CN207165614U - A kind of new SMD lamp beads - Google Patents

A kind of new SMD lamp beads Download PDF

Info

Publication number
CN207165614U
CN207165614U CN201721000174.3U CN201721000174U CN207165614U CN 207165614 U CN207165614 U CN 207165614U CN 201721000174 U CN201721000174 U CN 201721000174U CN 207165614 U CN207165614 U CN 207165614U
Authority
CN
China
Prior art keywords
conducting strip
encapsulating table
lamp beads
pedestal
smd lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201721000174.3U
Other languages
Chinese (zh)
Inventor
王俊华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong LCLED Lighting Co Ltd
Original Assignee
Guangdong LCLED Lighting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong LCLED Lighting Co Ltd filed Critical Guangdong LCLED Lighting Co Ltd
Priority to CN201721000174.3U priority Critical patent/CN207165614U/en
Application granted granted Critical
Publication of CN207165614U publication Critical patent/CN207165614U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses a kind of new SMD lamp beads, including pedestal and LED chip, the pedestal is provided with encapsulating table and is used for the conducting strip for connecting LED chip on encapsulating table, the encapsulating table is provided with four conducting strips, and each conducting strip extends to encapsulating table both sides external along the encapsulating table and forms conductive pin from inside to outside, the conducting strip with two be one group of symmetry arrangement on pedestal, LED chip is connected between every group of two conducting strips, encapsulated layer covered with packaging LED chips on the encapsulating table, after being packaged into SMD lamp beads, can be by changing the connected mode realization string of conductive pin and external circuit and switching, required electric current during so as to change lamp bead normal work, voltage, structure is practical reliable.

Description

A kind of new SMD lamp beads
Technical field
SMD encapsulation LED technologies field is the utility model is related to, especially a kind of new lamp bead based on SMD encapsulation.
Background technology
SMD refers to surface mount device, and SMD paster LEDs are surface labeling LED.SMD pasters help to produce Efficiency improves, and distinct device application, is a kind of solid state semiconductor devices, electricity directly can be converted into light by it.LED branch Frame is the bottom susceptor of LED lamp bead before encapsulation, on the basis of LED support, chip is fixed, positive and negative electrode of burn-oning, It is once in package shape with packaging plastic again.Internal structure has been fixed after traditional SMDLED lamp beads encapsulation, i.e., can not change internal LED The connection in series-parallel relation of chip, have to lamp bead using one voltage, current specification unmodifiable scope, during use very big Limitation.
Utility model content
To solve the above, the utility model provides a kind of new SMD lamp beads, can remain to meet string simultaneously after packaging The demand of change, required electric current, voltage during so as to change lamp bead normal work.
The technical solution adopted in the utility model is:
A kind of new SMD lamp beads, including pedestal and LED chip, the pedestal are provided with encapsulating table and located at encapsulating tables The upper conducting strip for being used to connect LED chip, the encapsulating table are provided with four conducting strips, and each conducting strip along the encapsulating table by Extend to from inside to outside encapsulating table both sides external formed conductive pin, the conducting strip with two be one group of symmetry arrangement in pedestal On, it is connected with LED chip between every group of two conducting strips, the encapsulated layer covered with packaging LED chips on the encapsulating table.
Preferably, the conducting strip is shaped as L-type or rectangle.
Preferably, the encapsulating table is provided with the locating slot matched with the conducting strip, and the conducting strip is inlayed in positioning Maintain an equal level in groove and with encapsulating table end face.
Preferably, the inside bending in the end of the conductive pin and extend along base bottom.
It is furthermore preferred that the encapsulated layer is fluorescent colloid.
It is furthermore preferred that the pedestal is macromolecule non-conducting material part.
The beneficial effects of the utility model are:SMD lamp beads of the present utility model, four conducting strips are set on pedestal, led Electric piece with two be one group of symmetry arrangement on pedestal, be connected with LED chip between every group of two conducting strips, be packaged into SMD lamps , can be by changing the connected mode realization string of conductive pin and external circuit and switching, so as to change lamp bead normal work after pearl Shi Suoxu electric current, voltage, structure are practical reliable.
Brief description of the drawings
Fig. 1 is the base construction schematic diagram in the utility model embodiment one;
Fig. 2 is the SMD lamp bead structure charts shown in the utility model embodiment one;
Fig. 3 is the SMD lamp bead structure charts shown in the utility model embodiment two.
Embodiment
In order that technical problem to be solved in the utility model, technical scheme and beneficial effect are more clearly understood, with Under in conjunction with the embodiments, the utility model is described in detail.Specific embodiment described herein is only explaining this practicality It is new, it is not used to limit the utility model.
Embodiment one:
As illustrated in fig. 1 and 2, the present embodiment provides a kind of new SMD lamp beads, including pedestal 1 and LED chip, the pedestal 1 It is provided with encapsulating table and is used for the conducting strip for connecting LED chip on encapsulating table, the encapsulating table is provided with four conductions Piece, and each conducting strip extends to encapsulating table both sides external along the encapsulating table and forms conductive pin, the conducting strip from inside to outside It is one group of symmetry arrangement on pedestal 1, being connected with LED chip, the encapsulating table overlying between every group of two conducting strips with two The encapsulated layer 8 of packaging LED chips is stamped, wherein, encapsulated layer 8 is fluorescent colloid, and pedestal 1 is macromolecule non-conducting material part.
The conducting strip that the embodiment uses illustrates for L-type structure by taking Fig. 2 as an example, and conducting strip is divided into the first conducting strip 2nd, the second conducting strip 3, the 3rd conducting strip 4 and the 4th conducting strip 5, the first conducting strip 2 and the second conducting strip 3 are one group, and the 3rd leads The electric conducting strip 5 of piece 4 and the 4th is another group, and the first LED chip 6 is connected between the first conducting strip 2 and the second conducting strip 3, the Two LED chips 7 are connected between the 3rd conducting strip 4 and the 4th conducting strip 5, the first conductive pin 21 of the corresponding extraction of each conducting strip, Second conductive pin 31, the 3rd conductive pin 41 and the 4th conductive pin 51, the inside bending in end of each conductive pin and along base The extension of 1 bottom of seat.
In order that conducting strip encapsulation is more firm, encapsulating table is provided with the locating slot matched with the conducting strip, the conduction Piece inlays to maintain an equal level in locating slot and with encapsulating table end face.
With reference to this example demonstrates that the utility model string and the method changed:Conducting strip is divided to two groups, every group by left and right All connect a LED chip and encapsulate, when the second conductive pin 31 is connected by external circuit with the 3rd conductive pin 41, first leads When electric pin 21 is connected positive and negative electrode respectively with the 4th conductive pin 51, two LED chips are series connection;When the first conductive pin 21 It is connected with the 3rd conductive pin 41 and connects positive pole, when the second conductive pin 31 is connected with the 4th conductive pin 51 and connects negative pole, two Individual LED chip is parallel connection.So, though internal structure has been fixed after encapsulation, the LED lamp bead product after encapsulation can be with outside Different modes that circuit is connected with conductive pin realize string and switching, required electric current during so as to change lamp bead normal work, Voltage.
Embodiment two:
As shown in figure 3, the difference of the embodiment and embodiment one is that conducting strip uses rectangular configuration, conducting strip is by up and down It is divided to two groups, wherein, the first conducting strip 2 and the 3rd conducting strip 4 are one group, and the second conducting strip 3 and the 4th conducting strip 5 are another group, First LED chip 6 is connected between the first conducting strip 2 and the 3rd conducting strip 4, and the second LED chip 7 is connected to the second conducting strip 3 And the 4th between conducting strip 5, series-parallel connected mode is identical with embodiment one.
When the second conductive pin 31 is connected by external circuit with the 3rd conductive pin 41, the first conductive pin 21 is led with the 4th When electric pin 51 connects positive and negative electrode respectively, two LED chips are series connection;When the first conductive pin 21 and the second conductive pin 31 It is connected and connects positive pole, when the 3rd conductive pin 41 is connected with the 4th conductive pin 51 and connects negative pole, two LED chips is parallel connection.
It is described above, preferred embodiment only of the present utility model, it is clear that the utility model can also have other classes Like combination, it is included within the scope of protection of the utility model.

Claims (6)

1. a kind of new SMD lamp beads, including pedestal and LED chip, it is characterised in that:The pedestal is provided with encapsulating table and set In the conducting strip for being used to connect LED chip on encapsulating table, the encapsulating table is provided with four conducting strips, and each conducting strip is described in Encapsulating table extends to encapsulating table both sides external and forms conductive pin from inside to outside, and the conducting strip is with two for one group of symmetry arrangement In on pedestal, being connected with LED chip between every group of two conducting strips, the encapsulation covered with packaging LED chips on the encapsulating table Layer.
2. SMD lamp beads according to claim 1, it is characterised in that:The conducting strip is shaped as L-type or rectangle.
3. SMD lamp beads according to claim 2, it is characterised in that:The encapsulating table is provided with and matched with the conducting strip Locating slot, the conducting strip inlays to maintain an equal level in locating slot and with encapsulating table end face.
4. SMD lamp beads according to claim 1, it is characterised in that:The inside bending in end of the conductive pin and along base The extension of seat bottom.
5. according to any described SMD lamp beads of claim 1-4, it is characterised in that:The encapsulated layer is fluorescent colloid.
6. SMD lamp beads according to claim 5, it is characterised in that:The pedestal is macromolecule non-conducting material part.
CN201721000174.3U 2017-08-10 2017-08-10 A kind of new SMD lamp beads Active CN207165614U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721000174.3U CN207165614U (en) 2017-08-10 2017-08-10 A kind of new SMD lamp beads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721000174.3U CN207165614U (en) 2017-08-10 2017-08-10 A kind of new SMD lamp beads

Publications (1)

Publication Number Publication Date
CN207165614U true CN207165614U (en) 2018-03-30

Family

ID=61715862

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721000174.3U Active CN207165614U (en) 2017-08-10 2017-08-10 A kind of new SMD lamp beads

Country Status (1)

Country Link
CN (1) CN207165614U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107482108A (en) * 2017-08-10 2017-12-15 广东聚科照明股份有限公司 A kind of new SMD lamp beads

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107482108A (en) * 2017-08-10 2017-12-15 广东聚科照明股份有限公司 A kind of new SMD lamp beads

Similar Documents

Publication Publication Date Title
CN104282676A (en) Integrated LED lamp panel packaging structure and technology
CN101958387A (en) Novel LED light resource module packaging structure
CN107482108A (en) A kind of new SMD lamp beads
CN207165614U (en) A kind of new SMD lamp beads
CN207165613U (en) A kind of SMD patch supports
CN209196572U (en) A kind of new structural high-voltage LED light bar
CN203812914U (en) LED illumination large chip
CN107482107A (en) A kind of SMD patch supports
CN211208444U (en) Novel packaging structure of RGB product
CN205028918U (en) LED support and LED packaging body
CN203607403U (en) High-voltage LED integration packaging light source and high-voltage LED light fixture
CN201758139U (en) Novel LED light source module packaging structure
CN203810156U (en) LED light machine module with horizontally arranged large chips
CN104124320B (en) Light emitting diode
CN201884982U (en) Novel LED (light-emitting diode) light source module encapsulation structure
CN207038551U (en) A kind of radiator and chip integrative packaging light-source structure
CN202695440U (en) Led integrated light source
CN207909874U (en) A kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED
CN203260633U (en) LED package structure requiring no welding line
CN201887044U (en) Encapsulating structure for LED light source module
CN202140813U (en) Integrally-packaged LED (light emitting diode) light source
CN202678310U (en) A large-power LED integrated array lighting source based on COB technology
CN201448717U (en) Locomotive car LED vehicle lamp with integrated package
CN206340541U (en) A kind of specular removal AC LED white light lamp beads
CN205859624U (en) Photo engine LED filament

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant