CN109501149A - A kind of novel flow channel structure of metaideophone molding IC package mold - Google Patents
A kind of novel flow channel structure of metaideophone molding IC package mold Download PDFInfo
- Publication number
- CN109501149A CN109501149A CN201811564573.1A CN201811564573A CN109501149A CN 109501149 A CN109501149 A CN 109501149A CN 201811564573 A CN201811564573 A CN 201811564573A CN 109501149 A CN109501149 A CN 109501149A
- Authority
- CN
- China
- Prior art keywords
- flow channel
- runner
- substrate
- metaideophone
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000001746 injection moulding Methods 0.000 claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 claims abstract description 17
- 239000012778 molding material Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 abstract description 19
- 238000000034 method Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
- B29C2045/2709—Gates with a plurality of mould cavity inlets in close proximity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of novel flow channel structures of metaideophone molding IC package mold；Structure difference is arranged with traditional runner, and region of converging is arranged in the position of center line of substrate, so that plastic packaging material is filled to the flowing of the distal end of substrate two sides respectively simultaneously from confluence region；The doab of the structure is located inside substrate, shortens injection molding path, reduces plastic packaging material flow resistance, while being conducive to gas discharge, effectively improves filling encapsulating, cavitation because of caused by the injection molding of side during existing metaideophone molding IC package；It is molded path to shorten, so as to be larger size, the big specification substrate containing more chips by substrate design, saves injection molding cost；The runner can be suitble to the plastic packaging of a variety of IC structures, and applicability is wide.
Description
[technical field]
The invention belongs to IC plastic packaging fields, and in particular to a kind of novel flow channel structure of metaideophone molding IC package mold.
[background technique]
Plastic packaging material used in IC package is thermosetting material, and characteristic is that injection molding path values are bigger during injection molding
Plastic packaging flow resistance is bigger at this, traditional flow passage structure, and confluence region is located at glue-feeder, and plastic packaging material is directly from glue-feeder stream
Enter doab, then flowed from the doab toward far-end, the mould stream for completing chip on entire substrate fills (referring to Fig. 1), utilizes
This metaideophone mould structure injection molding has the following disadvantages: that injection molding path is longer, during the flowing of thermosetting property plastic packaging material, flowing
Resistance is big, and mold cavity gas is not easy to be discharged, and the increase of flow resistance is unfavorable for product filling, so that product easily wraps
Bad defect is sealed, product becomes defective products.
[summary of the invention]
It is an object of the invention to overcome the above-mentioned prior art, a kind of the new of metaideophone molding IC package mold is provided
Type flow passage structure；The invention is by designing a kind of new flow passage structure, so that injection hole moves to substrate from traditional substrate one end
Centre, flow resistance reduces, is conducive to product and fills, reduce the fraction defective encapsulated of product.
In order to achieve the above objectives, the present invention is achieved by the following scheme:
A kind of novel flow channel structure of metaideophone molding IC package mold, comprising: substrate, first runner and third flow channel, the
One runner is connected to third flow channel by K second flow channel, the natural number that K is >=1；First runner is in the outside of substrate, and second
Runner and third flow channel are in the top of substrate；Array is disposed with chip on substrate, is plastic packaging region, the center of substrate between chip
Confluence region is offered on line, confluence region is connected to plastic packaging region (5), surface of the third flow channel in confluence region, third
Runner is parallel to confluence region；The lower surface of first runner is fixedly installed M metaideophone slot；The lower surface fixation of third flow channel is set
It is equipped with N number of 4th runner, the lower end face of the 4th runner is converged region, and M and N are >=2 natural number.
A further improvement of the present invention is that
Preferably, the center line of substrate is any one of cross central line or longitudinal centre line.
Preferably, first runner is parallel with third flow channel；Second flow channel is perpendicular to first runner.
Preferably, as K=1, the junction of second flow channel and third flow channel is at the center of third flow channel；As K > 1
When, second flow channel and the junction of third flow channel etc. divide third flow channel.
Preferably, M metaideophone slot is in lower surface of first runner etc. point arrangement.
Preferably, N number of 4th runner is in lower surface of third flow channel etc. point arrangement.
Preferably, each metaideophone slot is connected to the device of external offer injection molding material.
Preferably, first runner, second flow channel and third flow channel are made of upper mold and lower mold, and the upper mold is under
Mold is metal material.
Compared with prior art, the invention has the following advantages:
The invention discloses a kind of novel flow channel structures of metaideophone molding IC package mold；Structure difference and traditional stream
The position of center line of substrate is arranged in region of converging by road setting, so that plastic packaging material is from confluence region simultaneously respectively to substrate two
The distal end flowing of side is filled；The doab of the structure is located inside substrate, shortens injection molding path, reduces plastic packaging material flowing resistance
Power, while being conducive to gas discharge effectively improves during existing metaideophone molding IC package because of caused by the injection molding of side
Filling encapsulating, cavitation；It is molded path to shorten, so as to be larger size, the big rule containing more chips by substrate design
Lattice plate saves injection molding cost；The runner can be suitble to the plastic packaging of a variety of IC structures, and applicability is wide.
Further, the center line of substrate can be cross central line or longitudinal centre line, be applicable in a variety of substrates or plastic packaging
Equipment.
Further, first runner is parallel with third flow channel；Second flow channel reduces the stream of plastic packaging material perpendicular to first runner
Dynamic distance, reduces the resistance of plastic packaging material flow process.
Further, second flow channel etc. point third flow channel is arranged, plastic packaging material is uniformly flow to from first runner
Third flow channel improves the flowing velocity of plastic packaging material, reduces flow resistance.
Further, metaideophone slot etc. divides first runner to arrange, point third flow channel such as the 4th runner is arranged, is for melting
The plastic packaging material of state can uniformly flow into runner or confluence region in.
[Detailed description of the invention]
Fig. 1 is the conventional flow field structure chart that metaideophone forms IC package mold；
Fig. 2 is three-dimensional structure figure of the invention；
Fig. 3 is plane structure chart of the invention；
Wherein: 1- metaideophone slot；2- first runner；3- second flow channel；4- substrate；5- plastic packaging region；6- chip；7- third stream
Road；8- confluence region；The 4th runner of 9-.
[specific embodiment]
The invention will be described in further detail with reference to the accompanying drawing:
It is the conventional flow field structure chart that metaideophone forms IC package mold referring to Fig. 1, it can be seen from the figure that traditional runner
In structure injection moulding process plastic packaging material through runner flow to cast gate proximal end converge region, plastic packaging material through confluence region to cast gate distal end by
Gradually fill；The plastic packaging process of entire substrate 4 is from one end of substrate 4 to other end plastic packaging；So that entire plastic packaging process is molded road
Diameter is partially long, and the resistance of plastic packaging material flowing is larger.
Referring to fig. 2, the novel flow channel structure of IC package mold is formed for a kind of metaideophone that the present invention designs；The structure includes
Metaideophone slot 1, first runner 2, second flow channel 3, substrate 4, plastic packaging region 5, chip 6, third flow channel 7, confluence region 8 and the 4th stream
Road 9.Identical as traditional IC substrate, 6 fixed array of chip is on substrate 4, and entire runner design is in the top of substrate 4, runner
Including first runner 2 and third flow channel 7, first runner 2 and third flow channel 7 can be parallel to each other, can also be not parallel, if flat
Row, the flow distance of plastic packaging material is most short, and suffered resistance is minimum.First runner 2 is in the outside of 4 one end of substrate, so that first runner 2
On metaideophone slot 1 can be connected to the external device for providing injection molding material, third flow channel 7 is at the surface of 4 center line of substrate, center
Line can be cross central line or longitudinal centre line；First runner 2 is connected to third flow channel 7 by second flow channel 3, second flow channel
3 preferably perpendicular to first runner 2 or third flow channel 7, is provided with K second between first runner 2 and third flow channel 7 simultaneously
Road 3, the natural number that K is >=1, as K=1, the junction of second flow channel 3 and third flow channel 7 is at the center of third flow channel 7；
As K > 1, second flow channel 3 and the junction of third flow channel 7 etc. divide third flow channel 7.The lower surface setting of first runner 2 is along the
The length direction of one runner 2 is provided with M metaideophone slot 1, the natural number that M is >=2, and M metaideophone slot 1 opens up position equal part first
Runner 2, metaideophone slot 1 are connected to external plastic packaging material injection device, and end locating for metaideophone slot 1 is glue-feeder；Third flow channel 7
Lower surface is provided with N number of 4th runner 9, the natural number that N is >=2, N number of 4th runner 9 and third stream along the length direction of runner
The link position etc. in road 7 divides third flow channel 7, and the distance between the 4th adjacent runner 9 is equal；One end of 4th runner 9 and
Three runners 7 are fixedly connected, and the other end is towards the confluence region 8 on substrate 4, and region 8 of converging is at the laterally or longitudinally center of substrate 4
On line, confluence region 8 is parallel with 7 space of third flow channel；Array is disposed with chip 6 on substrate 4, is plastic packaging region between chip 6
5, plastic packaging region 5 is connected to confluence region 8.First runner 2, second flow channel 3 and third flow channel 7 are by upper mold and lower mold structure
At the upper mold and lower mold are metal material, such as copper, steel.
Injection moulding process of the invention:
Chip 6 is required according to arrangement, array is fixed on substrate 4, and the substrate 4 for being pasted with chip 6 is put into upper and lower mould
It in tool, is molded, high-pressure clamps mold closure, and when pressurization, injecting head is moved upwards；It, will using conventional plastic package method
Encapsulation capsulation material after preheating is full of die cavity via plunger indentation, and the device that outside provides injection molding material will be high by metaideophone slot 1
The plastic packaging material that temperature is melted enters in entire runner along first runner 2, is flow in third flow channel 7 by second flow channel 3, passes through third
Runner 7 expands to both sides to be calculated, and is flow in confluence region 8 by the 4th runner 9, and the plastic packaging material in region 8 of converging is simultaneously to the two of substrate 4
Filling plastic packaging region 5 is completed in a distal end flowing.
Preparation before present invention injection molding:
The first step carries out upper and lower Mold Making according to plastic packaging runner design, guarantees first-class after upper and lower mold clamping
Road 2, second flow channel 3, the use of third flow channel 7 and the 4th runner 9 are normal；
Second step, carries out the confluence region 8 inside substrate 4 and designs, and the design of cooperation runner and region of converging carries out substrate
4 Curve guide impeller simultaneously completes each process before the plastic packagings such as upper core.
It needs to complete component encapsulation after the hot setting of certain time after present invention injection molding.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of novel flow channel structure of metaideophone molding IC package mold characterized by comprising substrate (4), first runner
(2) it is connected to third flow channel (7) by K second flow channel (3) with third flow channel (7), first runner (2), the nature that K is >=1
Number；First runner (2) the outside of substrate (4), second flow channel (3) and third flow channel (7) substrate (4) top；Substrate (4)
Upper array is disposed with chip (6), is between chip (6) plastic packaging region (5), and confluence region is offered on the center line of substrate (4)
(8), confluence region (8) is connected to plastic packaging region (5), and third flow channel (7) is in the surface of confluence region (8), third flow channel (7)
It is parallel to confluence region (8)；The lower surface of first runner (2) is fixedly installed M metaideophone slot (1)；The following table of third flow channel (7)
Face is fixedly installed N number of 4th runner (9), and the lower end face of the 4th runner (9) is converged region (9), and M and N are >=2 nature
Number.
2. a kind of novel flow channel structure of metaideophone molding IC package mold according to claim 1, which is characterized in that substrate
(4) center line is any one of cross central line or longitudinal centre line.
3. a kind of novel flow channel structure of metaideophone molding IC package mold according to claim 1, which is characterized in that first
Runner (2) is parallel with third flow channel (7)；Second flow channel (3) is perpendicular to first runner (2).
4. a kind of novel flow channel structure of metaideophone molding IC package mold according to claim 1, which is characterized in that work as K
When=1, the junction of second flow channel (3) and third flow channel (7) is at the center of third flow channel (7)；As K > 1, second flow channel
(3) and third flow channel (7) are divided in the junction etc. of third flow channel (7).
5. a kind of novel flow channel structure of metaideophone molding IC package mold according to claim 1, which is characterized in that M
Metaideophone slot (1) is in lower surface of first runner (2) etc. point arrangement.
6. a kind of novel flow channel structure of metaideophone molding IC package mold according to claim 1, which is characterized in that N number of
4th runner (9) is in lower surface of third flow channel (7) etc. point arrangement.
7. a kind of novel flow channel structure of metaideophone molding IC package mold according to claim 1, which is characterized in that each
A metaideophone slot (1) is connected to the device of external offer injection molding material.
8. a kind of novel flow channel structure of metaideophone molding IC package mold described in -7 any one according to claim 1, special
Sign is that first runner (2), second flow channel (3) and third flow channel (7) are made of upper mold and lower mold, the upper mold and
Lower mold is metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811564573.1A CN109501149A (en) | 2018-12-20 | 2018-12-20 | A kind of novel flow channel structure of metaideophone molding IC package mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811564573.1A CN109501149A (en) | 2018-12-20 | 2018-12-20 | A kind of novel flow channel structure of metaideophone molding IC package mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109501149A true CN109501149A (en) | 2019-03-22 |
Family
ID=65753912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811564573.1A Pending CN109501149A (en) | 2018-12-20 | 2018-12-20 | A kind of novel flow channel structure of metaideophone molding IC package mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109501149A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010114388A (en) * | 2008-11-10 | 2010-05-20 | Powertech Technology Inc | Window type semiconductor package |
| CN201922536U (en) * | 2010-12-01 | 2011-08-10 | 桂林斯壮微电子有限责任公司 | Plastic sealing rubber die |
| CN102229227A (en) * | 2011-06-15 | 2011-11-02 | 深圳创维－Rgb电子有限公司 | Multilayer runner spreader plate with insert, hot runner system and insert manufacture method |
| CN102655098A (en) * | 2011-03-03 | 2012-09-05 | 三星电子株式会社 | Molding apparatus for semiconductor package |
| CN202846821U (en) * | 2012-08-31 | 2013-04-03 | 薛孝臣 | Flow channel for semiconductor plastic packaging mold |
| CN205264692U (en) * | 2015-12-08 | 2016-05-25 | 广东气派科技有限公司 | 15 IDF type SOP8 lead wire frame construction who arranges |
| CN108447843A (en) * | 2017-07-13 | 2018-08-24 | 睿力集成电路有限公司 | Window-type ball grid array package assembling |
| CN209534055U (en) * | 2018-12-20 | 2019-10-25 | 华天科技（西安）有限公司 | A kind of flow passage structure of metaideophone molding IC package mold |
-
2018
- 2018-12-20 CN CN201811564573.1A patent/CN109501149A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010114388A (en) * | 2008-11-10 | 2010-05-20 | Powertech Technology Inc | Window type semiconductor package |
| CN201922536U (en) * | 2010-12-01 | 2011-08-10 | 桂林斯壮微电子有限责任公司 | Plastic sealing rubber die |
| CN102655098A (en) * | 2011-03-03 | 2012-09-05 | 三星电子株式会社 | Molding apparatus for semiconductor package |
| CN102229227A (en) * | 2011-06-15 | 2011-11-02 | 深圳创维－Rgb电子有限公司 | Multilayer runner spreader plate with insert, hot runner system and insert manufacture method |
| CN202846821U (en) * | 2012-08-31 | 2013-04-03 | 薛孝臣 | Flow channel for semiconductor plastic packaging mold |
| CN205264692U (en) * | 2015-12-08 | 2016-05-25 | 广东气派科技有限公司 | 15 IDF type SOP8 lead wire frame construction who arranges |
| CN108447843A (en) * | 2017-07-13 | 2018-08-24 | 睿力集成电路有限公司 | Window-type ball grid array package assembling |
| CN209534055U (en) * | 2018-12-20 | 2019-10-25 | 华天科技（西安）有限公司 | A kind of flow passage structure of metaideophone molding IC package mold |
Non-Patent Citations (1)
| Title |
|---|
| 王春艳: "《塑料成型工艺与模具设计》", 机械工业出版社, pages: 102 - 178 * |
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