CN109003957A - The preparation method of SOT-89/223-2L lead frame and two leg structures - Google Patents
The preparation method of SOT-89/223-2L lead frame and two leg structures Download PDFInfo
- Publication number
- CN109003957A CN109003957A CN201811088109.XA CN201811088109A CN109003957A CN 109003957 A CN109003957 A CN 109003957A CN 201811088109 A CN201811088109 A CN 201811088109A CN 109003957 A CN109003957 A CN 109003957A
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- Prior art keywords
- lead frame
- product
- plastic
- foot
- sot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims description 6
- 239000004033 plastic Substances 0.000 claims abstract description 20
- 229920003023 plastic Polymers 0.000 claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 27
- 239000001257 hydrogen Substances 0.000 claims description 18
- 229910052739 hydrogen Inorganic materials 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 238000004026 adhesive bonding Methods 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 239000000206 moulding compound Substances 0.000 claims description 9
- 150000002431 hydrogen Chemical class 0.000 claims description 8
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 210000002414 leg Anatomy 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 210000001699 lower leg Anatomy 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses the production methods of SOT-89/223-2L encapsulating lead and bipod product, the mode that bipod encapsulation is realized in traditional three feet cutting is changed, realizes two pin packaging structures, and middle foot is not exposed, the insulation distance between the bipod of left and right is increased, the application range of device has been widened.SOT-89/223-2L encapsulating lead and bipod product of the present invention include lead frame, cooling fin, foot and left and right terminal pin in cutting type, without dew copper point at foot in bipod product, cooling fin and middle foot take the rib cutting implementation method that cutting type structure designs at plastic packaging line, make device at work >=1500V voltage without sparking or short circuit phenomenon, to improve the reliability of device.
Description
Technical field
The present invention relates to the technical fields of encapsulation, and in particular to the system of SOT-89/223-2L lead frame and two leg structures
Multiple rows of structures such as Preparation Method, including 6 rows, 8 rows, 12 rows.
Background technique
Existing SOT-89/223-2L product, including plastic-sealed body, cooling fin, left terminal pin, right terminal pin, middle leads
Foot, middle leads foot is consistent with left and right terminal pin length, cuts off crura intermedium when passing through rib cutting, remains in 0.5-1.0mm length
Between foot, it is smaller with the foot of left and right at a distance to remain crura intermedium, device at work because >=1500V voltage generate sparking or it is short-circuit now
As so that earlier circuit failure occur.
Summary of the invention
In order to solve the above technical problems, the present invention provides SOT-89/223-2L lead frame and two leg structures, including modeling
Feng Ti sets lead frame in plastic-sealed body, and cooling fin is drawn in plastic-sealed body side, and left terminal pin, right lead are drawn in the plastic-sealed body other side
Foot and middle leads foot；The middle leads foot is built-in type.
The preparation method of SOT-89/223-2L lead frame and two leg structures, comprising the following steps:
Chip is welded on lead frame by step 1: setting die Bonder temperature is 350-380 DEG C, and hydrogen nitrogen is pressed hydrogen 10-
The ratio of 25%, nitrogen 75-90% mix, and prepare high temperature solder stick Pb92.5Sn5Ag2.5；Lead frame is transmitted to a tin position
When, square in the state of hydrogen and nitrogen gas protection, by way of writing tin on chip loading area is drawn with a thickness of 20-60um
Chip is inhaled the welding region for being attached to lead frame, and is cooled to room temperature by solder；
In step 2, the left terminal pin of correspondence and right terminal pin that the electrode of chip is connected to lead frame by copper wire: setting ball
Hydrogen nitrogen is pressed hydrogen 5-10% by 200-250 DEG C of welder area guide rail temperature, and the ratio of nitrogen 90-95% mixes；Equipped with chip
Lead frame is transmitted to welding region, and in the state of hydrogen and nitrogen gas protection, copper wire is welded on chip surface electrode after burning ball, benefit
On the left terminal pin of correspondence and right terminal pin that the other end of copper wire is welded on lead frame with ultrasonic power.
The moulding compound used for lead frame that scolding tin is completed is encapsulated by step 3: 170-185 DEG C of arranging machine temperature of setting, mould
165-175 DEG C of temperature of tool.Frame after scolding tin is got well is discharged on arranging machine and preheats, then the lead frame after preheating is passed through feeding
Frame is put on plastic package die, is put into moulding compound, and mold-closing injection simultaneously is completed to take out product after solidifying.
Step 4 removes the runner after plastic packaging from lead frame: the lead frame after plastic packaging is put into runner machine
It is interior, the runner of moulding compound is removed, product is formed.
Step 5 solidifies afterwards: the product after removal runner is put into the baking oven that temperature is 175 ± 5 DEG C and is solidified, when
Between 12 hours.
Rear cured product is put into adhesive supplier removal residual cast gate, and removes middle leads foot by step 6；Gluing mold
Cavity plate knife supports product section at middle leads foot, and punch-pin knife is designed to the gradual inclined-plane edge of a knife, first by middle leads foot
Product plastic-sealed body die joint is pushed away along frame fracture close to plastic packaging body portion, intermediate draw then is cut off from lead frame outer rim
Stitch, and to cut-off part gluing.
Step 7, gluing complete product be electroplated, rib cutting, test, packaging.
Plastic package die of the present invention while compatible SOT-89/223-3L product, reduce the investment of plastic package die and equipment.
Without dew copper point at foot in SOT-89/223-2L product, pin pitch expanded as twice, device at work >=1500V voltage is without sparking
Or short circuit phenomenon, to improve the reliability of device.
The present invention changes the mode that bipod encapsulation is realized in traditional three feet cutting, realizes two pin packaging structures, and middle foot
It is not exposed, the insulation distance between the bipod of left and right is increased, the application range of device has been widened.
Detailed description of the invention
Fig. 1 is lead frame structure schematic diagram of the invention.
Fig. 2 is SOT-89/223-3L internal structure chart.
Fig. 3 is foot schematic diagram in gluing removal technique.
Fig. 4 is SOT-89/223-3L product structure figure.
Fig. 5 is the product structure figure that foot is exposed in SOT-89/223-2L.
Fig. 6 is product structure figure of the SOT-89/223-2L without middle foot.
In figure, 1. plastic-sealed bodies, 2. cooling fins, 3. left terminal pins, 4. right terminal pins, 5. middle leads feet, 6. welderings
Tin, 7. chips, 8. copper wire, 9. punch-pin knife, 10. cavity plate knife, 11. lead frames.
Specific embodiment
The present invention provides the implementation methods of SOT-89/223-2L lead frame and two leg structures, pass through special frame
Structure design, in plastic packaging, plastic package die can be compatible with the product of two kinds of structures of SOT-89/223-3L and SOT-89/223-2L,
The middle leads foot of SOT-89/223-2L product is completely enclosed in plastic-sealed body after plastic packaging, cuts off frame by mold in gluing
The middle leads foot of plastic packaging plugging action is played on frame, and the mould of 0.1mm length is left at SOT-89/223-2L product middle leads foot
Plastics improve the reliability of device by the terminal pin of device away from expanding as twice.
As shown in Figure 1, SOT-89/223-2L lead frame and two leg structures, including plastic-sealed body 1, lead is set in plastic-sealed body 1
Cooling fin 2 is drawn in frame 11,1 side of plastic-sealed body, and left terminal pin 3, right terminal pin 4 and middle leads are drawn in 1 other side of plastic-sealed body
Foot 5.For middle leads foot 5 in the centre of left terminal pin 3 and right terminal pin 4, middle leads foot 5 is cut-off.
The preparation method of SOT-89/223-2L lead frame and two leg structures, comprising the following steps:
Step 1: as shown in Fig. 2, chip 7 is welded on lead frame: setting die Bonder temperature is 350-380 DEG C.Hydrogen and nitrogen gas
It mixes in proportion, hydrogen ratio 10-25%, remainder is nitrogen.High temperature solder stick Pb92.5Sn5Ag2.5.When lead frame 11
When being transmitted to a tin position, in the state of hydrogen and nitrogen gas protection, by way of writing tin on chip loading area is drawn with a thickness of
Chip 7 is inhaled the welding region for being attached to lead frame 11, and is cooled to room temperature by the square scolding tin 6 of 20-60um.
Step 2: the electrode of chip 7 is connected to the left terminal pin 3 of correspondence and right terminal pin of lead frame 11 by copper wire 8
On 4: 200-250 DEG C of pellet bonding machine welding section guide rail temperature of setting.Hydrogen nitrogen is mixed in proportion, hydrogen ratio 5-10%, remainder is
Nitrogen.Lead frame 11 equipped with chip 7 is transmitted to welding region, and in the state of hydrogen and nitrogen gas protection, copper wire 8 welds after burning ball
On 7 surface electrode of chip, the left terminal pin 3 of the correspondence that the other end of copper wire 8 is welded on lead frame 11 by ultrasonic power and the right side
On terminal pin 4.
Step 3: the lead frame 11 that scolding tin is completed is encapsulated with moulding compound: 170-185 DEG C of arranging machine temperature of setting,
165-175 DEG C of mold temperature.Then the lead frame 11 after encapsulating is discharged on arranging machine and is preheated, then by the lead frame after preheating
Frame 11 is put on plastic package die by stock shelf, is put into moulding compound, and mold-closing injection simultaneously is completed to take out product after solidifying.
Step 4: the runner after plastic packaging being removed from lead frame 11: the lead frame 11 after plastic packaging is put into runner
In machine, the runner of moulding compound is removed, forms product.
Step 5: solidify afterwards: the product after removal runner being put into the baking oven that temperature is 175 ± 5 DEG C and is solidified, when
Between 12 hours.
Step 6: rear cured product being put into adhesive supplier removal residual cast gate, and removes middle leads foot；Gluing mold
Cavity plate knife supports product section at middle leads foot, and punch-pin knife is designed to the gradual inclined-plane edge of a knife, first by middle leads foot
Product plastic-sealed body die joint is pushed away along frame fracture close to plastic packaging body portion, then from cutting off from the outer rim of lead frame 11
Between terminal pin 5, and to cut-off part gluing.
Step 7: gluing complete product be electroplated, rib cutting, test, packaging.
Claims (2)
1.SOT-89/223-2L lead frame and two leg structures, it is characterised in that: including plastic-sealed body (1), set in plastic-sealed body (1)
Cooling fin (2) are drawn in lead frame (11), plastic-sealed body (1) side, and left terminal pin (3), right lead are drawn in plastic-sealed body (1) other side
Foot (4) and middle leads foot (5)；The middle leads foot (5) is built-in type.
2.SOT-89/223-2L the preparation method of lead frame and two leg structures, it is characterised in that: the following steps are included:
Chip is welded on lead frame by step 1: setting die Bonder temperature is 350-380 DEG C, and hydrogen nitrogen is pressed hydrogen 10-
The ratio of 25%, nitrogen 75-90% mix, and prepare high temperature solder stick；When lead frame is transmitted to a tin position, protected in hydrogen and nitrogen gas
In the state of shield, by way of writing tin chip loading area draw on a thickness of 20-60um square solder, chip is inhaled
It is attached to the welding region of lead frame, and is cooled to room temperature；
In step 2, the left terminal pin of correspondence and right terminal pin that the electrode of chip is connected to lead frame by copper wire: setting ball
Hydrogen nitrogen is pressed hydrogen 5-10% by 200-250 DEG C of welder area guide rail temperature, and the ratio of nitrogen 90-95% mixes；Chip will be housed
Lead frame be transmitted to welding region, hydrogen and nitrogen gas protection in the state of, copper wire burn ball after be welded on chip surface electrode,
On the left terminal pin of correspondence and right terminal pin that the other end of copper wire is welded on lead frame using ultrasonic power；
The moulding compound used for lead frame that scolding tin is completed is encapsulated by step 3: 170-185 DEG C of arranging machine temperature of setting, mold temperature
165-175 DEG C of degree；Frame after scolding tin is got well is discharged on arranging machine and preheats, then the lead frame after preheating is put by stock shelf
Onto plastic package die, it is put into moulding compound, mold-closing injection simultaneously is completed to take out product after solidifying；
Step 4 removes the runner after plastic packaging from lead frame: the lead frame after plastic packaging being put into runner machine, is gone
Except the runner of moulding compound, product is formed；
Step 5 solidifies afterwards: the product after removal runner is put into the baking oven that temperature is 175 ± 5 DEG C and is solidified, the time 12
Hour；
Step 6, gluing: rear cured product is put into adhesive supplier removal residual cast gate, and removes middle leads foot；Gluing mold
Cavity plate knife supports product section at middle leads foot, and punch-pin knife is designed to the gradual inclined-plane edge of a knife, first by middle leads foot
Product plastic-sealed body die joint is pushed away along frame fracture close to plastic packaging body portion, intermediate draw then is cut off from lead frame outer rim
Stitch, and to cut-off part gluing；
Step 7: gluing complete product be electroplated, rib cutting, test, packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811088109.XA CN109003957A (en) | 2018-09-18 | 2018-09-18 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811088109.XA CN109003957A (en) | 2018-09-18 | 2018-09-18 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109003957A true CN109003957A (en) | 2018-12-14 |
Family
ID=64591583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811088109.XA Pending CN109003957A (en) | 2018-09-18 | 2018-09-18 | The preparation method of SOT-89/223-2L lead frame and two leg structures |
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| CN (1) | CN109003957A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180397A (en) * | 2020-01-03 | 2020-05-19 | 深圳市奥伦德元器件有限公司 | Preparation process of photoelectric coupler compatible with different pin positions |
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| Title |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180397A (en) * | 2020-01-03 | 2020-05-19 | 深圳市奥伦德元器件有限公司 | Preparation process of photoelectric coupler compatible with different pin positions |
| CN111180397B (en) * | 2020-01-03 | 2021-11-05 | 深圳市奥伦德元器件有限公司 | Preparation process of photoelectric coupler compatible with different pin positions |
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