CN107482107A - A kind of SMD patch supports - Google Patents
A kind of SMD patch supports Download PDFInfo
- Publication number
- CN107482107A CN107482107A CN201710680731.9A CN201710680731A CN107482107A CN 107482107 A CN107482107 A CN 107482107A CN 201710680731 A CN201710680731 A CN 201710680731A CN 107482107 A CN107482107 A CN 107482107A
- Authority
- CN
- China
- Prior art keywords
- conducting strip
- encapsulating table
- smd
- encapsulating
- plastic base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003023 plastic Polymers 0.000 claims abstract description 14
- 239000004033 plastic Substances 0.000 claims abstract description 14
- 238000005452 bending Methods 0.000 claims description 2
- 239000011324 bead Substances 0.000 abstract description 10
- 238000005538 encapsulation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a kind of SMD patch supports, including plastic base, the plastic base is provided with encapsulating table and is used for the conducting strip for connecting LED chip on encapsulating table, the encapsulating table is provided with four conducting strips, and each conducting strip extends to encapsulating table both sides external along the encapsulating table and forms conductive pin from inside to outside, the encapsulating table is provided with the locating slot matched with the conducting strip, the conducting strip inlays to maintain an equal level in locating slot and with encapsulating table end face, the SMD patch supports are simple and practical, and after being packaged into SMD lamp beads, can be by changing the connected mode realization string of conductive pin and external circuit and switching, required electric current during so as to change lamp bead normal work, voltage.
Description
Technical field
The present invention relates to SMD encapsulation technologies field, more particularly to a kind of SMD patch supports.
Background technology
SMD refers to surface mount device, and SMD paster LEDs are surface labeling LED.SMD pasters help to produce
Efficiency improves, and distinct device application, is a kind of solid state semiconductor devices, electricity directly can be converted into light by it.LED branch
Frame is the bottom susceptor of LED lamp bead before encapsulation, on the basis of LED support, chip is fixed, positive and negative electrode of burn-oning,
It is once in package shape with packaging plastic again.Traditional SMDLED lamp beads generally set encapsulation cavity, and structural stability is poor, for a long time
Influence conductive region using easy, and internal structure has been fixed after encapsulating, i.e., serial or parallel connection to lamp bead using voltage,
One unmodifiable scope of current specification, there is significant limitation during use.
The content of the invention
To solve the above, the present invention provides a kind of reliable SMD patch supports of Stability Analysis of Structures, can after packaging still
Can meet string and the needs of change, required electric current, voltage during so as to change lamp bead normal work.
The technical solution adopted by the present invention is：
A kind of SMD patch supports, including plastic base, the plastic base are provided with encapsulating table and on encapsulating tables
For connecting the conducting strip of LED chip, the encapsulating table is provided with four conducting strips, and each conducting strip along the encapsulating table by interior
Extend out to encapsulating table both sides external and form conductive pin, the encapsulating table is provided with the positioning matched with the conducting strip
Groove, the conducting strip inlays to maintain an equal level in locating slot and with encapsulating table end face.
Preferably, the conducting strip is shaped as L-type or rectangle.
Preferably, the conducting strip with two be one group of symmetry arrangement on plastic base.
Preferably, the inside bending in the end of the conductive pin and along plastic base bottom extend.
The beneficial effects of the invention are as follows：The SMD patch supports of the present invention, conducting strip is inlayed on encapsulating table, structure is simple
It is single practical, and after being packaged into SMD lamp beads, it can be realized by changing the connected mode of conductive pin and external circuit and go here and there and switch,
Required electric current, voltage during so as to change lamp bead normal work.
Brief description of the drawings
Fig. 1 is the SMD patch support structure charts shown in the embodiment of the present invention one；
Fig. 2 is the SMD patch support structure charts shown in the embodiment of the present invention two.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Embodiment is closed, the present invention is described in detail.Specific embodiment described herein only to explain the present invention, is not used to
Limit the present invention.
Embodiment one：
As shown in figure 1, present embodiments provide a kind of SMD patch supports, including plastic base 1, on the plastic base 1
It is used for the conducting strip for connecting LED chip provided with encapsulating table and on encapsulating table, the encapsulating table is provided with four conducting strips,
And each conducting strip extends to encapsulating table both sides external along the encapsulating table and forms conductive pin from inside to outside, is set on the encapsulating table
There is the locating slot matched with the conducting strip, the conducting strip inlays to maintain an equal level in locating slot and with encapsulating table end face, plastics base
Seat 1 is macromolecule non-conducting material part.
The conducting strip that the embodiment uses illustrates for rectangle by taking Fig. 1 as an example, and conducting strip is divided into the first conducting strip 2,
Two conducting strips 3, the 3rd conducting strip 4 and the 4th conducting strip 5, the first conducting strip 2 and the 3rd conducting strip 4 are one group, the second conducting strip 3
Be another group with the 4th conducting strip 5, i.e. the first LED chip 6 is connected between the first conducting strip 2 and the 3rd conducting strip 4, and second
LED chip 7 is connected between the second conducting strip 3 and the 4th conducting strip 5, and each conducting strip is corresponding to draw the first conductive pin 21, the
Two conductive pins 31, the 3rd conductive pin 41 and the 4th conductive pin 51.
With reference to this example demonstrates that the method that the present invention goes here and there and changed：By being divided to two groups up and down, every group all connects conducting strip
Connect a LED chip and encapsulate, when the second conductive pin 31 is connected by external circuit with the 3rd conductive pin 41, the first conduction is drawn
When pin 21 is connected positive and negative electrode respectively with the 4th conductive pin 51, two LED chips are series connection；When the first conductive pin 21 and
Two conductive pins 31 are connected and connect positive pole, when the 3rd conductive pin 41 is connected with the 4th conductive pin 51 and connects negative pole, two LED
Chip is parallel connection.So, though internal structure has been fixed after encapsulation, the LED lamp bead product after encapsulation can be with external circuit
The different modes that are connected with conductive pin realize string and switching, required electric current, voltage during so as to change lamp bead normal work.
Embodiment two：
As shown in Fig. 2 the difference of the embodiment and embodiment one is that conducting strip uses L-type structure, wherein, first is conductive
The L-type bottom of the conducting strip 3 of piece 2 and second is relative and is divided into one group, the L-type bottom phase of the 3rd conducting strip 4 and the 4th conducting strip 5
Pair and be divided into another group, the first LED chip 6 is connected to the bottom position between the first conducting strip 2 and the second conducting strip 3,
Two LED chips 7 are connected to the bottom position between the second conducting strip 3 and the 4th conducting strip 5.Series-parallel connected mode is with implementing
Example one is identical.
The foregoing is only a preferred embodiment of the present invention, it is clear that the present invention can also have other similar combinations,
It is included within protection scope of the present invention.
Claims (4)
1. a kind of SMD patch supports, including plastic base, the plastic base is provided with encapsulating table and used on encapsulating table
In the conducting strip of connection LED chip, it is characterised in that：The encapsulating table is provided with four conducting strips, and each conducting strip is described in
Encapsulating table extends to encapsulating table both sides external and forms conductive pin from inside to outside, and the encapsulating table is provided with and the conducting strip
The locating slot matched somebody with somebody, the conducting strip inlays to maintain an equal level in locating slot and with encapsulating table end face.
2. SMD patch supports according to claim 1, it is characterised in that：The conducting strip is shaped as L-type or rectangle.
3. SMD patch supports according to claim 1 or 2, it is characterised in that：The conducting strip is one group symmetrical with two
It is arranged on plastic base.
4. SMD patch supports according to claim 1, it is characterised in that：The inside bending in end of the conductive pin is simultaneously
Extend along plastic base bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710680731.9A CN107482107A (en) | 2017-08-10 | 2017-08-10 | A kind of SMD patch supports |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710680731.9A CN107482107A (en) | 2017-08-10 | 2017-08-10 | A kind of SMD patch supports |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107482107A true CN107482107A (en) | 2017-12-15 |
Family
ID=60600070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710680731.9A Pending CN107482107A (en) | 2017-08-10 | 2017-08-10 | A kind of SMD patch supports |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107482107A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109654386A (en) * | 2018-08-21 | 2019-04-19 | 广东三彩实业有限公司 | A kind of new structural high-voltage LED light bar |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201975417U (en) * | 2010-11-24 | 2011-09-14 | 苏州泰嘉电子有限公司 | Full color SMD light emitting diode support |
| CN202120979U (en) * | 2011-05-12 | 2012-01-18 | 苏州泰嘉电子有限公司 | Full color SMD support improved structure |
| CN203300697U (en) * | 2013-06-19 | 2013-11-20 | 苏州信亚科技有限公司 | Moisture-proof LED support |
| CN205050868U (en) * | 2015-10-12 | 2016-02-24 | 深圳市艾佳利照明电器有限公司 | Multi -functional integrate LED lamp support |
| CN205350874U (en) * | 2015-12-17 | 2016-06-29 | 深圳市万兴锐科技有限公司 | LED lamp pearl with waterproof function |
| CN205542880U (en) * | 2016-03-25 | 2016-08-31 | 深圳市九洲光电科技有限公司 | Outer packaged type LED of SMD |
| CN207165613U (en) * | 2017-08-10 | 2018-03-30 | 广东聚科照明股份有限公司 | A kind of SMD patch supports |
-
2017
- 2017-08-10 CN CN201710680731.9A patent/CN107482107A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201975417U (en) * | 2010-11-24 | 2011-09-14 | 苏州泰嘉电子有限公司 | Full color SMD light emitting diode support |
| CN202120979U (en) * | 2011-05-12 | 2012-01-18 | 苏州泰嘉电子有限公司 | Full color SMD support improved structure |
| CN203300697U (en) * | 2013-06-19 | 2013-11-20 | 苏州信亚科技有限公司 | Moisture-proof LED support |
| CN205050868U (en) * | 2015-10-12 | 2016-02-24 | 深圳市艾佳利照明电器有限公司 | Multi -functional integrate LED lamp support |
| CN205350874U (en) * | 2015-12-17 | 2016-06-29 | 深圳市万兴锐科技有限公司 | LED lamp pearl with waterproof function |
| CN205542880U (en) * | 2016-03-25 | 2016-08-31 | 深圳市九洲光电科技有限公司 | Outer packaged type LED of SMD |
| CN207165613U (en) * | 2017-08-10 | 2018-03-30 | 广东聚科照明股份有限公司 | A kind of SMD patch supports |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109654386A (en) * | 2018-08-21 | 2019-04-19 | 广东三彩实业有限公司 | A kind of new structural high-voltage LED light bar |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171215 |
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| RJ01 | Rejection of invention patent application after publication |