JPS609131A - Method for resin sealing of semiconductor device and apparatus thereof - Google Patents

Abstract

PURPOSE:To enable to uniformly fill resin in each cavity as well as to enable to improve the yield of production by a method wherein an injection gate is formed by arrangement in such a manner that resin material will be poured in from the side reverse to the bonding wire assembling side. CONSTITUTION:The bottom force 31 and the top force 32 of a molding mold 30 are opened, a lead frame 17 is placed and arranged on the bottom force 31 in such a manner that a wire 19 will be positioned on the side reverse to the gate 35, and then the bottom force 31 and the top force 32 are butted together and arranged. Subsequently, the prescribed quantity of preheated resin material is supplied to each supply pot 33 respectively, the resin material supplied by a plunger 34 is pressure-injected to a cavity 36, and sealing resin is molded. A gate 35 from which resin will be injected into the cavity 36 is provided on the lower side of the lead frame 17, which is the assembled side of the bonding wire 19, and the resin material is pressure-injected from the lower side of the wire 19.

Description

Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to a method for manufacturing a semiconductor and an apparatus for manufacturing the same, and in particular, it relates to a method for manufacturing a semiconductor and a manufacturing apparatus for the same. The present invention relates to a method and apparatus for resin-sealing a semiconductor device.

Background of the technology In general, in the semiconductor manufacturing process, semiconductor chips (IC)
Packages (containers) for enclosing C-tic include those that are enclosed in a closed space (metallic packages, ceramic packages, etc.).
There are two types: motherboards, cages, etc.) and packages in which semiconductor chips are directly buried and sealed (resin-sealed packages, etc.). The latter direct embedding methods include: 1, using a mold and injecting resin under pressure into the mold to form the sealing resin; and 2) directly immersing the semiconductor with leads in liquid resin for sealing. There are ways to form resin.

Resin-sealed packages in which semiconductor chips are directly embedded and encapsulated using this mold are usually made by die-bonding semiconductor chips and f onto a metal lead frame, then applying wire bonding to the lead frame. is placed in a predetermined mold, and a thermosetting resin is injected into the mold under pressure to be molded. This mold is usually formed with a plurality of spaces (spaces in the shape of a molded product) called hollow cavities (spaces in the shape of a molded product) for accommodating and arranging the lead frame as described above, and these cavities are directly connected to each other. A narrow passage called a dart is formed to serve as an injection port, and a passage called a runner is formed that communicates with this dart.
Furthermore, a hole communicating with the runner is often formed. A preheated sealing resin material (thermosetting resin) is supplied to this hole (hereinafter referred to as a pot), and the supplied resin is pressurized into the cavity via the runner and dart by a plunger. The sealing resin is molded by injection. However, in this type of sealing resin molding, the resin remaining in each passage of the mold is wasted, and
Furthermore, since the resin that has flowed into the cavity directly contacts the thin bonding wire assembled to the lead frame, the wire may be deformed without causing any adverse effects. Therefore, there is a need for a method and device for resin-sealing semiconductor devices in the molding process of such a sealing resin, which has a good yield of resin material and does not have an adverse effect on the denting wire. has been done.

(c) Prior Art and Problems FIGS. 1 to 4 are diagrams for explaining a conventional resin sealing method and resin sealing apparatus for a semiconductor device. Fig. 1 is a partial plan view of the mold (lower mold) in the first conventional example, Fig. 2 is a cross-sectional view taken along the line A-A' in Fig. Figure 3 shows the mold (lower mold) in the second conventional example.
FIG. 4 is a sectional view taken along the line B-B' in FIG. 3 (
However, the state in which the upper molds are placed abutting each other is shown. In Figures 1 and 2, numeral 10 indicates the mold, and 11
12 is the lower mold, 12 is the upper mold, 13 is the supply pot (corresponding to the cull part of the molded product), 14 is the runner, 15 is the injection dart, 16
17 is a cavity, 17 is a lead frame 1.17a is a die stage formed integrally with the lead frame (17), 18 is a semiconductor chip, and 19 is a bonding wire. In the case of this conventional example, as shown in FIG. 10 for one runner
The individual cavities 16 are arranged and formed, and the runner 1
4 and the cavity 16 are communicated via an injection goose 15. Note that a pot (not shown) is also formed on the upper mold 2 in correspondence with the pot 13 provided on the lower mold 11.

The cavity 16 is formed by providing recesses in the mold surfaces of the lower mold 11 and the upper ff 112, respectively. The lead frame 17 has a semiconductor chip 18 assembled thereon in advance and a wire 19 bonded thereto. Now, as a resin sealing procedure in this conventional example, first, the mold lO is opened, and the lower mold 11 is
A lead frame 16 is accommodated in each cavity 16, and then an upper mold 12 is placed against the lower mold 11. Thereafter, a preheated resin material (thermosetting resin) is supplied into the supply pot 13, and the resin material is pressed by a plunger (not shown) to pass through the runner 14 and goo 15 into each cavity. Inject under pressure into 16. In this way, the sealing resin in which the semiconductor chip flB and the bonding wire 19 are directly embedded is molded in each cavity 16. However, this conventional example has the following problems.

■ Cavity 1 formed close to supply bottle) 13
Due to the large difference in filling time of the resin material between the resin material 6 and the cavity 16 at the end, a difference in viscosity of the filled resin occurs, which may result in incompletely filled cavities and often result in defective products. .

■ Since the resin remaining in the supply bottle) 13 (comparable to the molded material) and the runner 14 is wasted, the yield of the resin material (raw material is very low (bad 9°) ■ Cavity 1
As shown in FIG. 2, the flow of resin flowing into the wire 19 flows into the wire 19 from the lateral direction (direction of arrow C), so the wire 19 is swept away and the resin flows along the dotted line 19.
As a result, the wires 19 or the wires 19 and the semiconductor chip 18 may come into contact with each other and cause a short circuit (a phenomenon called wire unrow may occur). .

Next, a second conventional example shown in FIGS. 3 and 4 will be explained. This conventional example is a multi-plunger one-type resin sealing method. In both of these figures, the same parts as in the above-mentioned FIGS. 1 and 2 are given the same reference numerals. Therefore, the symbol 2o indicates a mold, 21 is a lower mold, 22 is an upper mold, 2
3 is a clam pot.

Reference numerals 2 and 24 indicate silangers, and other symbols indicate the same parts as in FIGS. 1 and 2. In the case of this conventional example, a large number of pots 23 are provided, and a plunger 24 is disposed corresponding to each pot 23, forming a so-called multiple plunger type. For each supply pot 23, a total of two cavities 16 are provided, one on each side via the injection goo 15 (in addition, there may be cases where there are four cavities 16 for one pot 23). be). Therefore, in this conventional example, the runner 14 is omitted compared to the first conventional example (FIGS. 1 and 2), and the runner 14 in the first conventional example is omitted. The difference is that multiple pairs of supply ports 23 and plungers 24 are provided in place of the knot 3 and the silanger. Incidentally, the resin sealing procedure is performed in substantially the same manner as in the conventional example described above. However, although this conventional example has the advantage of being able to solve the problems in section 2 and section 0 of the first conventional example (Figs. 1 and 2), it still has the problem The drawback is that it cannot be resolved.

B) Purpose of the Invention In view of the problems of the prior art, the purpose of the present invention is to completely fill all the cavities with the resin for the side stop;
It is possible to greatly improve the yield of resin materials, prevent short circuits caused by bonding wires or bonding wires and semiconductor chips coming into contact with each other, and further reduce the number of cavities. An object of the present invention is to provide a resin sealing method and a resin sealing apparatus for semiconductor devices that can increase the number of semiconductor devices.

(e) Configuration of starting j And in order to achieve this objective, according to the present invention,
When a lead frame to which a semiconductor chip is attached and wire bonding has been performed is sealed with resin, a plurality of cavities for accommodating the lead frame are formed in an array, and these cavities are connected to each other via injection darts. A matching mold is prepared in which supply pots are individually formed, a lead frame is housed and arranged in each cavity, a sealing resin is supplied into each supply pot, and then the sealing resin is There is provided a method for resin-sealing a semiconductor device, characterized in that resin-sealing is carried out by injecting a semiconductor device under pressure into the cavity.

Further, according to the present invention, a large number of cavities are arranged and formed in the molds arranged vertically against each other, and in each cavity,
A lead frame with a semiconductor chip mounted thereon and wire bonded thereon is accommodated, and the sealing resin supplied into the pot communicating with the cavity is injected under pressure into the cavity by a plunger to seal the resin of the semiconductor device. In a resin sealing apparatus for a semiconductor device configured to perform a sealing process, each of the cavities is provided with an injection dart, and a supply pot that directly communicates with the injection dart is individually arranged and formed, and each of the cavities is provided with an injection dart. A resin sealing device for a semiconductor device is provided, which is characterized in that plungers are arranged in correspondence with each other.

(F) Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

5 to 7 are diagrams for explaining the present invention in detail. FIG. 5 is a schematic plan view of a mold (lower mold) in a resin sealing apparatus for a semiconductor device according to the present invention, and FIG. 6 is a sectional view taken along line D-D' of FIG. state)
, FIG. 7 is a partially enlarged detailed view of FIG. 6 (however, the upper molds are arranged together). In these figures, the same parts as in FIGS. 2 and 4 (both conventional examples) are given the same reference numerals. Therefore, numeral 17 is a lead frame, 17a is a die stethoscope, 18 is a semiconductor chip, and 19 is a die stethoscope.
teeth? 30 is a mold in the resin sealing device of the present invention, 31 is a lower mold, 32 is an upper mold, and 33
is the supply pot (the part corresponding to the cull of the molded product), 34 is the plunger, 35 is the injection dart, 36 is the cavity,
Reference numeral 37 indicates a vent (air vent gap). still,
In this case, the lead frame 17 is formed so as to simultaneously include 10 left half cavities and 10 right half cavities (dotted chain line portion) in FIG. It consists of two sheets. In this embodiment, as shown in the figure, a plurality of lower cavities 36 (in this case, a total of 20 m) are formed in an array on the mold surface of the lower mold 31.
An injection gate 35 is formed in communication with the cavity 36 in a direction perpendicular to the horizontal direction of the cavity 36, and a supply pot 33 is formed coaxially with and in communication with the injection dart 36. That is, each cavity 36
Supply pots 33 are formed individually corresponding to each of the
A plunger 34 (only one plunger is shown in FIG. 6 as a representative) is provided corresponding to each of these supply pots 33.

In this way, by arranging the supply pot 33 that communicates substantially directly with the cavities 36, it is possible to increase the number of cavities 36 for the mold in the same area. Incidentally, the cavity 36 is formed by providing a recess in each of the mold surfaces of the lower mold 31 and the upper mold 32. Further, the tip end (suppressing surface) of the plunger 34 is formed to match the bottom shape of the supply pot 33, as clearly shown in FIG. Therefore, approximately 100% of the resin material supplied into the pot 33 is extruded by the Noranger 34. Furthermore, the injection gate 35 is formed to have a very short path length, as also clearly shown in FIG. This is designed to ensure that the amount of resin material remaining in the dart 35 is extremely small. Now,
The procedure of the resin sealing process in this embodiment is performed in substantially the same manner as in the case of the second conventional example shown in FIG. 3 mentioned above. That is, the lower mold 31 and upper mold 32 of gold m30 are opened,
The lead frame 17 is connected to the wire 19 as shown in FIG.
is housed in the lower die 31 so that it is located on the opposite side of the gate 35, and then the lower die 31 and the upper die are placed against each other. Thereafter, a predetermined amount of the preheated resin material is supplied to each supply pot 33. At this time, the plunger 34
3), then the resin material supplied by the plunger 34 is injected into the cavity 36 under pressure to form a sealing resin. In this way, in this embodiment, the r-t 35 injected into the cavity 36 is
As shown in the figure, it is provided on the lower side of the lead frame 17, that is, on the opposite side to the side where the ending wire 19 is assembled, and is configured such that the resin material is injected under pressure from the lower side of the wire 19.

Therefore, since the injected resin material flows in the direction of tensing the wires 19 (in the direction of arrow E), the wires 19 are deformed and the wires 19 or the wires 19 and the semiconductor chip come into contact, completely eliminating the risk of short circuit (jaw torn). Furthermore, as described above, the supply pot 33 and the plunger 34 are arranged individually corresponding to each cavity 36, and the shape of the tip of the plunger 34 and the bottom of the pot 33 is In this embodiment, the amount of resin material remaining in the pot 33 can be minimized, and each cavity 3
It is possible to completely eliminate the difference in filling time of the resin material with respect to No. 6. It should be noted that the present invention is not limited to the above embodiment, and for example, it is easily possible to arrange the supply pot 33 and the granger 34 on the upper mold 32 in the opposite manner to the above embodiment. Furthermore, the present invention may be applied to other hairstyle examples without departing from the spirit of the invention.

(g) Effects of the Invention As explained in detail above, the resin sealing method and resin sealing apparatus for a semiconductor device according to the present invention individually disposes a supply pot and a plunger corresponding to each cavity, In addition, an injection dart is arranged and formed so that the resin material flows into the lead frame, which is housed in the cavity and has the semiconductor chip and the bonding wire assembled thereto, from the direction opposite to the side where the bonding wire is attached. In particular, the resin material can be filled uniformly and completely into all cavities, greatly improving the yield of the resin material, and completely preventing deformation of the bonding wire (wire flow) when filling the resin material. This has great effects, such as being able to prevent this from occurring and increasing the number of cavities for a mold with the same area.Furthermore, it improves product yield and reliability. It can bring about

[Brief explanation of the drawing]

Fig. 1 is a partial plan view of a mold (lower mold) for explaining the first conventional example, and Fig. 2 is a cross-sectional view taken along the line A-A' in Fig. 1 (however, the upper mold is placed abutting Figure 3 is a partial plan view of the mold (lower mold) for explaining the second conventional example, and Figure 4 is a sectional view taken along line BB' in Figure 3 (however, the upper mold is FIG. 5 is a schematic plan view of the mold (lower mold) in the resin sealing apparatus for semiconductor devices according to the present invention, and FIG. 6 is a sectional view taken along the line DD' in FIG. upper mold placed close together),
Fig. 7 is a partially enlarged detailed view of the 6th prisoner (however, the upper mold is arranged in abutment). 17... lead frame, 17a... formed integrally with the lead frame (17) Dice stage, 18
... semiconductor chip, 19... bonding wire,
30...Mold, -31...Lower mold, 32...Upper mold,
33... Resin material supply pot, 34... Granger, 35... Injection dart, 36... Cavity,
37...Vent (air vent gap).

Claims (1)

[Claims] 1. When sealing with resin a lead frame to which a semiconductor chip is attached and wire endings are formed, a plurality of cavities for accommodating the lead frame are arranged and formed, and each of these cavities is Prepare a mating mold in which supply pots communicating with each cavity via injection darts are individually formed, a lead frame is housed and arranged in each cavity, and then a sealing resin is supplied into each supply pot. A method for resin-sealing a semiconductor device, characterized in that the sealing resin is then injected into the cavity under pressure to perform resin-sealing. 2. A plurality of cavities are arranged and formed in a mold that is arranged vertically against each other, each cavity houses a lead frame on which a semiconductor chip is attached and wire bonding is performed, and is connected to the cavity. In a resin sealing apparatus for a semiconductor device configured to carry out a resin sealing process of a semiconductor device by injecting a sealing resin supplied into a pot that communicates with the plunger into a pot under pressure, each of the above-mentioned An injection dart is provided in each cavity, and a supply pot that communicates directly with the injection dart is individually arranged and formed, and each of the cavities is provided with an injection dart.
A resin sealing device for semiconductor devices characterized by the fact that plungers are arranged corresponding to the respective positions.