame is composed of a first base island, a second base island and a plurality of pins, wherein the first base island and the second base island are arranged independently and are both made of conductive materials;
the electric element comprises a power supply control tube core, a first diode and a second diode, wherein a first connecting pad, a second connecting pad and a third connecting pad are arranged on the power supply control tube core, a substrate of the power supply control tube core is bonded with the first base island through a conductive material, the first connecting pad of the power supply control tube core is bonded with the first base island through a metal lead, the second connecting pad of the power supply control tube core is bonded with an anode of the second diode through a metal lead, the substrate of the first diode is bonded with the first base island through a conductive material, and the substrate of the second diode is bonded with the second base island through a conductive material.
Preferably, the pins in the package frame include an input pin, an output ground pin, a chip ground pin, an output pin, and a power supply pin;
the input pin and the output ground pin are both separated from the first base island, the chip ground pin is directly connected with the first base island, one of the output pin and the power supply pin is directly connected with the second base island, and the other one of the output pin and the power supply pin is separated from the second base island.
Preferably, when the substrate of the second diode is an anode, the power supply pin is directly connected with the second base island, and the output pin is separated from the second base island;
when the substrate of the second diode is a cathode, the output pin is directly connected with the second base island, and the power supply pin is separated from the second base island.
Preferably, the substrate of the first diode is an anode, and the substrate of the second diode is an anode;
the second connecting pad of the power control tube core is bonded with the second base island through a metal lead, the third connecting pad of the power control tube core is bonded with the input pin through a metal lead, the cathode of the first diode is bonded with the output ground pin through a metal lead, and the cathode of the second diode is bonded with the output pin through a metal lead.
Preferably, the substrate of the first diode is an anode, and the substrate of the second diode is a cathode;
the second connecting pad of the power control tube core is bonded with the anode of the second diode through a metal lead, the third connecting pad of the power control tube core is bonded with the input pin through a metal lead, the cathode of the first diode is bonded with the output ground pin through a metal lead, and the anode of the second diode is further bonded with the power pin through a metal lead.
Preferably, the chip package structure further comprises a molding compound for realizing chip package, and the molding compound completely covers the front side and the back side of the package frame and the surface of the electrical element arranged on the package frame.
The utility model also discloses a switching power supply system, which comprises the power supply chip, a power supply capacitor, an output capacitor and an inductor;
the input pin in the packaging frame is connected with the positive electrode of the input end, one end of the power supply capacitor is electrically connected with the power supply pin in the packaging frame, the other end of the power supply capacitor is electrically connected with the chip ground pin in the packaging frame and one end of the inductor respectively, and the other end of the inductor is electrically connected with the output pin in the packaging frame.
Preferably, the input terminal is a DC input or an AC input connected through a preceding stage rectification circuit.
Preferably, an output ground pin in the package frame is electrically connected to a negative electrode of the input terminal, one end of the output capacitor, and a negative electrode of the output terminal, and is grounded, and the output pin is further electrically connected to the other end of the output capacitor and a positive electrode of the output terminal.
Preferably, an output ground pin in the package frame is electrically connected to a negative electrode of the output terminal and one end of the output capacitor, respectively, and the output pin is further electrically connected to a negative electrode of the input terminal, the other end of the output capacitor, and a positive electrode of the output terminal.
Compared with the prior art, the utility model discloses an advantage mainly embodies in following several aspects:
a power chip with novel packaging structure, through the application of the inside integrated form power control tube core of power chip packaging structure and system after optimizing, retrench the system architecture on the maximum amplitude, reduced the off-the-shelf volume of system, improved the production yield of processing enterprise.
Meanwhile, due to the obvious improvement of the power supply chips, the number of components in a switching power supply system applying the power supply chips is greatly reduced, the manufacturing cost of the whole system is reduced, system faults caused by damage of individual components are effectively avoided, the reliability of the whole system is improved, and the service performance of the whole system is further improved.
Furthermore, the utility model discloses also for other relevant problems in the same field provide the reference, can use this to extend as the foundation, apply to in the field other with power chip and the relevant technical scheme of switching power supply system, have very wide application prospect.
The following detailed description is made of specific embodiments of the present invention with reference to the accompanying drawings, so as to make the technical solution of the present invention easier to understand and master.
Drawings
Fig. 1 is a schematic diagram of a package structure of a power chip according to the present invention;
fig. 2 is a schematic cross-sectional view of a package of a power chip according to the present invention;
fig. 3 is a schematic view of another package structure of the power chip of the present invention;
fig. 4 is a schematic structural diagram of the switching power supply system of the present invention;
fig. 5 is another schematic structural diagram of the switching power supply system of the present invention.
Wherein: 10. a first base island; 11. a second base island; 100. inputting a pin; 101. an output ground pin; 102. a chip ground pin; 110. an output pin; 111. a power supply pin; 20. a power control die; 200. a first connection pad; 201. a second connection pad; 202. a third connection pad; 21. a first diode; 22. a second diode.
Detailed Description
The utility model aims at providing a power chip and applied this chip's switching power supply system with novel packaging structure.
Generally, the utility model discloses a power chip, including the encapsulation frame and set up in electrical element on the encapsulation frame, the encapsulation frame comprises first base island 10, second base island 11 and a plurality of pin, first base island 10 with mutual independence sets up between the second base island 11 and the two is made, possesses corresponding electric conductive property by conducting material. The specific material for manufacturing the first base island 10 and the second base island 11 may be further selected according to the actual application, and only the range of the material is limited here.
The electrical element comprises a power control die 20 integrated with a power transistor device, a first diode 21 and a second diode 22, and a first connection pad 200, a second connection pad 201 and a third connection pad 202 are arranged on the power control die 20.
The substrate of the power control die 20 is bonded to the first base island 10 through a conductive material, the first connection pad 200 of the power control die 20 is bonded to the first base island 10 through a metal wire, the second connection pad 201 of the power control die 20 is bonded to the anode of the second diode 22 through a metal wire, the substrate of the first diode 21 is bonded to the first base island 10 through a conductive material, and the substrate of the second diode 22 is bonded to the second base island 11 through a conductive material.
It should be noted that the specific shapes of the power control die 20, the first diode 21 and the second diode 22 do not affect the implementation of the present invention, in the present invention, the shape of the power control die 20 is rectangular, and the shapes of the first diode 21 and the second diode 22 are square.
The pins in the package frame include an input pin 100 as a chip input pin, an output ground pin 101 which can be connected to an AC input directly or through a pre-rectification circuit, as a system output, with reference to ground, a chip ground pin 102 as a chip reference to ground, an output pin 110 as a system output, and a power pin 111 as a chip power pin.
The input pin 100 and the output ground pin 101 are both separated from the first base island 10, and the chip ground pin 102 is directly connected to the first base island 10.
One of the output pin 110 and the power supply pin 111 is directly connected to the second base island 11, and the other is separated from the second base island 11, and the setting rule is as follows.
When the substrate of the second diode 22 is an anode, the power supply pin 111 is directly connected to the second base island 11, and the output pin 110 is separated from the second base island 11;
when the substrate of the second diode 22 is a cathode, the output pin 110 is directly connected to the second base island 11, and the power supply pin 111 is separated from the second base island 11.
It should be added that the material selection of the first connection pad 200, the second connection pad 201, and the third connection pad 202 may be in various forms, and only the application needs to be adaptively selected according to actual use requirements. In this embodiment, the first connection pad 200, the second connection pad 201, and the third connection pad 202 are all aluminum pads.
To the structure of above-mentioned power chip, the utility model provides an embodiment of two differences is specifically as follows.
As shown in fig. 1 to fig. 2, in an embodiment of the power supply chip of the present invention, the substrate of the first diode 21 is an anode, and the substrate of the second diode 22 is an anode. In this arrangement, the second connection pad 201 of the power control die 20 is directly bonded to the second base island 11 through a metal wire by virtue of the conductivity of the second base island 11 itself, the third connection pad 202 of the power control die 20 is bonded to the input lead 100 through a metal wire, the cathode of the first diode 21 is bonded to the output ground lead 101 through a metal wire, and the cathode of the second diode 22 is bonded to the output lead 110 through a metal wire.
As shown in fig. 3, in another embodiment of the power chip of the present invention, the substrate of the first diode 21 is an anode, and the substrate of the second diode 22 is a cathode. In this arrangement, the second connection pad 201 of the power control die 20 is bonded to the anode of the second diode 22 through a metal wire, the third connection pad 202 of the power control die 20 is bonded to the input lead 100 through a metal wire, the cathode of the first diode 21 is bonded to the output ground lead 101 through a metal wire, and the anode of the second diode 22 is also bonded to the power supply lead 111 through a metal wire.
In addition, it should be added that, in the practical application process, since the implementation form of the second diode 22 is various, the specific connection setting between the components can be correspondingly adapted without violating the connection relationship of the present invention. For example, if certain diode components with specific specifications are used as the first diode 21 and the second diode 22, it may happen that the cathode and the anode of the first diode 21 or the second diode 22 are located on the same side, and in this case, the basic connection relationship between the components still remains unchanged, and in particular, the connection relationship between the second diode 22 and the second connection pad 201 still follows the rule of "bonding the second connection pad 201 and the anode of the second diode 22".
Besides, the power chip further comprises a plastic package material for realizing chip packaging, and the plastic package material completely covers the front side and the back side of the packaging frame and the surface of the electrical element arranged on the packaging frame.
The utility model also provides a non-isolated switching power supply system, including the power chip as above, still including power capacitor C1, output capacitor C2 and inductance L1;
an input pin 100 in the package frame is connected to a positive electrode of an input terminal, one end of the power capacitor C1 is electrically connected to a power pin 111 in the package frame, the other end of the power capacitor C1 is electrically connected to a chip ground pin 102 in the package frame and one end of the inductor L1, respectively, and the other end of the inductor L1 is electrically connected to an output pin 110 in the package frame.
The input end can be a DC input or an AC input connected through a preceding stage rectifying circuit, and the specific input end setting can be further determined according to the actual situation.
The same as the scheme of the above chip, the switching power supply system of the present invention is also provided with the following two embodiments.
As shown in fig. 4, in an embodiment of the switching power supply system of the present invention, the output ground pin 101 in the package frame is electrically connected to the negative electrode of the input terminal, one end of the output capacitor C2, and the negative electrode of the output terminal, and is grounded, and the output pin 110 is further electrically connected to the other end of the output capacitor C2 and the positive electrode of the output terminal.
As shown in fig. 5, in another embodiment of the switching power supply system of the present invention, the output ground pin 101 in the package frame is electrically connected to the negative electrode of the output end and the one end of the output capacitor C2, respectively, and the output pin 110 is also electrically connected to the negative electrode of the input end, the other end of the output capacitor C2, and the positive electrode of the output end.
A power chip with novel packaging structure, through the application of the inside integrated form power control tube core of power chip packaging structure and system after optimizing, retrench the system architecture on the maximum amplitude, reduced the off-the-shelf volume of system, improved the production yield of processing enterprise.
Meanwhile, due to the obvious improvement of the power supply chips, the number of components in a switching power supply system applying the power supply chips is greatly reduced, the manufacturing cost of the whole system is reduced, system faults caused by damage of individual components are effectively avoided, the reliability of the whole system is improved, and the service performance of the whole system is further improved.
Furthermore, the utility model discloses also for other relevant problems in the same field provide the reference, can use this to extend as the foundation, apply to in the field other with power chip and the relevant technical scheme of switching power supply system, have very wide application prospect.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A power chip comprises a packaging frame and an electric element arranged on the packaging frame, and is characterized in that:
the packaging frame is composed of a first base island (10), a second base island (11) and a plurality of pins, wherein the first base island (10) and the second base island (11) are arranged independently, and both the first base island and the second base island are made of conductive materials;
the electrical elements comprise a power control die (20), a first diode (21) and a second diode (22), a first connection pad (200), a second connection pad (201) and a third connection pad (202) are arranged on the power control die (20), the substrate of the power control die (20) is bonded to the first base island (10) by a conductive material, the first connection pads (200) of the power control die (20) are bonded to the first base island (10) by metal wires, a second connection pad (201) of the power control die (20) is bonded to the anode of the second diode (22) by a metal wire, the substrate of the first diode (21) is bonded to the first base island (10) by means of an electrically conductive material, the substrate of the second diode (22) is bonded to the second base island (11) by a conductive material.
2. The power supply chip according to claim 1, wherein: the pins in the packaging frame comprise an input pin (100), an output ground pin (101), a chip ground pin (102), an output pin (110) and a power supply pin (111);
the input pin (100) and the output ground pin (101) are separated from the first base island (10), the chip ground pin (102) is directly connected with the first base island (10), one of the output pin (110) and the power supply pin (111) is directly connected with the second base island (11), and the other one is separated from the second base island (11).
3. The power supply chip according to claim 2, wherein: when the substrate of the second diode (22) is an anode, the power supply pin (111) is directly connected with the second base island (11), and the output pin (110) is separated from the second base island (11);
when the substrate of the second diode (22) is a cathode, the output pin (110) is directly connected with the second base island (11), and the power supply pin (111) is separated from the second base island (11).
4. The power supply chip according to claim 3, wherein: the substrate of the first diode (21) is an anode, and the substrate of the second diode (22) is an anode;
the second connection pad (201) of the power control die (20) is bonded with the second base island (11) through a metal lead, the third connection pad (202) of the power control die (20) is bonded with the input lead (100) through a metal lead, the cathode of the first diode (21) is bonded with the output ground lead (101) through a metal lead, and the cathode of the second diode (22) is bonded with the output lead (110) through a metal lead.
5. The power supply chip according to claim 3, wherein: the substrate of the first diode (21) is an anode, and the substrate of the second diode (22) is a cathode;
the second connecting pad (201) of the power control die (20) is bonded with the anode of the second diode (22) through a metal lead, the third connecting pad (202) of the power control die (20) is bonded with the input lead (100) through a metal lead, the cathode of the first diode (21) is bonded with the output ground lead (101) through a metal lead, and the anode of the second diode (22) is also bonded with the power lead (111) through a metal lead.
6. The power supply chip according to claim 1, wherein: the packaging frame is characterized by further comprising a plastic packaging material for realizing chip packaging, wherein the plastic packaging material completely covers the front side and the back side of the packaging frame and the surface of the electric element arranged on the packaging frame.
7. A switching power supply system comprising the power supply chip according to any one of claims 1 to 6, characterized in that: the power supply capacitor, the output capacitor and the inductor are also included;
an input pin (100) in the packaging frame is connected with the positive electrode of an input end, one end of the power supply capacitor is electrically connected with a power supply pin (111) in the packaging frame, the other end of the power supply capacitor is respectively electrically connected with a chip ground pin (102) in the packaging frame and one end of the inductor, and the other end of the inductor is electrically connected with an output pin (110) in the packaging frame.
8. The switching power supply system according to claim 7, wherein: the input end is DC input or AC input connected through a preceding stage rectifying circuit.
9. The switching power supply system according to claim 7, wherein: an output ground pin (101) in the packaging frame is electrically connected with a negative electrode of the input end, one end of the output capacitor and a negative electrode of the output end respectively and is grounded, and the output pin (110) is also electrically connected with the other end of the output capacitor and a positive electrode of the output end.
10. The switching power supply system according to claim 7, wherein: an output ground pin (101) in the packaging frame is electrically connected with a negative electrode of the output end and one end of the output capacitor respectively, and the output pin (110) is also electrically connected with a negative electrode of the input end, the other end of the output capacitor and a positive electrode of the output end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922008867.2U CN210927428U (en) | 2019-11-20 | 2019-11-20 | Power supply chip and switching power supply system applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922008867.2U CN210927428U (en) | 2019-11-20 | 2019-11-20 | Power supply chip and switching power supply system applying same |
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| Publication Number | Publication Date |
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| CN210927428U true CN210927428U (en) | 2020-07-03 |
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| CN201922008867.2U Active CN210927428U (en) | 2019-11-20 | 2019-11-20 | Power supply chip and switching power supply system applying same |
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