CN103943596A - Fully packaged type lead frame - Google Patents

Fully packaged type lead frame Download PDF

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Publication number
CN103943596A
CN103943596A CN201410121398.4A CN201410121398A CN103943596A CN 103943596 A CN103943596 A CN 103943596A CN 201410121398 A CN201410121398 A CN 201410121398A CN 103943596 A CN103943596 A CN 103943596A
Authority
CN
China
Prior art keywords
lead frame
fin
terminal pin
radiation piece
fully packaged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410121398.4A
Other languages
Chinese (zh)
Inventor
张轩
Original Assignee
张轩
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张轩 filed Critical 张轩
Priority to CN201410121398.4A priority Critical patent/CN103943596A/en
Publication of CN103943596A publication Critical patent/CN103943596A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses a fully packaged type lead frame. The fully packaged type lead frame is composed of a plurality of lead frame units arranged in a single row, wherein the lead frame units are mutually connected through connecting ribs. Each lead frame unit comprises a heat radiation piece and a lead pin, wherein the connecting position of the head radiation piece and the lead pin is bent, a packing frame is arranged at the head of the heat radiation piece, and a runner port is formed in the connecting position of the heat radiation piece and the packing frame. The lead frame is fully packaged, the runner ports will be automatically broken after glue enters the heads of the heat radiation piece, and the packaging efficiency is improved.

Description

A kind of lead frame of total incapsulation form
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame of total incapsulation form.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame of total incapsulation form, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises fin and terminal pin, bend in fin and terminal pin junction, described fin head is provided with seals frame, and fin is provided with runner mouth with the junction of sealing frame.
As a further improvement on the present invention, the width of described lead frame unit is 17 ± 0.03mm.
As a further improvement on the present invention, described lead frame unit is provided with location hole, and the diameter of location hole is 1.5 ± 0.05mm.
As a further improvement on the present invention, described fin thickness is 1.5 ± 0.02mm, and terminal pin thickness is 0.5 ± 0.015mm, and fin and terminal pin plane of living in is at a distance of 2.8 ± 0.03mm.
Adopt said structure, its beneficial effect is: this lead frame adopts total incapsulation form, and after fin head enters glue, runner mouth can rupture automatically, improves packaging efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, 4-seals frame, 5-runner mouth, 6-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Fig. 1, a kind of lead frame of total incapsulation form, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, described fin 2 heads are provided with seals frame 4, fin 2 is provided with runner mouth 5 with the junction of sealing frame 4, the width of described lead frame unit 1 is 17 ± 0.03mm, described lead frame unit 1 is provided with location hole 6, the diameter of location hole 6 is 1.5 ± 0.05mm, described fin 2 thickness are 1.5 ± 0.02mm, terminal pin 3 thickness are 0.5 ± 0.015mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.8 ± 0.03mm.
This lead frame adopts total incapsulation form, and after fin 2 heads enter glue, runner mouth 5 can rupture automatically, improves packaging efficiency.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.

Claims (4)

1. the lead frame of a total incapsulation form, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, described lead frame unit (1) comprises fin (2) and terminal pin (3), bend in fin (2) and terminal pin (3) junction, it is characterized in that: described fin (2) head is provided with seals frame (4), fin (2) is provided with runner mouth (5) with the junction of sealing frame (4).
2. the lead frame of a kind of total incapsulation form according to claim 1, is characterized in that: the width of described lead frame unit (1) is 17 ± 0.03mm.
3. the lead frame of a kind of total incapsulation form according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (6), and the diameter of location hole (6) is 1.5 ± 0.05mm.
4. the lead frame of a kind of total incapsulation form according to claim 1, it is characterized in that: described fin (2) thickness is 1.5 ± 0.02mm, terminal pin (3) thickness is 0.5 ± 0.015mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.8 ± 0.03mm.
CN201410121398.4A 2014-03-28 2014-03-28 Fully packaged type lead frame Pending CN103943596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410121398.4A CN103943596A (en) 2014-03-28 2014-03-28 Fully packaged type lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410121398.4A CN103943596A (en) 2014-03-28 2014-03-28 Fully packaged type lead frame

Publications (1)

Publication Number Publication Date
CN103943596A true CN103943596A (en) 2014-07-23

Family

ID=51191194

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410121398.4A Pending CN103943596A (en) 2014-03-28 2014-03-28 Fully packaged type lead frame

Country Status (1)

Country Link
CN (1) CN103943596A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107346763A (en) * 2016-05-06 2017-11-14 无锡华润安盛科技有限公司 A kind of lead frame of IPM modules
CN108807326A (en) * 2018-05-02 2018-11-13 泰州友润电子科技股份有限公司 A kind of improved overloading type 3PF lead frames

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244334A (en) * 1993-02-15 1994-09-02 Fuji Electric Co Ltd Resin-sealed semiconductor device
US6114750A (en) * 1996-10-01 2000-09-05 International Rectifier Corp. Surface mount TO-220 package and process for the manufacture thereof
CN203850287U (en) * 2014-03-28 2014-09-24 张轩 Plastic-sealed lead frame in full packaging manner

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244334A (en) * 1993-02-15 1994-09-02 Fuji Electric Co Ltd Resin-sealed semiconductor device
US6114750A (en) * 1996-10-01 2000-09-05 International Rectifier Corp. Surface mount TO-220 package and process for the manufacture thereof
CN203850287U (en) * 2014-03-28 2014-09-24 张轩 Plastic-sealed lead frame in full packaging manner

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107346763A (en) * 2016-05-06 2017-11-14 无锡华润安盛科技有限公司 A kind of lead frame of IPM modules
CN107346763B (en) * 2016-05-06 2020-04-17 无锡华润安盛科技有限公司 Lead frame of IPM module
CN108807326A (en) * 2018-05-02 2018-11-13 泰州友润电子科技股份有限公司 A kind of improved overloading type 3PF lead frames

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140723