CN204088299U - A kind of New type of S OT223-3L encapsulating lead - Google Patents
A kind of New type of S OT223-3L encapsulating lead Download PDFInfo
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- CN204088299U CN204088299U CN201420420999.0U CN201420420999U CN204088299U CN 204088299 U CN204088299 U CN 204088299U CN 201420420999 U CN201420420999 U CN 201420420999U CN 204088299 U CN204088299 U CN 204088299U
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Abstract
The utility model discloses a kind of New type of S OT223-3L encapsulating lead and comprises pin outside the left and right sides, middle outer pin, pin in the left and right sides being connected to pin upper end outside the left and right sides, the carrier that lower end is connected with pin outside centre, be connected to the fin of carrier upper end, in the left and right sides, pin upper outside is provided with semicircle pod apertures, in the left and right sides, pin bottom and carrier bottom are provided with oval stress hole, fin bottom is provided with circular stress hole, and the front of fin lower end and carrier is provided with groove, in left and right, the back side of pin and carrier is provided with multiple pit, and the spacing in the left and right sides inside pin and between carrier is less than the spacing inside the outer pin of homonymy and between carrier, and the width of fin is greater than carrier, thus it is strong not only to enhance moisture-resistant gas infiltration capability, also substantially increase the adhesion between framework and plastic packaging material, thus can prevent from forming layering between framework and plastic packaging material, thus the utility model package reliability is high.
Description
Technical field
The utility model relates to integrated antenna package technical field, particularly relates to a kind of New type of S OT223-3L encapsulating lead.
Background technology
Lead frame is as the chip carrier of integrated circuit, a kind of realize the electrical connection of chip internal circuits exit and outer lead by means of bonding material (as spun gold, aluminium wire, copper wire) thus form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, simultaneously also for integrated circuit provides heat radiation, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.
The process of encapsulation is electrical connection on the one hand, is form protection to chip on the one hand.Protection mainly uses plastic packaging material by chip, framework parcel wherein, if encapsulate unreliable, moisture-resistant gas cut enters ability, and easily forms layering between framework and plastic packaging material.
In existing design, SOT223-3L lead frame comprises the outer pin in left, center, right three, pin in the left and right sides be connected with pin outside left and right, the carrier be connected with pin outside centre, be connected to the fin of carrier opposite side, inside the inside and outside pin of the same side the side of carrier (namely near) on the same line or the inner side of outer pin closer to carrier, thus carrier area is large, and the width of fin is consistent with carrier width, in order to improve moisture-resistant gas infiltration capability, some is pin and carrier arranged outside semicircle pod apertures in left and right, so that plastic packaging material flows through semicircle pod apertures, make pin in the left and right sides, carrier top and bottom combine good, increase the contact area of plastic packaging material and framework, thus improve the new energy of sealing of plastic packaging material, strengthen the air-tightness of plastic packaging material, thus strengthen moisture-resistant gas infiltration capability, but only so design, adhesion between framework and plastic packaging material is still strong not, easily form layering between the two.
Utility model content
The purpose of this utility model is to provide a kind of New type of S OT223-3L encapsulating lead, and its package reliability is high.
For achieving the above object, the technical scheme that the utility model adopts is:
A kind of New type of S OT223-3L encapsulating lead, comprises outside the outer pin in left side, middle outer pin, right side
Pin, be connected to left side outer pin upper end left side in pin, the carrier that lower end is connected with pin outside centre, be connected to the fin of carrier upper end, be connected to right side outer pin upper end right side in pin, in the described left and right sides, pin upper outside is provided with semicircle pod apertures, in the left and right sides, pin bottom and carrier bottom are provided with oval stress hole, fin bottom is provided with circular stress hole, and the front of fin lower end and carrier is provided with groove, in left and right, the back side of pin and carrier is provided with multiple pit, and the spacing in the described left and right sides inside pin and between carrier is less than the spacing inside the outer pin of homonymy and between carrier, and the width of fin is greater than carrier.
In described right side, pin is L-shaped, outside described right side pin to be connected on the right side of L shape under pin lateral part
End, inside and outside described left side, inside and outside pin and right side, pin is symmetrical arranged.
Described pit becomes del.
The groove of described fin lower end extends along the Width of fin.
Groove on described carrier is set to four up and down, and adjacent two grooves are end to end.
The beneficial effects of the utility model are: the utility model moisture-resistant gas infiltration capability is strong, also substantially increase the adhesion between framework and plastic packaging material, thus can prevent from forming layering between framework and plastic packaging material, thus the utility model lead-frame packages reliability is high.
Accompanying drawing explanation
Fig. 1 the utility model SOT223-3L encapsulating lead schematic diagram;
Fig. 2 is according to the generalized section in A-A direction in Fig. 1.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, the utility model SOT223-3L encapsulating lead comprises the outer pin 1 in left side, middle outer pin 2, the outer pin 3 in right side, be connected to left side outer pin 1 upper end left side in pin 4, the carrier 5 that lower end is connected with pin outside centre 2, be connected to the fin 6 of carrier 5 upper end, be connected to right side outer pin 3 upper end right side in pin 7, pin 4 in the described left and right sides, 7 upper outside are provided with semicircle pod apertures 8, pin 4 in the left and right sides, 7 bottoms and carrier 5 bottom are provided with oval stress hole 9, fin 6 bottom is provided with circular stress hole 10, and the front of carrier 5 and fin 6 lower end is respectively arranged with groove 11, 12, pin 4 in the left and right sides, 7 and the back side of carrier 5 be provided with multiple pit 13, and pin 4 in the described left and right sides, spacing inside 7 and between carrier 5 is less than the spacing inside the outer pin of homonymy and between carrier 5, and the width of fin 6 is greater than carrier 5.
In the present embodiment, in described right side, pin 7 is L-shaped, outside described right side pin 1 to be connected on the right side of L shape in lower end, pin 7 lateral part, inside and outside described left side, inside and outside pin and right side, pin is symmetrical arranged.
In the present embodiment, preferably, the groove 11 on described carrier 5 is set to four up and down, and adjacent two grooves are end to end; The groove 12 of described fin 6 lower end extends along the Width of fin 6.
As shown in Figure 2, in the present embodiment, preferably, described pit 13 one-tenth del.
In the present embodiment, the semicircle pod apertures 8 that in the left and right sides, pin 4,7 is arranged, can so that plastic packaging material flows through semicircle pod apertures 8, pin 4,7 top and bottom in the left and right sides are combined good, increase the contact area of plastic packaging material and framework, thus improve the sealing property of plastic packaging material, strengthen the air-tightness of plastic packaging material, thus strengthen moisture-resistant gas infiltration capability; The setting of stress hole 9,10, during encapsulation, plastic packaging material flows through and passes through stress hole 9,10, thus be equivalent to arrange the pin that a plastic packaging material makes, so, can to make in the left and right sides pin 4,7, carrier 5 and fin 6 be locked in plastic packaging material firmly, thus improve the adhesion between framework and plastic packaging material; Carrier 5 and fin 6 arrange groove 11,12, and plastic packaging material can flow in these grooves, can improve the moisture-resistant gas infiltration capability of framework on the one hand further, on the other hand, improves carrier 5 and the adhesion between fin 6 and plastic packaging material further; And the design of pit 13, plastic packaging material can be made also to flow in pit 13, thus also can improve the adhesion of framework and plastic packaging material; In addition, spacing in both sides inside pin and between carrier 5 is less than the spacing inside the outer pin of homonymy and between carrier 5, thus make the size of carrier 5 be less than the size of conventional carriers, so, the area ratio of plastic packaging material and lead frame can be controlled, that is, carrier 5 size is little, when plastic packaging material very much, the carrier 5 of a unit are can bear more plastic packaging material, thus make the adhesion between plastic packaging material and carrier 5 larger, and because the width of fin 6 is greater than carrier 5, thus heat-sinking capability of the present utility model can be improved.
As above design, not only enhance the utility model moisture-resistant gas infiltration capability strong, also substantially increase the adhesion between framework and plastic packaging material, thus can prevent from forming layering between framework and plastic packaging material, thus the utility model lead-frame packages reliability is high.
Claims (5)
1. a New type of S OT223-3L encapsulating lead, it is characterized in that: comprise the outer pin in left side, middle outer pin, the outer pin in right side, be connected to left side outer pin upper end left side in pin, the carrier that lower end is connected with pin outside centre, be connected to the fin of carrier upper end, be connected to right side outer pin upper end right side in pin, in the described left and right sides, pin upper outside is provided with semicircle pod apertures, in the left and right sides, pin bottom and carrier bottom are provided with oval stress hole, fin bottom is provided with circular stress hole, and the front of fin lower end and carrier is provided with groove, in left and right, the back side of pin and carrier is provided with multiple pit, and the spacing in the described left and right sides inside pin and between carrier is less than the spacing inside the outer pin of homonymy and between carrier, and the width of fin is greater than carrier.
2. New type of S OT223-3L encapsulating lead according to claim 1, it is characterized in that: in described right side, pin is L-shaped, outside described right side pin to be connected on the right side of L shape in lower end, pin lateral part, inside and outside described left side, inside and outside pin and right side, pin is symmetrical arranged.
3. New type of S OT223-3L encapsulating lead according to claim 2, is characterized in that: described pit becomes del.
4. the New type of S OT223-3L encapsulating lead according to claim 1 or 2 or 3, is characterized in that: the groove of described fin lower end extends along the Width of fin.
5. New type of S OT223-3L encapsulating lead according to claim 4, is characterized in that: the groove on described carrier is set to four up and down, and adjacent two grooves are end to end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420999.0U CN204088299U (en) | 2014-07-29 | 2014-07-29 | A kind of New type of S OT223-3L encapsulating lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420999.0U CN204088299U (en) | 2014-07-29 | 2014-07-29 | A kind of New type of S OT223-3L encapsulating lead |
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| Publication Number | Publication Date |
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| CN204088299U true CN204088299U (en) | 2015-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420420999.0U Active CN204088299U (en) | 2014-07-29 | 2014-07-29 | A kind of New type of S OT223-3L encapsulating lead |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895592A (en) * | 2016-06-24 | 2016-08-24 | 扬州扬杰电子科技股份有限公司 | Frame, diode comprising same and processing technology of diode |
| CN105932007A (en) * | 2016-06-28 | 2016-09-07 | 无锡市玉祁红光电子有限公司 | Lead frame with high bonding strength |
| CN105938826A (en) * | 2016-06-14 | 2016-09-14 | 上海凯虹科技电子有限公司 | Lead frame for improving layering of frame surface and plastic package body and package body |
| CN106872575A (en) * | 2017-01-05 | 2017-06-20 | 航天科工防御技术研究试验中心 | A kind of classification risk evaluating method of plastic device lamination defect |
| CN107978572A (en) * | 2017-12-20 | 2018-05-01 | 西安华羿微电子股份有限公司 | Prevent the TO lead frames of layering |
| CN109003957A (en) * | 2018-09-18 | 2018-12-14 | 江苏捷捷微电子股份有限公司 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
| CN109935566A (en) * | 2019-03-29 | 2019-06-25 | 无锡红光微电子股份有限公司 | Modified SOT223 frame |
| CN109962048A (en) * | 2019-03-28 | 2019-07-02 | 江西芯诚微电子有限公司 | A kind of integrated circuit package structure of five pins of band heat dissipation |
-
2014
- 2014-07-29 CN CN201420420999.0U patent/CN204088299U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105938826A (en) * | 2016-06-14 | 2016-09-14 | 上海凯虹科技电子有限公司 | Lead frame for improving layering of frame surface and plastic package body and package body |
| CN105895592A (en) * | 2016-06-24 | 2016-08-24 | 扬州扬杰电子科技股份有限公司 | Frame, diode comprising same and processing technology of diode |
| CN105932007A (en) * | 2016-06-28 | 2016-09-07 | 无锡市玉祁红光电子有限公司 | Lead frame with high bonding strength |
| CN106872575A (en) * | 2017-01-05 | 2017-06-20 | 航天科工防御技术研究试验中心 | A kind of classification risk evaluating method of plastic device lamination defect |
| CN106872575B (en) * | 2017-01-05 | 2020-01-14 | 航天科工防御技术研究试验中心 | Grading risk evaluation method for layered defects of plastic package device |
| CN107978572A (en) * | 2017-12-20 | 2018-05-01 | 西安华羿微电子股份有限公司 | Prevent the TO lead frames of layering |
| CN109003957A (en) * | 2018-09-18 | 2018-12-14 | 江苏捷捷微电子股份有限公司 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
| CN109962048A (en) * | 2019-03-28 | 2019-07-02 | 江西芯诚微电子有限公司 | A kind of integrated circuit package structure of five pins of band heat dissipation |
| CN109935566A (en) * | 2019-03-29 | 2019-06-25 | 无锡红光微电子股份有限公司 | Modified SOT223 frame |
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