CN105932007A - Lead frame with high bonding strength - Google Patents
Lead frame with high bonding strength Download PDFInfo
- Publication number
- CN105932007A CN105932007A CN201610486874.1A CN201610486874A CN105932007A CN 105932007 A CN105932007 A CN 105932007A CN 201610486874 A CN201610486874 A CN 201610486874A CN 105932007 A CN105932007 A CN 105932007A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip
- lead
- bond strength
- bonding strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a lead frame with high bonding strength. The lead frame comprises multiple lead frame units, wherein the adjacent lead frame units are connected through connecting ribs; each lead frame unit comprises pin leads, a chip lead and a chip carrier connected with the chip lead; each chip carrier comprises a chip carrying region and a radiating region; multiple notches are formed in each chip carrying region; and the notches are in matrix configuration as a whole. According to the lead frame with the high bonding strength, multiple notches in matrix configuration are formed in the chip carrying regions, so that the radiating effect can be improved, bubbles between soldering tin and the chip carrying regions is reduced, and the bonding strength between the chips and the chip carrying regions is reinforced; and meanwhile, the lead frame is simple in structure and easy to implement.
Description
Technical field
The present invention relates to field of semiconductor devices, particularly relate to a kind of lead frame with high bond strength.
Background technology
Lead frame, as the chip carrier of integrated circuit, is that one realizes chip internal by means of bonding material
Circuit exit and the electrical connection of outer lead, form the key structure part of electric loop；It serves with outward
The function served as bridge that portion's wire connects.At present, the semiconductor integrated block of the overwhelming majority is required for use plastic packaging to draw
Wire frame, it is basic material important in electronics and information industry.
Still there is the problem such as weak heat-dissipating and chip poor bonding strength in the lead frame on existing market, thus,
It is badly in need of solving.
Summary of the invention
Present invention aims to the problems referred to above, it is provided that a kind of lead frame with high bond strength,
To solve existing lead frame weak heat-dissipating, with the problem of chip poor bonding strength.
It is an object of the invention to be achieved through the following technical solutions:
A kind of lead frame with high bond strength, including multiple lead frame unit, adjacent lead frame
Unit is connected by dowel, and described lead frame unit includes pin leads, chip lead and draws with chip
The chip carrier that line is connected, described chip carrier includes slide glass district and radiating area, described slide glass district being provided with some
Individual recess, all recesses are overall arranges in matrix.
As a preferred embodiment of the present invention, described radiating area has louvre.
As a preferred embodiment of the present invention, described dowel has hole, location.
As a preferred embodiment of the present invention, the bore of described recess is 1mm.
Beneficial effects of the present invention is, described a kind of lead frame with high bond strength passes through in slide glass district
Arrange that several are the recess that matrix is arranged, radiating effect can not only be improved, and scolding tin and load can be reduced
Bubble between section, improves the bond strength in chip and slide glass district, simple in construction, is easily achieved.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of lead frame with high bond strength of the present invention.
In figure:
1, dowel；2, left pin leads；3, right pin leads；4, chip lead；5, chip carrier；
6, recess；7, louvre；8, hole, location.
Detailed description of the invention
Further illustrate technical scheme below in conjunction with the accompanying drawings and by detailed description of the invention.Permissible
Being understood by, embodiment described herein is used only for explaining the present invention, rather than limitation of the invention.
Refer to shown in Fig. 1, Fig. 1 is that the structure of a kind of lead frame with high bond strength of the present invention is shown
It is intended to.
In the present embodiment, a kind of lead frame with high bond strength, including multiple lead frame unit,
Adjacent lead frame unit is connected by dowel 1, and described dowel 1 has hole 8, location, described lead-in wire
Frame unit includes left pin leads 2, right pin leads 3, chip lead 4 and is connected with chip lead 4
Chip carrier 5, described chip carrier 5 includes slide glass district and radiating area, and described radiating area has louvre 7, institute
Stating and be provided with several recesses 6 in slide glass district, all recess 6 entirety are matrix arrangement, the mouth of described recess 6
Footpath is 1mm.
Above-mentioned a kind of lead frame with high bond strength is by arranging that in slide glass district several are that matrix is arranged
Recess 6, radiating effect can not only be improved, and the bubble between scolding tin and slide glass district can be reduced, improve
The bond strength in chip and slide glass district, simple in construction, is easily achieved.
Above example simply elaborates ultimate principle and the characteristic of the present invention, and the present invention is not by above-described embodiment
Limiting, without departing from the spirit and scope of the present invention, the present invention also has various change and change, this
A little changes and change both fall within scope of the claimed invention.Claimed scope is by appended
Claims define.
Claims (4)
1. a lead frame with high bond strength, it is characterised in that: include multiple lead frame unit,
Adjacent lead frame unit is connected by dowel, and described lead frame unit includes that pin leads, chip draw
Line and the chip carrier being connected with chip lead, described chip carrier includes slide glass district and radiating area, described slide glass district
On be provided with several recesses, all recesses are overall arranges in matrix.
A kind of lead frame with high bond strength the most according to claim 1, it is characterised in that:
Louvre is had on described radiating area.
A kind of lead frame with high bond strength the most according to claim 1, it is characterised in that:
Hole, location is had on described dowel.
A kind of lead frame with high bond strength the most according to claim 1, it is characterised in that:
The bore of described recess is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610486874.1A CN105932007A (en) | 2016-06-28 | 2016-06-28 | Lead frame with high bonding strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610486874.1A CN105932007A (en) | 2016-06-28 | 2016-06-28 | Lead frame with high bonding strength |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105932007A true CN105932007A (en) | 2016-09-07 |
Family
ID=56829641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610486874.1A Pending CN105932007A (en) | 2016-06-28 | 2016-06-28 | Lead frame with high bonding strength |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105932007A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928427A (en) * | 2014-03-28 | 2014-07-16 | 张轩 | Lead frame with pits on backs of cooling fins |
| CN203760460U (en) * | 2014-04-15 | 2014-08-06 | 宁波华龙电子股份有限公司 | Integrated circuit lead frame board |
| CN204088299U (en) * | 2014-07-29 | 2015-01-07 | 深圳电通纬创微电子股份有限公司 | A kind of New type of S OT223-3L encapsulating lead |
| CN205920965U (en) * | 2016-06-28 | 2017-02-01 | 无锡市玉祁红光电子有限公司 | Lead frame with high bonding strength |
-
2016
- 2016-06-28 CN CN201610486874.1A patent/CN105932007A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928427A (en) * | 2014-03-28 | 2014-07-16 | 张轩 | Lead frame with pits on backs of cooling fins |
| CN203760460U (en) * | 2014-04-15 | 2014-08-06 | 宁波华龙电子股份有限公司 | Integrated circuit lead frame board |
| CN204088299U (en) * | 2014-07-29 | 2015-01-07 | 深圳电通纬创微电子股份有限公司 | A kind of New type of S OT223-3L encapsulating lead |
| CN205920965U (en) * | 2016-06-28 | 2017-02-01 | 无锡市玉祁红光电子有限公司 | Lead frame with high bonding strength |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
| CN111199941B (en) * | 2018-11-16 | 2022-03-25 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160907 |
|
| RJ01 | Rejection of invention patent application after publication |