JPS609131A - Method for resin sealing of semiconductor device and apparatus thereof - Google Patents

Method for resin sealing of semiconductor device and apparatus thereof

Info

Publication number
JPS609131A
JPS609131A JP11588383A JP11588383A JPS609131A JP S609131 A JPS609131 A JP S609131A JP 11588383 A JP11588383 A JP 11588383A JP 11588383 A JP11588383 A JP 11588383A JP S609131 A JPS609131 A JP S609131A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
side
resin
resin material
injected
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11588383A
Other versions
JPH0342495B2 (en )
Inventor
Toyoshige Kawashima
Akihiro Kubota
Masao Takehiro
Eiji Yokota
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To enable to uniformly fill resin in each cavity as well as to enable to improve the yield of production by a method wherein an injection gate is formed by arrangement in such a manner that resin material will be poured in from the side reverse to the bonding wire assembling side. CONSTITUTION:The bottom force 31 and the top force 32 of a molding mold 30 are opened, a lead frame 17 is placed and arranged on the bottom force 31 in such a manner that a wire 19 will be positioned on the side reverse to the gate 35, and then the bottom force 31 and the top force 32 are butted together and arranged. Subsequently, the prescribed quantity of preheated resin material is supplied to each supply pot 33 respectively, the resin material supplied by a plunger 34 is pressure-injected to a cavity 36, and sealing resin is molded. A gate 35 from which resin will be injected into the cavity 36 is provided on the lower side of the lead frame 17, which is the assembled side of the bonding wire 19, and the resin material is pressure-injected from the lower side of the wire 19.
JP11588383A 1983-06-29 1983-06-29 Expired - Lifetime JPH0342495B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11588383A JPH0342495B2 (en) 1983-06-29 1983-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11588383A JPH0342495B2 (en) 1983-06-29 1983-06-29

Publications (2)

Publication Number Publication Date
JPS609131A true true JPS609131A (en) 1985-01-18
JPH0342495B2 JPH0342495B2 (en) 1991-06-27

Family

ID=14673536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11588383A Expired - Lifetime JPH0342495B2 (en) 1983-06-29 1983-06-29

Country Status (1)

Country Link
JP (1) JPH0342495B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6298733A (en) * 1985-10-25 1987-05-08 Rhythm Watch Co Ltd Resin sealing metallic mold for semiconductor device
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
US5064706A (en) * 1987-12-11 1991-11-12 Mitsubishi Denki Kabushiki Kaisha Carrier tape including molten resin flow path element for resin packaged semiconductor devices
US5200366A (en) * 1990-04-27 1993-04-06 Hitachi, Ltd. Semiconductor device, its fabrication method and molding apparatus used therefor
JP2007307769A (en) * 2006-05-17 2007-11-29 Kitagawa Ind Co Ltd Package of synthetic resin molded product and its manufacturing method
JP2013120914A (en) * 2011-12-09 2013-06-17 Semiconductor Components Industries Llc Manufacturing method of circuit device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6298733A (en) * 1985-10-25 1987-05-08 Rhythm Watch Co Ltd Resin sealing metallic mold for semiconductor device
US5064706A (en) * 1987-12-11 1991-11-12 Mitsubishi Denki Kabushiki Kaisha Carrier tape including molten resin flow path element for resin packaged semiconductor devices
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
US5096853A (en) * 1988-10-20 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing a resin encapsulated semiconductor device
US5200366A (en) * 1990-04-27 1993-04-06 Hitachi, Ltd. Semiconductor device, its fabrication method and molding apparatus used therefor
JP2007307769A (en) * 2006-05-17 2007-11-29 Kitagawa Ind Co Ltd Package of synthetic resin molded product and its manufacturing method
JP2013120914A (en) * 2011-12-09 2013-06-17 Semiconductor Components Industries Llc Manufacturing method of circuit device

Also Published As

Publication number Publication date Type
JPH0342495B2 (en) 1991-06-27 grant

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