CN108807306A - A kind of novel power supply power module architectures of band input protection - Google Patents
A kind of novel power supply power module architectures of band input protection Download PDFInfo
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- CN108807306A CN108807306A CN201810708184.5A CN201810708184A CN108807306A CN 108807306 A CN108807306 A CN 108807306A CN 201810708184 A CN201810708184 A CN 201810708184A CN 108807306 A CN108807306 A CN 108807306A
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- 238000010276 construction Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims description 44
- 238000005452 bending Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000001052 transient effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 208000004067 Flatfoot Diseases 0.000 description 1
- 208000025274 Lightning injury Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 235000019994 cava Nutrition 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Rectifiers (AREA)
Abstract
The present invention provides a kind of novel power supply power module architectures of band input protection, belong to semiconductor components and devices field, including four rectification chips, one overvoltage protection chip, two input terminals, two leading-out terminals and plastic-sealed body, it is characterized in that, it further include the first frame unit being oppositely arranged successively, second frame unit and third frame unit, four rectification chips are arranged between the first frame unit and the second frame unit, overvoltage protection chip setting forms laminated construction between the second frame unit and third frame unit, two input terminals are drawn from the second frame unit, two leading-out terminals are drawn from the first frame unit；Four rectification chips and overvoltage protection chip are carried out by androgynous encapsulation using laminated construction; formed the tiling of four rectification chips and with the structure of overvoltage protection chip vertical integration; encapsulating structure space layout is more reasonable; the plane space that product occupies on pcb board is small, solves the problems, such as the space availability ratio on pcb board.
Description
Technical field
The present invention relates to semiconductor components and devices fields, and in particular to a kind of novel power supply power module knot of band input protection
Structure.
Background technology
With the development of society, electronic product is also more and more accurate, requirement of the electronic product to power supply is also higher and higher.
Existing AC network can generate instantaneous interference when by factors such as lightning stroke and power equipment start and stop in power grid, this interference
Electronic equipment and circuit can be damaged.Many electronic components using direct current, institute can have been used in electronic product
To need to add AC to DC before accessing power grid and carry the electronic component such as rectifier bridge etc. of rectifying and voltage-stabilizing structure, with
Realize the protection to other electronic components.Existing Transient Suppression Diode has the response time being exceedingly fast（Nanosecond）And phase
When high surge absoption ability, subsequent circuit element can be protected not impacted by high voltage transient spike.General transient state suppression
Diode processed is mounted on power input or output module, all components being responsible in the entire circuit of protection, but in the circuit board
Individually welding TVS pipe, it is not only of high cost, no small space is also occupied, electronic product micromation is unfavorable for.
For this problem, discloses one kind application No. is 201621042098.8 utility model patent and filtering out high voltage transient
The ultra-thin rectifier bridge of pulse, including the diode chip for backlight unit of plastic-sealed body, four same technical indicators, two-way TVS pipe chip, four
The frame of a lead；Two-way TVS pipe chip is fixed on the first lead frame, and third lead frame is connected by conducting wire；Its
In two diode chip for backlight unit be fixed on the second lead frame, top surface is p-type, respectively pass through conducting wire connection first, third
Lead frame；Other two diode chip for backlight unit is fixed on the 4th lead frame, and top surface is N-type, is connected respectively by conducting wire
Connect first, third lead frame；The first, third lead frame makees exchange pin, and the second, the 4th lead frame is made positive and negative respectively
Pole pin.The structure carries out bonding wire arrangement in the form of four gage laps, and it is small to be conducive to pcb board for rectifier bridge compact in design
Typeization develops.
Although it is big that above structure solves on circuit boards independent welding TVS diode occupied space to a certain extent
Problem, but there is a problem in that：Bonding wire craft itself has limitation, and production efficiency is relatively low, to working condition
The phenomenon that harsher, and the lead used caves in during plastic packaging it is easy to appear bonding wire, cause product yield relatively low, together
When influence the quality of product；Used lead is generally copper wire, and in order to meet the requirement of encapsulation, copper wire fineness used is wanted
Ask high, be bound to cause the raising of product cost, and make contact operation it is cumbersome, speed of making contact is slow, influences production efficiency；Separately
Outside, which uses bonding wire craft to weld together the chip of TVS diode and rectifier bridge with flush system, and topology layout is inadequate
Rationally, it is larger that plane space is occupied on pcb board, not only constrains the miniaturization of rectifier bridge, but also this structure is direct
The quantity for resulting in the rectifier bridge that can be encapsulated per framing during its manufacturing procedure, influences the production efficiency of product.
Invention content
To solve the above-mentioned problems, it the present invention provides a kind of novel power supply power module architectures of band input protection, adopts
Rectifier bridge and overvoltage protection chip consubstantiality are encapsulated with laminated construction, space layout is more reasonable, what product occupied on pcb board
Plane space is small, is conducive to the miniaturization of rectifier bridge product, expands the popularity of its application；This Space Layout Structure simultaneously
Employed in each holder between design more rationally, improve the rectifier bridge quantity that single group frame can encapsulate, carry significantly
High production efficiency, reduces cost；In addition this structure is more stablized, and product yield caused by bonding wire capable of being avoided to cave in is low to be showed
As.
The present invention is technical solution used by solving its technical problem：A kind of novel power supply power of band input protection
Modular structure, including four rectification chips, an overvoltage protection chip, two input terminals, two leading-out terminals and plastic-sealed body,
The overvoltage protection chip can be used but be not limited to TVS chips, voltage dependent resistor chip, which is characterized in that further include opposite successively
The first frame unit, the second frame unit and the third frame unit being arranged, four rectification chips are arranged in the first frame unit
Between the second frame unit, overvoltage protection chip setting formation lamination knot between the second frame unit and third frame unit
Structure；
First frame unit includes two downhand welding disks, two pads with salient point, and two downhand welding disks are connected, and two with convex
The pad of point is connected, and the cathode of two rectification chips is connected with two downhand welding disks of the first frame unit respectively；Described
Two frame units include two downhand welding disks, two pads with salient point towards the first frame unit, the second frame unit direction
The pad with salient point that each downhand welding disk of first frame unit is connected respectively the second frame unit forms pad company
The cathode of junctor, another two rectification chip is connected with two downhand welding disks of the second frame unit respectively；On first frame unit
Two pads with salient point are connected with the anode for the rectification chip being set on two downhand welding disks on the second frame unit respectively, the
Pad with the salient point anode with the rectification chip being set on the first frame unit on two downhand welding disks respectively on two frame units
It is connected；
Second frame unit further includes a downhand welding disk towards third frame unit, towards third on the second frame unit
The downhand welding disk of frame unit is arranged on a pad connector, and court is arranged on the second frame unit in the overvoltage protection chip
It is connected with another pad connector on the downhand welding disk of third frame unit, and by third frame unit；
Two input terminals are drawn from the second frame unit, wherein an input terminal is from a pad connector close to flat
The side of pad is drawn, another input terminal is drawn from another pad connector close to the side of downhand welding disk；Two defeated
Go out terminal to draw from the first frame unit, wherein a leading-out terminal is connected from two downhand welding disks on the first frame unit
Side is drawn, another leading-out terminal is drawn from the side that two pads with salient point are connected on the first frame unit.
Further, described the input terminal and the output terminal can stretch out to form flat foot knot from the bottom flat of plastic-sealed body
Structure；In addition, the input terminal and the output terminal can also stretch out simultaneously bending formation sea-gull leg structure outward from the intermediate of plastic-sealed body.
Further, described the input terminal and the output terminal is coplanar.
Further, the third frame unit is set as film dancing, film dancing one end and the overvoltage on a pad connector
Chip is protected to be connected, the film dancing other end is connected with another pad connector.
The invention has the advantages that four rectification chips and overvoltage protection chip are carried out androgynous envelope using laminated construction
Dress, formed the tiling of four rectification chips and with the structure of overvoltage protection chip vertical integration, encapsulating structure space layout more adduction
Reason, the plane space that product occupies on pcb board is small, solves the problems, such as the space availability ratio on pcb board, is conducive to rectifier bridge product
Miniaturization, expand its application popularity；It is packaged connection using three layers of frame unit pair, five chips, is occupied
Plane space is small, the density of single group lead frame carrying product is improved, to improve the rectification that single group frame can encapsulate
The quantity of bridge component, substantially increases production efficiency, effectively reduces production cost；Three layers of frame unit and five chips
Cooperation forms specific solid space inside plastic-sealed body, rationally distributed, is not only conducive to the heat dissipation of product, avoids laminated construction pair
The electrical influence of product, and product structure is more stablized, the low phenomenon of product yield caused by bonding wire capable of being avoided to cave in.
Description of the drawings
Fig. 1 is the main structure diagram of one embodiment of the invention；
Fig. 2 is the overlooking structure diagram of one embodiment of the invention；
Fig. 3 is the left view structural representation of one embodiment of the invention；
Fig. 4 is the right side structural representation of one embodiment of the invention；
Fig. 5 is the inside dimensional structure diagram of one embodiment of the invention plastic-sealed body；
Fig. 6 is the structural schematic diagram of four rectification chips and the first, second frame unit of one embodiment of the invention；
Fig. 7 is the overlooking structure diagram of the first frame unit of one embodiment of the invention；
Fig. 8 is the left view schematic diagram of Fig. 7；
Fig. 9 is the overlooking structure diagram of the second frame unit of one embodiment of the invention；
Figure 10 is the left view schematic diagram of Fig. 9；
Figure 11 is the side structure schematic view of another embodiment of the present invention；
Figure 12 is the internal die circuitry connection diagram of the present invention.
In figure：1. the first frame unit, 2. second frame units, 3. third frame units, 4. rectification chips, 5. overvoltages are protected
Protect chip, 6. input terminals, 7. leading-out terminals, 8. downhand welding disks, 9. pads with salient point, 10. plastic-sealed bodies, 11. pad connectors.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
As shown in Fig. 1-Figure 10, one embodiment of the invention power modular structure, including four rectification chips 4, one
The leading-out terminal 7 of input terminal 6, two of a overvoltage protection chip 5, two and plastic-sealed body 10, the overvoltage protection chip 5 can be adopted
With but be not limited to TVS chips, voltage dependent resistor chip, power modular structure further includes the first frame list being oppositely arranged successively
First 1, second frame unit 2 and third frame unit 3, the wherein orientation of three can be but not limited to shown in the drawings perpendicular
Histogram to, specifically should be according to the space angle of power module in actual use depending on, vertical direction shown in the drawings is
For by power module be used for horizontal plane pcb board when arrangement orientation；
Four rectification chips 4 are arranged between the first frame unit 1 and the second frame unit 2, the setting of overvoltage protection chip 5 is the
Laminated construction is formed between two frame units 2 and third frame unit 3；
The laminated construction is specially：First frame unit 1 includes two downhand welding disks, 8, two pads 9 with salient point,
Two downhand welding disks 8 are connected, and two pads 9 with salient point are connected, the cathode of two rectification chips 4 respectively with the first frame list
Two downhand welding disks 8 of member 1 are connected；Second frame unit 2 includes two downhand welding disks 8, two towards the first frame unit 1
Each downhand welding disk 8 of a pad 9 with salient point, the second frame unit 2 towards the first frame unit 1 is connected respectively the second frame
Pad 9 of one of frame unit 2 with salient point forms pad connector 11, the cathode of another two rectification chip 4 respectively with the second frame
Two downhand welding disks 8 of frame unit 2 are connected；On first frame unit 1 two pads 9 with salient point respectively with the second frame unit
The anode for the rectification chip 4 being set on two downhand welding disks 8 on 2 is connected, and the pad 9 with salient point is distinguished on the second frame unit 2
It is connected with the anode for the rectification chip 4 being set on two downhand welding disks 8 on the first frame unit 1；Second frame unit 2 is also
Include a downhand welding disk 8 towards third frame unit 3, towards the downhand welding disk 8 of third frame unit 3 on the second frame unit 2
It is arranged on a pad connector 11, the overvoltage protection chip 5 is arranged on the second frame unit 2 towards third frame list
On the downhand welding disk 8 of member 3, and it is connected with another pad connector 11 by third frame unit 3；Third frame in the present embodiment
Unit 3 is set as film dancing, and film dancing one end is connected with the overvoltage protection chip 5 on a pad connector 11, the film dancing other end with
Another pad connector 11 is connected；
In being formed by laminated construction, four rectification chips respectively on the first frame unit 1 and the second frame unit 2 not
It is connected with position salient point, staggeredly space is complemented each other to form centainly in being formed by space structure, is conducive to improve dissipating for product
Hot property；Five connections between chip and frame unit or film dancing in the present embodiment can be used tin cream and be welded and fixed.
Two input terminals 6 are drawn from the second frame unit 2, and specifically, one of input terminal 6 connects from a pad
It is drawn close to the side of downhand welding disk 8 on junctor 11, another input terminal 6 is from another pad connector 11 close to downhand welding disk
It draws 8 side；
Two leading-out terminals 7 are drawn from the first frame unit 1, and specifically, one of leading-out terminal 7 is from the first frame unit 1
Side that upper two downhand welding disks 8 are connected is drawn, another leading-out terminal 7 is from two welderings with salient point on the first frame unit 1
It draws the side that disk 9 is connected；And input terminal 6 and leading-out terminal 7 are coplanar.
The input terminal 6 and leading-out terminal 7 of the present embodiment from plastic-sealed body 10 it is intermediate stretch out then bending outward and to
Extend to form sea-gull leg structure outside；Wherein input terminal 6 and 7 outwardly extending part of leading-out terminal can be leaned on plastic-sealed body 10
The top surface flush of nearly first frame unit 1, as shown in Figure 3 and Figure 4；Can also be with plastic-sealed body 10 close to third frame unit
3 top surface flush, i.e. four terminal overbending directions are opposite with direction shown in Fig. 3 and Fig. 4.
As shown in figure 11, in another embodiment of the present invention input terminal 6 and leading-out terminal 6 and the first frame unit 1 and
Second frame unit, 2 place plane parallel, input terminal 6 and leading-out terminal 7 stretch out shape from the bottom flat of plastic-sealed body 10
At flat leg structure；The bottom of plastic-sealed body 10 can be plastic-sealed body 10 shown in Figure 11 close to the top surface of the first frame unit 1 herein,
Can also be with shown in Figure 11 on the contrary, plastic-sealed body 10 is regarded as its bottom close to the top surface of third frame unit 3.
Four rectification chips and overvoltage protection chip are carried out androgynous encapsulation by the present invention using laminated construction, and formation four is whole
Flow chip tiling and with the structure of overvoltage protection chip vertical integration, encapsulating structure space layout is more reasonable, and product is in pcb board
The plane space of upper occupancy is small, solves the problems, such as the space availability ratio on pcb board, is conducive to the miniaturization of rectifier bridge product,
Expand the popularity of its application；It is packaged connection using three layers of frame unit pair, five chips, occupancy plane space is small, carries
The high density of single group lead frame carrying product, to improve the number for the rectifier bridge component that single group frame can encapsulate
Amount, production efficiency improve 30%-50% compared with the prior art, effectively reduce production cost；Three layers of frame unit and five cores
The cooperation of piece forms specific solid space inside plastic-sealed body, rationally distributed, is not only conducive to the heat dissipation of product, avoids lamination knot
The structure influence electrical to product, and product structure is more stablized, and product yield caused by bonding wire capable of being avoided to cave in is low to be showed
As.
Claims (7)
1. a kind of novel power supply power module architectures of band input protection, including four rectification chips（4）, an overvoltage protection core
Piece（5）, two input terminals（6）, two leading-out terminals（7）And plastic-sealed body（10）, which is characterized in that further include opposite successively set
The first frame unit set（1）, the second frame unit（2）And third frame unit（3）, four rectification chips（4）Setting is the
One frame unit（1）With the second frame unit（2）Between, overvoltage protection chip（5）It is arranged in the second frame unit（2）With third
Frame unit（3）Between form laminated construction；
First frame unit（1）Including two downhand welding disks（8）, two pads with salient point（9）, two downhand welding disks（8）Phase
Connection, two pads with salient point（9）It is connected, two rectification chips（4）Cathode respectively with the first frame unit（1）Two
A downhand welding disk（8）It is connected；Second frame unit（2）Including the first frame unit of direction（1）Two downhand welding disks（8）,
Two pads with salient point（9）, the second frame unit（2）Towards the first frame unit（1）Each downhand welding disk（8）It corresponds to respectively
Connect the second frame unit（2）A pad with salient point（9）Form pad connector（11）, another two rectification chip（4）
Cathode respectively with the second frame unit（2）Two downhand welding disks（8）It is connected；First frame unit（1）Upper two bands salient point
Pad（9）Respectively with the second frame unit（2）It is upper to be set to two downhand welding disks（8）On rectification chip（4）Anode be connected,
Second frame unit（2）On the pad with salient point（9）Respectively with the first frame unit（1）It is upper to be set to two downhand welding disks（8）On
Rectification chip（4）Anode be connected；
Second frame unit（2）Further include towards third frame unit（3）A downhand welding disk（8）, the second frame unit
（2）On towards third frame unit（3）Downhand welding disk（8）It is arranged in a pad connector（11）On, the overvoltage protection core
Piece（5）It is arranged in the second frame unit（2）On towards third frame unit（3）Downhand welding disk（8）On, and pass through third frame list
Member（3）With another pad connector（11）It is connected；
Two input terminals（6）From the second frame unit（2）It draws, two leading-out terminals（7）From the first frame unit（1）Draw
Go out.
2. the novel power supply power module architectures of band input protection according to claim 1, which is characterized in that input terminal
（6）And leading-out terminal（7）From plastic-sealed body（10）Bottom flat stretch out to form flat leg structure.
3. the novel power supply power module architectures of band input protection according to claim 1, which is characterized in that input terminal
（6）And leading-out terminal（7）From plastic-sealed body（10）Intermediate stretch out and bending forms sea-gull leg structure outward.
4. the novel power supply power module architectures of band input protection according to claim 1, which is characterized in that an input
Terminal（6）From a pad connector（11）Upper close downhand welding disk（8）Side draw, another input terminal（6）From another
A pad connector（11）Upper close downhand welding disk（8）Side draw.
5. the novel power supply power module architectures of band input protection according to claim 1, which is characterized in that an output
Terminal（7）From the first frame unit（1）Upper two downhand welding disks（8）The side being connected is drawn, another leading-out terminal（7）From
One frame unit（1）Upper two pads with salient point（9）It draws the side being connected.
6. according to the novel power supply power module architectures of claim 1-5 any one of them bands input protection, which is characterized in that
The input terminal（6）And leading-out terminal（7）It is coplanar.
7. the novel power supply power module architectures of band input protection according to claim 1, which is characterized in that the third
Frame unit（3）It is set as film dancing, film dancing one end and a pad connector（11）On overvoltage protection chip（5）It is connected, jumps
The piece other end and another pad connector（11）It is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810708184.5A CN108807306B (en) | 2018-07-02 | 2018-07-02 | Power module structure with input protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810708184.5A CN108807306B (en) | 2018-07-02 | 2018-07-02 | Power module structure with input protection |
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| Publication Number | Publication Date |
|---|---|
| CN108807306A true CN108807306A (en) | 2018-11-13 |
| CN108807306B CN108807306B (en) | 2024-02-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035587A (en) * | 2019-05-21 | 2019-07-19 | 横店集团得邦照明股份有限公司 | A kind of high power factor LED drive circuit simplified and its implementation |
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| 俞晓东;何洪;宋秀峰;曾俊;李冉;石志想;: "功率电子模块及其封装技术", 电子与封装, no. 11 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035587A (en) * | 2019-05-21 | 2019-07-19 | 横店集团得邦照明股份有限公司 | A kind of high power factor LED drive circuit simplified and its implementation |
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|---|---|
| CN108807306B (en) | 2024-02-13 |
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