CN204088298U - A kind of New type of S OP-8L encapsulating lead - Google Patents
A kind of New type of S OP-8L encapsulating lead Download PDFInfo
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- CN204088298U CN204088298U CN201420420838.1U CN201420420838U CN204088298U CN 204088298 U CN204088298 U CN 204088298U CN 201420420838 U CN201420420838 U CN 201420420838U CN 204088298 U CN204088298 U CN 204088298U
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Abstract
The utility model discloses a kind of New type of S OP-8L encapsulating lead, comprise eight outer pins, eight interior pins, first carrier and Second support, describedly pin is provided with lock hole in each, described first carrier is provided with two half slots towards the side marginating compartment of Second support, first carrier lower edge is provided with an oval groove, described Second support is provided with an oval groove towards a lateral edges of the first carrier, Second support lower edge is arranged at intervals with two oval grooves, and described first carrier area is less than Second support, so, the combination between the two of the utility model SOP-8L encapsulating lead and plastic packaging material is tightr, package reliability is high, small one and large one two carrier makes the utility model can be applicable to the chip of multiple different size.
Description
Technical field
The utility model relates to integrated antenna package technical field, particularly relates to a kind of New type of S OP-8L encapsulating lead.
Background technology
Lead frame is as the chip carrier of integrated circuit, a kind of realize the electrical connection of chip internal circuits exit and outer lead by means of bonding material (as spun gold, aluminium wire, copper wire) thus form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, simultaneously also for integrated circuit provides heat radiation, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.
The process of encapsulation is electrical connection on the one hand, is form protection to chip on the one hand.Protection mainly uses plastic packaging material by chip, framework parcel wherein; between material, cooperation can cause interfacial failure because of the factor such as material behavior, structure; generally be referred to as " layering "; and framework, plastic packaging material are as main encapsulating material, cooperation is between the two the direction of package reliability research always.
SOP-8L packing forms is mainly used in LED power driving aspect, and the input of LED drive power comprises high pressure industrial frequency AC (i.e. civil power), low-voltage direct, high voltage direct current, low-voltage high-frequency interchange (output as electronic transformer) etc.Such applied environment causes encapsulation to have high requirement to heat radiation, and also require that SOP-8L encapsulates needs high reliability simultaneously.
Tradition SOP-8L lead frame comprises eight outer pins, eight interior pins and two carriers for carries chips, and traditional framework encapsulation is unreliable, and framework and plastic packaging material adhesion are large not, easily form layering between the two; In addition, two carrier areas are equally large, thus adapt to chip size narrow range, because some chip is comparatively large, carrier is little, fails to lay down.
Utility model content
The purpose of this utility model is to provide a kind of New type of S OP-8L encapsulating lead, and its package reliability is high, and it is wide to adapt to chip size scope.
For achieving the above object, the technical scheme that the utility model adopts is:
A kind of New type of S OP-8L encapsulating lead, comprises eight outer pins, eight interior pins, the first carriers
And Second support, describedly pin is provided with lock hole in each, described first carrier is provided with two half slots towards the side marginating compartment of Second support, first carrier lower edge is provided with an oval groove, described Second support is provided with an oval groove towards a lateral edges of the first carrier, Second support lower edge is arranged at intervals with two oval grooves, and described first carrier area is less than Second support.
The beneficial effects of the utility model are: arranging of described half slot, oval groove and lock hole can make the utility model SOP-8L lead frame and plastic packaging material adhesion between the two larger, thus can prevent from occurring layering between the two, thus the utility model package reliability is high; In addition, small one and large one two carrier makes the utility model can be applicable to the chip of multiple different size.
Accompanying drawing explanation
Fig. 1 is the utility model SOP-8L encapsulating lead schematic diagram.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, the SOP-8L encapsulating lead that the utility model package reliability is high comprises eight outer pins 1, eight interior pins 2, first carrier 3 and Second support 4, describedly pin 2 is provided with lock hole 5 in each, described first carrier 3 is provided with two half slots 6 towards the side marginating compartment of Second support 4, first carrier 3 lower edge is provided with an oval groove 7, described Second support 4 is provided with an oval groove 8 towards a lateral edges of the first carrier 3, Second support 4 lower edge is arranged at intervals with two oval grooves 9, and described first carrier 3 area is less than Second support 4.
In the present embodiment, described interior pin 2 arranges lock hole 5, during encapsulation, plastic packaging material flows through and passes through this lock hole 5, thus be equivalent to arrange the pin that a plastic packaging material makes, so, interior pin 2 can be made to be locked in firmly in plastic packaging material, thus improve the anti-dilatory ability of interior pin 2, be also the adhesion of pin 2 and plastic packaging material in improving; Described first carrier 3 edge arranges half slot 6, can improve the mobility of plastic packaging material in mold cavity, strengthens the combination of plastic packaging material and the first carrier 3; Described two carrier 3,4 edges arrange oval groove 7,8,9, and the combination of two carriers 3,4 and plastic packaging material can be made more firm, thus locking two movements of carrier 3,4 in plastic packaging material, prevent two carrier 3,4 and plastic packaging material layerings.Design in sum, the utility model SOP-8L encapsulating lead and plastic packaging material adhesion between the two can be made larger, can prevent from occurring layering between the two, thus the utility model package reliability is high.
In the present embodiment, two carrier areas are set to greatly different, thus the larger Second support 4 of area can carry larger-size chip, the chip that size is less can carry down more, thus the utility model SOP-8L package leadframe can adapt to the chip of multiple different size, namely adapt to chip size scope wide; And larger vector can bring better radiating condition, just in time meet the radiating requirements of large chip, thus good heat dissipation.
In the present embodiment, preferably, the oblique line on described two carriers 3,4 and interior pin 2 represents and is provided with silver coating, compare the silver coating of traditional design, the utility model changes silver coating position, and decreases silver coating area, so, current process requirements can be adapted on the one hand, on the other hand, because silvered face smoother, plastic packaging material with it in conjunction with time, easily there is the situation such as layering, stripping in faying face, thus also can improve anti-vertical resolution after reducing silver-plated area.
Claims (1)
1. a New type of S OP-8L encapsulating lead, comprise eight outer pins, eight interior pins, the first carrier and Second supports, it is characterized in that: describedly pin is provided with lock hole in each, described first carrier is provided with two half slots towards the side marginating compartment of Second support, first carrier lower edge is provided with an oval groove, described Second support is provided with an oval groove towards a lateral edges of the first carrier, Second support lower edge is arranged at intervals with two oval grooves, and described first carrier area is less than Second support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420838.1U CN204088298U (en) | 2014-07-29 | 2014-07-29 | A kind of New type of S OP-8L encapsulating lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420838.1U CN204088298U (en) | 2014-07-29 | 2014-07-29 | A kind of New type of S OP-8L encapsulating lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204088298U true CN204088298U (en) | 2015-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420420838.1U Active CN204088298U (en) | 2014-07-29 | 2014-07-29 | A kind of New type of S OP-8L encapsulating lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204088298U (en) |
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2014
- 2014-07-29 CN CN201420420838.1U patent/CN204088298U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |