CN107785345A - Lead frame, array of lead frames and packaging body - Google Patents
Lead frame, array of lead frames and packaging body Download PDFInfo
- Publication number
- CN107785345A CN107785345A CN201711145541.3A CN201711145541A CN107785345A CN 107785345 A CN107785345 A CN 107785345A CN 201711145541 A CN201711145541 A CN 201711145541A CN 107785345 A CN107785345 A CN 107785345A
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- pin
- type
- lead frame
- chip
- dao
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 48
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 210000003205 muscle Anatomy 0.000 claims description 8
- 238000005728 strengthening Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 102000005591 NIMA-Interacting Peptidylprolyl Isomerase Human genes 0.000 description 1
- 108010059419 NIMA-Interacting Peptidylprolyl Isomerase Proteins 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention provides a kind of lead frame, array of lead frames and packaging body, the lead frame includes a Ji Dao for being used to place an at least chip, at least one first kind pin being connected with Ji Dao and at least one Second Type pin that with chip metal lead wire can be used to be connected, the width of first kind pin is more than the width of Second Type pin, there is a long and narrow breach at the rib cutting of the one end of first kind pin away from the Ji Dao, first kind leads ends part is segmented into two parts by long and narrow breach, after lead frame is encapsulated by plastic-sealed body, what first kind pin had a long and narrow breach is partially protrude through plastic-sealed body.The invention has the advantages that, at the rib cutting of first kind pin, first kind pin is divided into two parts by the long and narrow breach, reduces stress of the first kind pin at rib cutting, solve the problem for being not easy Trim Molding, avoid the risk that the plastic-sealed body of packaging body secretly splits.
Description
Technical field
The present invention relates to field of semiconductor package, more particularly to a kind of lead frame, array of lead frames and packaging body.
Background technology
The ultrathin heat dissipation type high paster encapsulation of low cost is always the developing way of semiconductor packages, with chip technology skill
The progress of art, chip area is less and less, therefore packaging body is also because the change of chip area experienced big packaging body, large chip；
Big packaging body, small chip；Small package body, small chip these three developing stage, at the same also generate SOP, ESOP, DFN, QFN,
The encapsulated types such as SOT.
As country vigorously advocates environmental protection and energy saving, LED illumination industry is helped, LED illumination has welcome spring, LED driving skills
Art innovation is advanced by leaps and bounds, and LED chip area is less and less, and power is increasing, and the use environment increasingly limit, cooling requirements are got over
Come higher, market competition is increasingly fierce, and Cost Competition is especially prominent.The shortcomings that traditional paster encapsulated type is, some envelopes
Zhuan Tiji islands area is small, but thermal diffusivity is bad；The thermal diffusivity of some packaging bodies is good, but base island area is big, and chip area is small, returns
Have security risk after fluid welding, cost performance is not high, therefore, traditional paster encapsulated type can not meet packaging body it is low into
Originally, the ultrathin, requirement of high heat dispersion.
Therefore, the shortcomings that a kind of new array of lead frames and packaging body are to overcome existing product to exist is needed badly.
The content of the invention
The technical problem to be solved by the invention is to provide a kind of lead frame, array of lead frames and packaging body, its energy
Enough reduce the stress of first kind pin Trim Molding, while the risk that plastic-sealed body secretly splits can be avoided.
In order to solve the above problems, the invention provides a kind of lead frame, including one is used to place an at least chip
Ji Dao, at least one first kind pin being connected with the Ji Dao and at least one it can use metal lead wire with the chip
The Second Type pin of connection, the width of the first kind pin are more than the width of the Second Type pin, and described first
There is a long and narrow breach, the long and narrow breach draws the first kind at the rib cutting of the one end of type pins away from the Ji Dao
The end of pin is divided into two parts, and after the lead frame is encapsulated by plastic-sealed body, the first kind pin has described narrow
Long nick is partially protrude through the plastic-sealed body.
In one embodiment, the Ji Dao is included for the blank outside the chip region of chip placement and the chip region
Area, at least one locked mode hole is provided with the clear area, and the locked mode hole is used to strengthen the lead frame and plastic-sealed body
Adhesion.
In one embodiment, the locked mode hole is arranged on the side that the clear area is connected with the first kind pin
And/or it is arranged on the side that the clear area is not connected with the first kind pin.
In one embodiment, the first kind pin is separately positioned on the two of the Ji Dao with the Second Type pin
Side.
In one embodiment, with the first kind pin homonymy, also with one the 3rd type pins, the 3rd class
Type pin is connected with the Ji Dao, and the 3rd type pins are identical with the first kind pin function.
In one embodiment, with the first kind pin homonymy, or there are one the 3rd type pins, the described 3rd
Type pins can be connected with the chip using metal lead wire, and the 3rd type pins are with the Second Type pin
Functional leads.
In one embodiment, the width of the long and narrow breach is the 0.13~0.24 of the width of the first kind pin
Times.
The present invention also provides a kind of array of lead frames, including multiple above-mentioned lead frames, between multiple lead frames
Connect muscle by framework to connect, the one end of the first kind pin away from the Ji Dao connects muscle with the framework and is connected.
The present invention also provides a kind of packaging body, including lead frame described in a lead frame, at least a chip and plastic packaging and
The plastic-sealed body of the chip；The lead frame include Ji Dao, at least one first kind pin being connected with the Ji Dao and
At least one Second Type pin that with the chip metal lead wire can be used to be connected；The width of the first kind pin is big
In the width of the Second Type pin, the first kind pin has a long and narrow breach, and the long and narrow breach is by described
The end of one type pins is divided into two parts；The chip is arranged on the Ji Dao, the Second Type pin with it is described
Chip is connected by metal lead wire；The first kind pin has the part of the long and narrow breach and the Second Type pin
Protrude from the plastic-sealed body.
In one embodiment, the clear area outside chip region and the chip region of the Ji Dao including chip placement,
The clear area is provided with least one locked mode hole, and the plastic-sealed body fills the locked mode hole, and the locked mode hole is used to strengthen institute
State the adhesion of lead frame and the plastic-sealed body.
In one embodiment, the locked mode hole is arranged on the side that the clear area is connected with the first kind pin
And/or it is arranged on the side that the clear area is not connected with the first kind pin.
In one embodiment, the first kind pin is separately positioned on the two of the Ji Dao with the Second Type pin
Side.
In one embodiment, with the first kind pin homonymy, or there are one the 3rd type pins, the described 3rd
Type pins are connected with the Ji Dao, and the first kind pin and the 3rd type pins function phase are same.
In one embodiment, with the first kind pin homonymy, or there are one the 3rd type pins, the described 3rd
Type pins can be connected with the chip using metal lead wire, and the Second Type pin is with the 3rd type pins
Functional leads.
In one embodiment, the width of the long and narrow breach is the 0.13~0.24 of the width of the first kind pin
Times.
It is an advantage of the current invention that on the premise of first kind pin heat dispersion is ensured, first kind pin with
The junction that framework connects muscle sets long and narrow breach, and at the rib cutting of the first kind pin, the long and narrow breach is by the first kind
Type pin is divided into two parts, reduces stress of the first kind pin at rib cutting, solves the problem for being not easy Trim Molding,
Avoid the risk that plastic-sealed body secretly splits simultaneously.
Brief description of the drawings
Fig. 1 is the planar structure schematic diagram of lead frame first embodiment of the present invention；
Fig. 2 is the planar structure schematic diagram of lead frame second embodiment of the present invention；
Fig. 3 is the planar structure schematic diagram of lead frame 3rd embodiment of the present invention；
Fig. 4 is the planar structure schematic diagram of lead frame fourth embodiment of the present invention；
Fig. 5 is the structural representation of array of lead frames of the present invention；
Fig. 6 A are the overlooking the structure diagrams of the first embodiment of packaging body of the present invention；
Fig. 6 B are the side structure schematic views of the first embodiment of packaging body of the present invention；
Fig. 6 C are another structural representations of the first embodiment of packaging body of the present invention；
Fig. 7 is the structural representation of the second embodiment of packaging body of the present invention.
Embodiment
Below in conjunction with the accompanying drawings to the embodiment of lead frame provided by the invention, array of lead frames and packaging body
Elaborate.
Fig. 1 is the planar structure schematic diagram of lead frame first embodiment of the present invention.Shown in Figure 1, the present invention draws
Wire frame 10 can form an independent packaging body (being shown in chip 20 in Fig. 6 C) after plastic packaging, wherein lead frame 10
Packaging line 40 gone out using dotted line frame schematic indication.The lead frame 10 includes a base island 11, at least one first kind
Pin 12 and at least one Second Type pin 13.In the first embodiment, a first kind pin is schematically shown
12 and three Second Type pins 13, the first kind pin 12 is respectively arranged at the base with the Second Type pin 13
The both sides on island 11, in other embodiments, the first kind pin 12 and Second Type pin 13 are in a unlimited number, as long as meeting
The purpose of the present invention.
At least one chip can be placed on the surface on the base island 11.For multi-chip package, the table on the base island 11
Face can place two chips, even three chips, four chips.The first kind pin 12 is connected with the base island 11,
It is electrically connected as main the radiating pin and functional leads on the base island 11 with the external world.The Second Type pin 13 not with institute
Shu Ji islands 11 are directly connected to, and it can be connected with the chip being arranged on base island 11 using metal lead wire 21 (being shown in Fig. 6 C)
Connect, multiple Second Type pins 13 can connect the different chips being arranged on base island 11, the Second Type pin respectively
13 as follow-up packaging body functional leads with the external world electrically connect.In other embodiments, the first kind pin 12 with
The base island 11 or the chip being arranged on Ji Dao, it can also be connected using metal lead wire 21.
Wherein, the width of the first kind pin 12 is more than the width of the Second Type pin 13, the advantage is that,
The width of main radiating pin is added, improves the performance that the packaging body after plastic packaging is outwards radiated by pin.In the present invention,
The width of the width of the first kind pin 12 and the Second Type pin 13 refers to that after plastic packaging each pin protrudes
Width in the part of plastic-sealed body.
There is a long and narrow breach 14 at the rib cutting of the one end of the first kind pin 12 away from the base island 11.It is described narrow
The end of the first kind pin 12 is divided into two parts by long nick 14, is encapsulated in the lead frame 10 by plastic-sealed body
Afterwards, the plastic-sealed body 30 that is partially protrude through that the first kind pin 12 has the long and narrow breach 14 (is shown in Fig. 6 A
In).Refer to cutting the position of first kind pin 12 before packaging or after packaging at the rib cutting, as dotted line A is marked in Fig. 1
The position shown.Due to the wider width of the first kind pin 12, therefore, its stress is larger, in cutting step, is not easy to cut
It is disconnected, problem is brought to Trim Molding, and the risk for thering is plastic-sealed body secretly to split.In the present invention, the first kind pin 12 is remote
There is a long and narrow breach 14, the long and narrow breach 14 is by the first kind pin 12 1 at the rib cutting of the one end on the base island 11
It is divided into two so that the stress of the Trim Molding of the first kind pin 12 reduces, and solves the problem for being not easy Trim Molding, together
When it also avoid the risk that plastic-sealed body secretly splits.Preferably, the width of the long and narrow breach 14 is the first kind pin 12
0.13~0.24 times of width, for example, 0.15 times, 0.17 times, 0.20 times, 0.22 times etc., it the advantage is that, ensureing thermal diffusivity
On the premise of being basically unchanged, solve the problem of Trim Molding, while it also avoid the risk that plastic-sealed body secretly splits.
Further, in the present embodiment, with the homonymy of first kind pin 12, also with one the 3rd type pins
15.3rd type pins 15 are directly connected to the base island 11, and the 3rd type pins 15 are drawn with the first kind
The function phase of pin 12 is same, is radiating pin.In the present embodiment, the width of the 3rd type pins 15 is less than the first kind
The width of type pin 12, the stress of the 3rd type pins 15 do not interfere with Trim Molding, therefore in the 3rd type pins
On 15 and it is not provided with long and narrow breach.In other embodiments, if the wider width of the 3rd type pins 15, its stress influence
Trim Molding, then also long and narrow breach can be set in the 3rd type pins 15, stress is excessive to be brought to Trim Molding to solve
Problem.
Fig. 2 is the planar structure schematic diagram of the second embodiment of lead frame of the present invention.It is shown in Figure 2, described
The difference of two embodiments and the first embodiment is that the 3rd type pins 15 are not connected directly with base island 11, institute
Stating the 3rd type pins 15 can be connected with the chip being arranged on base island 11 using metal lead wire 21, the 3rd type pins
15 is identical with the effect of the Second Type pin 13, and the functional leads as follow-up packaging body electrically connect with the external world.
Fig. 3 is the planar structure schematic diagram of the 3rd embodiment of lead frame of the present invention.It is shown in Figure 3, described
The difference of three embodiments and the first embodiment is that the base island 11 includes the chip region 110 and institute for chip placement
State the clear area 111 outside chip region 110.In practical structures, because the chip region 110 and the clear area 111 have no
Obvious line of demarcation, therefore the scope of chip region 110 is schematically indicated using dotted line frame in figure 3.In practical structures, core
The region that piece takes is exactly chip region 110, and chip is exactly clear area 111 without the region taken.Set in the clear area 111
There is at least one locked mode hole 16, the locked mode hole 16 can be along longitudinally through the lead frame 10, can also be only recessed along longitudinal direction
Fall into and and not through the lead frame 10.The effect in the locked mode hole 16 is to strengthen the lead frame 10 and follow-up encapsulation
The adhesion of the plastic-sealed body 30 of technique.Existing product encapsulation volume is small, and encapsulating intensity is weaker, and product is easily layered, and this hair
The design in bright locked mode hole 16, adds the adhesion of lead frame 10 and plastic-sealed body 30, avoids product from being layered, while lifting production again
The reliability of product.
In this third embodiment, the locked mode hole 16 is arranged on the clear area 111 and the first kind pin 12
The side of connection.To the shape in the locked mode hole 16 without limiting, its shape can be adjusted the present invention according to set location.
In other embodiments of the present invention, the locked mode hole 16 can be arranged on the clear area 111 not with the first kind pin
The side of 12 connections.To the quantity in the locked mode hole 16 also without limiting, its quantity can be set the present invention as needed
It is fixed, for example, can be come according to the chip area being arranged on Ji Dao, the excellent degree of adhesion of lead frame 10 and plastic-sealed body 30
Set.Preferably, it is shown in Figure 4 in fourth embodiment of the invention, in the clear area 111 and described first
The side that the side and the clear area 111 that type pins 12 connect are not connected with the first kind pin 12 is respectively provided with
Locked mode hole 16 is stated, this further improves the combination of the lead frame 10 and plastic-sealed body 30.
The present invention also provides a kind of array of lead frames, and Fig. 5 is the flat of one embodiment of array of lead frames of the present invention
Face structural representation, shown in Figure 5, the array of lead frames includes multiple lead frames 10, the lead frame 10
Structure it is identical with the structure of previously described lead frame, repeat no more, in the present embodiment, with the array of lead frames
First embodiment lead frame of the lead frame 10 as the array of lead frames.Pass through between the lead frame 10
Framework connects muscle 1 and connected, and the one end of the first kind pin 12 away from the base island 11 connects muscle 1 with the framework and is connected, then institute
State and connect muscle 1 close to the framework at the rib cutting of first kind pin 12.
The present invention also provides a kind of packaging body, and Fig. 6 A are the plan structure signals of the first embodiment of packaging body of the present invention
Figure, Fig. 6 B are the side structure schematic views of the first embodiment of packaging body of the present invention, and Fig. 6 C are the first realities of packaging body of the present invention
Another structural representation of example is applied, wherein, in order to clearly describe the structure of packaging body of the present invention, in figure 6 c, in plastic-sealed body 30
The structure of the lead frame in portion is shown out.Refer to shown in Fig. 6 A, Fig. 6 B and Fig. 6 C, the packaging body includes a lead frame
10th, the plastic-sealed body 30 of lead frame 10 and the chip 20 described in an at least chip 20 and plastic packaging.The knot of the lead frame 10
Structure is identical with the structure of previously described lead frame, repeats no more, in the present embodiment, real with the first of the lead frame
Apply lead frame of the example as the packaging body.Wherein, the chip 20 is arranged on the base island 11, and the Second Type draws
Pin 13 is connected by metal lead wire 21 with the chip 20, and the first kind pin 12 has the part of the long and narrow breach 14
And the Second Type pin 13 protrudes from the plastic-sealed body 30, packaging area of the plastic-sealed body 30 along the lead frame 10
Encapsulate the lead frame 10 and the chip 20.Fig. 7 is the structural representation of the second embodiment of packaging body of the present invention, please be joined
As shown in Figure 7, in this embodiment, the locked mode hole 16, the locked mode are filled in the clear area on base island 11, the plastic-sealed body 30
Hole 16 is used for the adhesion for strengthening the lead frame 10 and the plastic-sealed body 30.
The present invention is on the premise of the heat dispersion of first kind pin 12 is ensured, in first kind pin 12 away from the base
Long and narrow breach 14 is set at the rib cutting of the one end on island 11, and the rib cutting punishment of first kind pin 12 is segmented into by the long and narrow breach 14
Two parts, stress of the first kind pin 12 at rib cutting is reduced, the problem for being not easy Trim Molding is solved, avoids simultaneously
The risk that plastic-sealed body 30 secretly splits.Further, for the ease of identifying the starting pin (i.e. PIN1) of packaging body, can also draw in starting
Mark is set corresponding to pin on plastic-sealed body.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (15)
1. a kind of lead frame, it is characterised in that be used to place at least Ji Dao of a chip, at least one and base including one
The first kind pin of island connection and at least one Second Type pin that with the chip metal lead wire can be used to be connected, institute
The width for stating first kind pin is more than the width of the Second Type pin, and the first kind pin is away from the Ji Dao's
There is a long and narrow breach at the rib cutting of one end, the end of the first kind pin is divided into two parts by the long and narrow breach,
After the lead frame is encapsulated by plastic-sealed body, the first kind pin has being partially protrude through for the long and narrow breach described
Plastic-sealed body.
2. lead frame according to claim 1, it is characterised in that the Ji Dao includes the chip region for chip placement
And the clear area outside the chip region, at least one locked mode hole is provided with the clear area, the locked mode hole is used to strengthen
The adhesion of the lead frame and plastic-sealed body.
3. lead frame according to claim 2, it is characterised in that the locked mode hole be arranged on the clear area with it is described
The side and/or be arranged on the side that the clear area is not connected with the first kind pin that first kind pin connects.
4. lead frame according to claim 1, it is characterised in that the first kind pin draws with the Second Type
Pin is separately positioned on the both sides of the Ji Dao.
5. lead frame according to claim 4, it is characterised in that with the first kind pin homonymy, also have
One the 3rd type pins, the 3rd type pins are connected with the Ji Dao, the 3rd type pins and the first kind
Pin function is identical.
6. lead frame according to claim 4, it is characterised in that with the first kind pin homonymy, or tool
There are one the 3rd type pins, the 3rd type pins can be connected with the chip using metal lead wire, the 3rd type
Pin and the Second Type pin are functional leads.
7. lead frame according to claim 1, it is characterised in that the width of the long and narrow breach is the first kind
0.13~0.24 times of the width of pin.
A kind of 8. array of lead frames, it is characterised in that including multiple lead frames as described in claim any one of 1-7,
Connect muscle by framework between multiple lead frames to connect, the one end of the first kind pin away from the Ji Dao and the framework
Even muscle connection.
9. a kind of packaging body, it is characterised in that including lead frame described in a lead frame, at least a chip and plastic packaging and described
The plastic-sealed body of chip；The lead frame includes Ji Dao, at least one first kind pin being connected with the Ji Dao and at least
One Second Type pin that with the chip metal lead wire can be used to be connected；The width of the first kind pin is more than institute
State the width of Second Type pin, the first kind pin has a long and narrow breach, and the long and narrow breach is by the first kind
The end of type pin is divided into two parts；The chip is arranged on the Ji Dao, the Second Type pin and the chip
Connected by metal lead wire；There is the first kind pin part of the long and narrow breach and the Second Type pin to protrude
In the plastic-sealed body.
10. packaging body according to claim 9, it is characterised in that the Ji Dao includes chip region and the institute of chip placement
The clear area outside chip region is stated, at least one locked mode hole is provided with the clear area, the plastic-sealed body fills the locked mode
Hole, the locked mode hole are used for the adhesion for strengthening the lead frame and the plastic-sealed body.
11. packaging body according to claim 10, it is characterised in that the locked mode hole be arranged on the clear area with it is described
The side and/or be arranged on the side that the clear area is not connected with the first kind pin that first kind pin connects.
12. packaging body according to claim 9, it is characterised in that the first kind pin draws with the Second Type
Pin is separately positioned on the both sides of the Ji Dao.
13. packaging body according to claim 12, it is characterised in that with the first kind pin homonymy, or tool
There are one the 3rd type pins, the 3rd type pins are connected with the Ji Dao, the first kind pin and the 3rd class
Type pin function is identical.
14. packaging body according to claim 12, it is characterised in that with the first kind pin homonymy, or tool
There are one the 3rd type pins, the 3rd type pins can be connected with the chip using metal lead wire, the Second Type
Pin and the 3rd type pins are functional leads.
15. packaging body according to claim 9, it is characterised in that the width of the long and narrow breach is the first kind
0.13~0.24 times of the width of pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711145541.3A CN107785345A (en) | 2017-11-17 | 2017-11-17 | Lead frame, array of lead frames and packaging body |
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| CN109671696A (en) * | 2018-12-27 | 2019-04-23 | 天水华天科技股份有限公司 | A kind of lead frame and its SOT33-5L packaging part in the locking glue hole in multiple rows of island Dan Ji |
| CN109686717A (en) * | 2018-12-27 | 2019-04-26 | 天水华天科技股份有限公司 | A kind of lead frame and its LED driving storage circuit SOT33-6L packaging part and production method |
| CN109962048A (en) * | 2019-03-28 | 2019-07-02 | 江西芯诚微电子有限公司 | A kind of integrated circuit package structure of five pins of band heat dissipation |
| WO2022233240A1 (en) * | 2021-05-07 | 2022-11-10 | 苏州汇川技术有限公司 | Packaging structure of power semiconductor device, and power module |
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| CN109671696A (en) * | 2018-12-27 | 2019-04-23 | 天水华天科技股份有限公司 | A kind of lead frame and its SOT33-5L packaging part in the locking glue hole in multiple rows of island Dan Ji |
| CN109686717A (en) * | 2018-12-27 | 2019-04-26 | 天水华天科技股份有限公司 | A kind of lead frame and its LED driving storage circuit SOT33-6L packaging part and production method |
| CN109962048A (en) * | 2019-03-28 | 2019-07-02 | 江西芯诚微电子有限公司 | A kind of integrated circuit package structure of five pins of band heat dissipation |
| WO2022233240A1 (en) * | 2021-05-07 | 2022-11-10 | 苏州汇川技术有限公司 | Packaging structure of power semiconductor device, and power module |
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Application publication date: 20180309 |