CN107482108A - A kind of new SMD lamp beads - Google Patents
A kind of new SMD lamp beads Download PDFInfo
- Publication number
- CN107482108A CN107482108A CN201710683471.0A CN201710683471A CN107482108A CN 107482108 A CN107482108 A CN 107482108A CN 201710683471 A CN201710683471 A CN 201710683471A CN 107482108 A CN107482108 A CN 107482108A
- Authority
- CN
- China
- Prior art keywords
- conducting strip
- encapsulating table
- lamp beads
- pedestal
- smd lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 26
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009411 base construction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000013396 workstream Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of new SMD lamp beads, including pedestal and LED chip, the pedestal is provided with encapsulating table and is used for the conducting strip for connecting LED chip on encapsulating table, the encapsulating table is provided with four conducting strips, and each conducting strip extends to encapsulating table both sides external along the encapsulating table and forms conductive pin from inside to outside, the conducting strip with two be one group of symmetry arrangement on pedestal, LED chip is connected between every group of two conducting strips, encapsulated layer covered with packaging LED chips on the encapsulating table, after being packaged into SMD lamp beads, can be by changing the connected mode realization string of conductive pin and external circuit and switching, required electric current during so as to change lamp bead normal work, voltage, structure is practical reliable.
Description
Technical field
The present invention relates to SMD encapsulation LED technologies field, especially a kind of new lamp bead based on SMD encapsulation.
Background technology
SMD refers to surface mount device, and SMD paster LEDs are surface labeling LED.SMD pasters help to produce
Efficiency improves, and distinct device application, is a kind of solid state semiconductor devices, electricity directly can be converted into light by it.LED branch
Frame is the bottom susceptor of LED lamp bead before encapsulation, on the basis of LED support, chip is fixed, positive and negative electrode of burn-oning,
It is once in package shape with packaging plastic again.Internal structure has been fixed after traditional SMD LED lamp beads encapsulation, i.e., can not change inside
The connection in series-parallel relation of LED chip, have very to lamp bead using one voltage, current specification unmodifiable scope, during use
Big limitation.
The content of the invention
To solve the above, the present invention provides a kind of new SMD lamp beads, can remain to meet to go here and there and change after packaging
Demand, required electric current, voltage during so as to change lamp bead normal work.
The technical solution adopted by the present invention is：
A kind of new SMD lamp beads, including pedestal and LED chip, the pedestal are provided with encapsulating table and located at encapsulating tables
The upper conducting strip for being used to connect LED chip, the encapsulating table are provided with four conducting strips, and each conducting strip along the encapsulating table by
Extend to from inside to outside encapsulating table both sides external formed conductive pin, the conducting strip with two be one group of symmetry arrangement in pedestal
On, it is connected with LED chip between every group of two conducting strips, the encapsulated layer covered with packaging LED chips on the encapsulating table.
Preferably, the conducting strip is shaped as L-type or rectangle.
Preferably, the encapsulating table is provided with the locating slot matched with the conducting strip, and the conducting strip is inlayed in positioning
Maintain an equal level in groove and with encapsulating table end face.
Preferably, the inside bending in the end of the conductive pin and extend along base bottom.
It is furthermore preferred that the encapsulated layer is fluorescent colloid.
It is furthermore preferred that the pedestal is macromolecule non-conducting material part.
The beneficial effects of the invention are as follows：The SMD lamp beads of the present invention, four conducting strips are set on pedestal, and conducting strip is with two
It is individual be one group of symmetry arrangement on pedestal, be connected with LED chip between every group of two conducting strips, after being packaged into SMD lamp beads, can lead to
Cross and change the connected mode of conductive pin and external circuit and realize and go here and there and switch, required electricity during so as to change lamp bead normal work
Stream, voltage, structure are practical reliable.
Brief description of the drawings
Fig. 1 is the base construction schematic diagram in the embodiment of the present invention one；
Fig. 2 is the SMD lamp bead structure charts shown in the embodiment of the present invention one；
Fig. 3 is the SMD lamp bead structure charts shown in the embodiment of the present invention two.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Embodiment is closed, the present invention is described in detail.Specific embodiment described herein only to explain the present invention, is not used to
Limit the present invention.
Embodiment one：
As illustrated in fig. 1 and 2, the present embodiment provides a kind of new SMD lamp beads, including pedestal 1 and LED chip, the pedestal 1
It is provided with encapsulating table and is used for the conducting strip for connecting LED chip on encapsulating table, the encapsulating table is provided with four conductions
Piece, and each conducting strip extends to encapsulating table both sides external along the encapsulating table and forms conductive pin, the conducting strip from inside to outside
It is one group of symmetry arrangement on pedestal 1, being connected with LED chip, the encapsulating table overlying between every group of two conducting strips with two
The encapsulated layer 8 of packaging LED chips is stamped, wherein, encapsulated layer 8 is fluorescent colloid, and pedestal 1 is macromolecule non-conducting material part.
The conducting strip that the embodiment uses illustrates for L-type structure by taking Fig. 2 as an example, and conducting strip is divided into the first conducting strip
2nd, the second conducting strip 3, the 3rd conducting strip 4 and the 4th conducting strip 5, the first conducting strip 2 and the second conducting strip 3 are one group, and the 3rd leads
The electric conducting strip 5 of piece 4 and the 4th is another group, and the first LED chip 6 is connected between the first conducting strip 2 and the second conducting strip 3, the
Two LED chips 7 are connected between the 3rd conducting strip 4 and the 4th conducting strip 5, the first conductive pin 21 of the corresponding extraction of each conducting strip,
Second conductive pin 31, the 3rd conductive pin 41 and the 4th conductive pin 51, the inside bending in end of each conductive pin and along base
The extension of 1 bottom of seat.
In order that conducting strip encapsulation is more firm, encapsulating table is provided with the locating slot matched with the conducting strip, the conduction
Piece inlays to maintain an equal level in locating slot and with encapsulating table end face.
With reference to this example demonstrates that the method that the present invention goes here and there and changed：Conducting strip is divided to two groups by left and right, and every group all connects
Connect a LED chip and encapsulate, when the second conductive pin 31 is connected by external circuit with the 3rd conductive pin 41, the first conduction is drawn
When pin 21 is connected positive and negative electrode respectively with the 4th conductive pin 51, two LED chips are series connection；When the first conductive pin 21 and
Three conductive pins 41 are connected and connect positive pole, when the second conductive pin 31 is connected with the 4th conductive pin 51 and connects negative pole, two LED
Chip is parallel connection.So, though internal structure has been fixed after encapsulation, the LED lamp bead product after encapsulation can be with external circuit
The different modes that are connected with conductive pin realize string and switching, required electric current, voltage during so as to change lamp bead normal work.
Embodiment two：
As shown in figure 3, the difference of the embodiment and embodiment one is that conducting strip uses rectangular configuration, conducting strip is by up and down
It is divided to two groups, wherein, the first conducting strip 2 and the 3rd conducting strip 4 are one group, and the second conducting strip 3 and the 4th conducting strip 5 are another group,
First LED chip 6 is connected between the first conducting strip 2 and the 3rd conducting strip 4, and the second LED chip 7 is connected to the second conducting strip 3
And the 4th between conducting strip 5, series-parallel connected mode is identical with embodiment one.
When the second conductive pin 31 is connected by external circuit with the 3rd conductive pin 41, the first conductive pin 21 is led with the 4th
When electric pin 51 connects positive and negative electrode respectively, two LED chips are series connection；When the first conductive pin 21 and the second conductive pin 31
It is connected and connects positive pole, when the 3rd conductive pin 41 is connected with the 4th conductive pin 51 and connects negative pole, two LED chips is parallel connection.
The foregoing is only a preferred embodiment of the present invention, it is clear that the present invention can also have other similar combinations,
It is included within protection scope of the present invention.
Claims (6)
1. a kind of new SMD lamp beads, including pedestal and LED chip, it is characterised in that：The pedestal is provided with encapsulating table and set
In the conducting strip for being used to connect LED chip on encapsulating table, the encapsulating table is provided with four conducting strips, and each conducting strip is described in
Encapsulating table extends to encapsulating table both sides external and forms conductive pin from inside to outside, and the conducting strip is with two for one group of symmetry arrangement
In on pedestal, being connected with LED chip between every group of two conducting strips, the encapsulation covered with packaging LED chips on the encapsulating table
Layer.
2. SMD lamp beads according to claim 1, it is characterised in that：The conducting strip is shaped as L-type or rectangle.
3. SMD lamp beads according to claim 2, it is characterised in that：The encapsulating table is provided with and matched with the conducting strip
Locating slot, the conducting strip inlays to maintain an equal level in locating slot and with encapsulating table end face.
4. SMD lamp beads according to claim 1, it is characterised in that：The inside bending in end of the conductive pin and along base
The extension of seat bottom.
5. according to any described SMD lamp beads of claim 1-4, it is characterised in that：The encapsulated layer is fluorescent colloid.
6. SMD lamp beads according to claim 5, it is characterised in that：The pedestal is macromolecule non-conducting material part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710683471.0A CN107482108A (en) | 2017-08-10 | 2017-08-10 | A kind of new SMD lamp beads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710683471.0A CN107482108A (en) | 2017-08-10 | 2017-08-10 | A kind of new SMD lamp beads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107482108A true CN107482108A (en) | 2017-12-15 |
Family
ID=60599277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710683471.0A Pending CN107482108A (en) | 2017-08-10 | 2017-08-10 | A kind of new SMD lamp beads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107482108A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109654386A (en) * | 2018-08-21 | 2019-04-19 | 广东三彩实业有限公司 | A kind of new structural high-voltage LED light bar |
| CN109920902A (en) * | 2019-03-07 | 2019-06-21 | 深圳市华星光电半导体显示技术有限公司 | LED support, LED component and side entrance back module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412362A (en) * | 2011-10-22 | 2012-04-11 | 浙江英特来光电科技有限公司 | Full outdoor light-emitting diode (LED) lamp with lens |
| CN204558521U (en) * | 2015-04-10 | 2015-08-12 | 深圳市宇亮光电技术有限公司 | A kind of LED lamp bead |
| CN105591013A (en) * | 2016-03-25 | 2016-05-18 | 深圳市九洲光电科技有限公司 | SMD outer package type LED |
| CN205350874U (en) * | 2015-12-17 | 2016-06-29 | 深圳市万兴锐科技有限公司 | LED lamp pearl with waterproof function |
| CN205542880U (en) * | 2016-03-25 | 2016-08-31 | 深圳市九洲光电科技有限公司 | Outer packaged type LED of SMD |
| CN207165614U (en) * | 2017-08-10 | 2018-03-30 | 广东聚科照明股份有限公司 | A kind of new SMD lamp beads |
-
2017
- 2017-08-10 CN CN201710683471.0A patent/CN107482108A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412362A (en) * | 2011-10-22 | 2012-04-11 | 浙江英特来光电科技有限公司 | Full outdoor light-emitting diode (LED) lamp with lens |
| CN204558521U (en) * | 2015-04-10 | 2015-08-12 | 深圳市宇亮光电技术有限公司 | A kind of LED lamp bead |
| CN205350874U (en) * | 2015-12-17 | 2016-06-29 | 深圳市万兴锐科技有限公司 | LED lamp pearl with waterproof function |
| CN105591013A (en) * | 2016-03-25 | 2016-05-18 | 深圳市九洲光电科技有限公司 | SMD outer package type LED |
| CN205542880U (en) * | 2016-03-25 | 2016-08-31 | 深圳市九洲光电科技有限公司 | Outer packaged type LED of SMD |
| CN207165614U (en) * | 2017-08-10 | 2018-03-30 | 广东聚科照明股份有限公司 | A kind of new SMD lamp beads |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109654386A (en) * | 2018-08-21 | 2019-04-19 | 广东三彩实业有限公司 | A kind of new structural high-voltage LED light bar |
| CN109920902A (en) * | 2019-03-07 | 2019-06-21 | 深圳市华星光电半导体显示技术有限公司 | LED support, LED component and side entrance back module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171215 |