CN206340541U - A kind of specular removal AC LED white light lamp beads - Google Patents

A kind of specular removal AC LED white light lamp beads Download PDF

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Publication number
CN206340541U
CN206340541U CN201621481140.6U CN201621481140U CN206340541U CN 206340541 U CN206340541 U CN 206340541U CN 201621481140 U CN201621481140 U CN 201621481140U CN 206340541 U CN206340541 U CN 206340541U
Authority
CN
China
Prior art keywords
chip
lamp bead
gold thread
white light
specular removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621481140.6U
Other languages
Chinese (zh)
Inventor
郭畅
陈智
郭浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Lipu Photoelectric Co Ltd
Original Assignee
Huizhou Lipu Photoelectric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Lipu Photoelectric Co Ltd filed Critical Huizhou Lipu Photoelectric Co Ltd
Priority to CN201621481140.6U priority Critical patent/CN206340541U/en
Application granted granted Critical
Publication of CN206340541U publication Critical patent/CN206340541U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48095Kinked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements

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  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

The utility model discloses a kind of specular removal AC LED white light lamp beads, including overcoat support and substrate holder, it is enclosed within outside the overcoat support on substrate holder, lamp bead electrode described in lamp bead electrode is installed in the groove of the overcoat support to be connected with chip one and chip two by gold thread, the lower section of the chip one and chip two is provided with die bond, the die bond is arranged in chip placing groove, the chip placing groove is arranged on substrate holder, optical lens is installed above the overcoat support, the inner side of the optical lens is filled with filling glue, the upper surface of the chip one and chip two, which is applied, is formed with fluorescent material.The utility model is by being mounted side by side two alternate chips of gold thread both positive and negative polarity, current cycle is also made full use of while reduction voltage, so that single lamp bead is not with the stroboscopic phenomenon of current cycle, lift the overall light efficiency of lamp bead, by studying the thickness that fluorescent material is smeared, so that the light efficiency of LED lamp bead reaches more than 160LM/W, colour rendering index reaches more than 80.

Description

A kind of specular removal AC-LED white light lamp beads
Technical field
The utility model is related to specular removal AC-LED white light lamp bead equipment technical fields, specially a kind of specular removal AC-LED White light lamp bead.
Background technology
LED full name are semiconductor light-emitting-diode, are made of semi-conducting material, directly to convert electrical energy into light Can, electricity number is converted into the luminescent device of optical signal, and the lamp decoration product using LED as light source necessarily replaces white in the future of 21 century Knit lamp, as the mankind illuminate again revolution, LED lamp bead the overwhelming majority using one single chips as light source, light efficiency it is relatively low and More fix, it is known that LED lamp bead is used in alternating current, normal work is the positive half cycle of electric current, and this is for one single chip Lamp bead luminance have a certain impact, and because fluorescent material affects light efficiency and the colour developing of lamp bead with when thickness always, Produced in LED lamp bead use it is substantial amounts of heat and electrostatic problem, all affect its service life by.
Utility model content
The purpose of this utility model is to provide a kind of specular removal AC-LED white light lamp beads, to solve in above-mentioned background technology The LED lamp bead overwhelming majority of proposition uses the problems such as one single chip is as light source.
To achieve the above object, the utility model provides following technical scheme:A kind of specular removal AC-LED white light lamp beads, bag Include and be enclosed within outside overcoat support and substrate holder, the overcoat support on substrate holder, is provided with the groove of the overcoat support Lamp bead electrode described in lamp bead electrode is connected by gold thread with chip one and chip two, and the lower section of the chip one and chip two is installed There is die bond, the die bond is arranged in chip placing groove, and the chip placing groove is arranged on substrate holder, the overcoat support Top optical lens is installed, the inner side of the optical lens is filled with filling glue, the upper table of the chip one and chip two Face applies and is formed with fluorescent material.
It is preferred that, the fluorescent material by yellow fluophor layer and red-emitting phosphors layer constitute, the yellow fluophor layer and The thickness ratio of red-emitting phosphors layer is 7:3.
It is preferred that, the chip one and chip two are mounted side by side, and the gold thread is by chip positive pole gold thread and chip negative pole gold Line is constituted, and chip positive pole gold thread and chip the negative pole gold thread is alternately connected on lamp bead electrode.
It is preferred that, it is provided with antistatic backing above the lamp bead electrode.
It is preferred that, the bottom of the substrate holder is embedded with heat transfer device.
Compared with prior art, the beneficial effects of the utility model are:The utility model is by being mounted side by side two gold threads The alternate chip of both positive and negative polarity, current cycle is also made full use of while reduction voltage so that single lamp bead is not with electric current week The stroboscopic phenomenon of phase, the overall light efficiency of lifting lamp bead, by studying the thickness that fluorescent material is smeared so that the light of LED lamp bead Effect reaches more than 160LM/W, and colour rendering index reaches more than 80, and sets about from spot gluing equipment, improves dispensing needle head aperture, enhancing Dispensing board air pressure and sealing stability so that multiple gel quantity error is reached within 0.0005G, by lamp bead electrode Side sets antistatic backing, and effective minimizing electrostatic damage phenomenon preferably plays conductive force, the lamp using embedded heat transfer device Pearl is rational in infrastructure, overall specular removal, is worth of widely use.
Brief description of the drawings
Fig. 1 is a kind of overlooking the structure diagram of specular removal AC-LED white light lamp beads of the utility model;
Fig. 2 is a kind of cross section structure schematic diagram of specular removal AC-LED white light lamp beads of the utility model.
In figure:1- overcoats support, 2- chip positive poles gold thread, 3- optical lenses, 4- lamp beads electrode, 5- fluorescent material, 6- chips Resettlement groove, 7- chips one, 8- die bonds, 9- chips two, 10- chip negative poles gold thread, 11- fillings glue, 12- gold threads, 13- antistatics Layer, 14- heat transfer devices, 15- substrate holders.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.
Refer to Fig. 1-2, a kind of embodiment that the utility model is provided:A kind of specular removal AC-LED white light lamp beads, including It is enclosed within outside overcoat support 1 and substrate holder 15, overcoat support 1 on substrate holder 15, lamp bead is installed in the groove of overcoat support 1 The lamp bead electrode 4 of electrode 4 is connected by gold thread 12 with chip 1 and chip 29, and the lower section of chip 1 and chip 29 is provided with admittedly Crystalline substance 8, die bond 8 is arranged in chip placing groove 6, and chip placing groove 6 is arranged on substrate holder 15, the top peace of overcoat support 1 Equipped with optical lens 3, the inner side of optical lens 3, which is filled with, fills glue 11, and the upper surface of chip 1 and chip 29, which is applied, to be formed with Fluorescent material 5.
Fluorescent material 5 by yellow fluophor layer and red-emitting phosphors layer constitute, yellow fluophor layer and red-emitting phosphors layer Thickness ratio is 7:3 so that the light efficiency of LED lamp bead reaches more than 160LM/W, colour rendering index reaches more than 80.
Chip 1 and chip 29 are mounted side by side, and gold thread 12 is made up of chip positive pole gold thread 2 and chip negative pole gold thread 10, core Piece positive pole gold thread 2 and chip negative pole gold thread 10 are alternately connected on lamp bead electrode 4 so that single lamp bead is not with current cycle Stroboscopic phenomenon, the overall light efficiency of lifting lamp bead.
The top of lamp bead electrode 4 is provided with antistatic backing 13, minimizing electrostatic damage phenomenon.
The bottom of substrate holder 15 is embedded with heat transfer device 14, effectively raises heat dispersion.
Specifically used mode:In utility model works, the contact surface that each component is connected is in dispensing, and passing through improves Dispensing is carried out on dispensing needle head aperture and enhancing dispensing board air pressure and the datum mark of sealing stability, multiple gel quantity is reached Error is welded within 0.0005G by lamp bead electrode, after energization, chip 1 and chip 29 as light source luminescent, then Make it that light source discoloration is white by fluorescent material 5, by antistatic backing 13 when reassembling, minimizing electrostatic damage phenomenon, by embedding Enter formula heat transfer device 14 and play more preferable conductive force.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation Involved claim.

Claims (5)

1. a kind of specular removal AC-LED white light lamp beads, including overcoat support (1) and substrate holder (15), it is characterised in that:It is described It is enclosed within outside overcoat support (1) on substrate holder (15), lamp bead electrode (4) is installed described in the groove of the overcoat support (1) Lamp bead electrode (4) is connected by gold thread (12) with chip one (7) and chip two (9), the chip one (7) and chip two (9) Lower section is provided with die bond (8), and the die bond (8) is arranged in chip placing groove (6), and the chip placing groove (6) is arranged on base On board mount (15), optical lens (3), the inner side filling of the optical lens (3) are installed above the overcoat support (1) There is filling glue (11), the upper surface of the chip one (7) and chip two (9), which is applied, is formed with fluorescent material (5).
2. a kind of specular removal AC-LED white light lamp beads according to claim 1, it is characterised in that:The fluorescent material (5) by Yellow fluophor layer and red-emitting phosphors layer are constituted, and the thickness ratio of yellow fluophor layer and the red-emitting phosphors layer is 7:3.
3. a kind of specular removal AC-LED white light lamp beads according to claim 1, it is characterised in that:The chip one (7) and Chip two (9) is mounted side by side, and the gold thread (12) is made up of chip positive pole gold thread (2) and chip negative pole gold thread (10), the core Piece positive pole gold thread (2) and chip negative pole gold thread (10) are alternately connected on lamp bead electrode (4).
4. a kind of specular removal AC-LED white light lamp beads according to claim 1, it is characterised in that:The lamp bead electrode (4) Top be provided with antistatic backing (13).
5. a kind of specular removal AC-LED white light lamp beads according to claim 1, it is characterised in that:The substrate holder (15) Bottom be embedded with heat transfer device (14).
CN201621481140.6U 2016-12-30 2016-12-30 A kind of specular removal AC LED white light lamp beads Expired - Fee Related CN206340541U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621481140.6U CN206340541U (en) 2016-12-30 2016-12-30 A kind of specular removal AC LED white light lamp beads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621481140.6U CN206340541U (en) 2016-12-30 2016-12-30 A kind of specular removal AC LED white light lamp beads

Publications (1)

Publication Number Publication Date
CN206340541U true CN206340541U (en) 2017-07-18

Family

ID=59303606

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621481140.6U Expired - Fee Related CN206340541U (en) 2016-12-30 2016-12-30 A kind of specular removal AC LED white light lamp beads

Country Status (1)

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CN (1) CN206340541U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111370551A (en) * 2018-12-25 2020-07-03 亿光电子(中国)有限公司 Light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111370551A (en) * 2018-12-25 2020-07-03 亿光电子(中国)有限公司 Light emitting device

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170718

Termination date: 20191230

CF01 Termination of patent right due to non-payment of annual fee