CN202846821U - Flow channel for semiconductor plastic packaging mold - Google Patents
Flow channel for semiconductor plastic packaging mold Download PDFInfo
- Publication number
- CN202846821U CN202846821U CN 201220442396 CN201220442396U CN202846821U CN 202846821 U CN202846821 U CN 202846821U CN 201220442396 CN201220442396 CN 201220442396 CN 201220442396 U CN201220442396 U CN 201220442396U CN 202846821 U CN202846821 U CN 202846821U
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- CN
- China
- Prior art keywords
- main body
- runner
- flow channel
- tail end
- semi
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model relates to a flow channel for a semiconductor plastic packaging mold. The flow channel comprises a flow channel main body and a plurality of flow channel outlets which are uniformly distributed in the two sides of the flow channel main body, wherein one end of the flow channel main body is a feeding end, and the other end of the flow channel main body is a tail end. The flow channel is characterized in that the opening of the feeding end is greater than that of the tail end. Because the feeding end of the flow channel is large while the tail end of the flow channel is small, enough flow can be ensured, simultaneously, the pressure of the tail end can be increased to reduce material amount, and the flow channel not only facilitates product filling but also improves filling quality so as to reduce production cost.
Description
Technical field
The utility model relates to a kind of runner of plastic packaging film, more particularly, thereby relates to a kind of runner that forms Semi-conductor plastic capsulation mould for filling epoxy resin.
Background technology
Developed into the stage that competition turns white-hot semi-conductive, a lot of semiconductor producers want to enhance competitiveness, but have in the face of the relative contradiction between the quality and cost.But the quality that has improved product has increased cost, and this has just reduced the price advantage of product.Fig. 1 is the runner of Semi-conductor plastic capsulation mould in the prior art.The width in the same size of its feed end and tail end, this just causes preferentially obtaining at the die cavity at feed end place the filling of epoxy resin, tail end can not get enough pressure and causes filling the appearance of incomplete problem, thereby has affected product quality, has wasted again running channel epoxy resin.
The utility model content
The technical problems to be solved in the utility model is, for the defects of prior art, provides a kind of runner of Semi-conductor plastic capsulation mould.
The technical scheme that its technical problem that solves the utility model adopts is: the runner of constructing a kind of Semi-conductor plastic capsulation mould, comprise runner main body and a plurality of runner exit that is evenly distributed on described runner main body both sides, and described runner main body one end is feed end, the other end is tail end, and the opening of described feed end is greater than the opening of described tail end.
Runner for Semi-conductor plastic capsulation mould described in the utility model, wherein, described runner main body cross section in the longitudinal direction is stepped.
Runner for Semi-conductor plastic capsulation mould described in the utility model, wherein, described runner main body comprises first flow main body, the second runner main body that is communicated with described first flow main body and the 3rd runner main body that is communicated with described the second runner main body at least, and the width of described first flow main body, the second runner main body and the 3rd runner main body successively decreases successively.
Runner for Semi-conductor plastic capsulation mould of the present utility model, wherein, the openings of sizes of described feed end and/or described tail end reduces gradually along the direction that is fed to discharging.
Implement the runner of Semi-conductor plastic capsulation mould of the present utility model, has following beneficial effect: because the feed end of runner is large, and tail end is little, therefore can be when guaranteeing enough flows, increase the pressure of tail end and reduce its materials amount, not only be conducive to the filling of product but also be conducive to improve filling quality, thereby reduced production cost.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of Semi-conductor plastic capsulation mould runner in the prior art;
Fig. 2 is the structural representation of a kind of runner preferred embodiment for Semi-conductor plastic capsulation mould of the utility model;
Fig. 3 is a kind of runner preferred embodiment runner main body cross sectional representation in the longitudinal direction for Semi-conductor plastic capsulation mould of the utility model.
The specific embodiment
As shown in Figure 2, in preferred embodiment of the present utility model, the runner that should be used for Semi-conductor plastic capsulation mould comprises runner main body 100 and a plurality of runner exit 101 that is evenly distributed on runner main body 100 both sides, the corresponding processed product 200 in each runner exit 101 place, and runner main body 100 1 ends are feed end 102, the other end is tail end 103, and the opening of feed end 101 is greater than the opening 103 of tail end.Epoxy resin is filled from the feed end 101 of runner main body 100, arrive each processed product 200 by each runner exit 101 successively, because the opening of feed end 101 is greater than the opening 103 of tail end, therefore when guaranteeing the epoxy resin flow, tail end 103 can increase pressure when materials reduce, make the processed product 200 that is positioned at tail end can access sufficient filling, therefore improved product quality, saved cost of material.
As shown in Figure 3, preferably, above-mentioned runner main body 100 cross section in the longitudinal direction is stepped.From another angle, above-mentioned stepped runner main body 100 comprises first flow main body 104, the second runner main body 105 that is communicated with first flow main body 104 and the 3rd runner main body 106 that is communicated with the second runner main body 105 at least, and the width of first flow main body 104, the second runner main body 105 and the 3rd runner main body 106 successively decreases (as shown in Figure 2) successively.The width of first flow main body 104, the second runner main body 105 and the 3rd runner main body 106 successively decreases successively and is conducive to the processing of whole runner main body 100, and further, in runner main body 100 cross-sectional illustration shown in Figure 3, be transitioned into the position of the second runner main body 105 and can process suitably gradient from the position that the second runner main body 105 is transitioned into the 3rd runner main body 106 from first flow main body 104, so that the transition of runner main body 100 is more natural.
Preferably, be further to increase feed pressure, the openings of sizes of feed end 102 and/or tail end 103 can be designed to the form that reduces gradually along the direction that is fed to discharging.
Runner for Semi-conductor plastic capsulation mould of the present utility model has the following advantages:
1, the opening of feed end is conducive to increase the pressure of tail end greater than the opening of tail end, is conducive to filling product, reduces the epoxy resin materials of Semi-conductor plastic capsulation mould, reduces cost, improves the price advantage of product.
2, be conducive to improve the service life of semiconductor plastic package die.
3, widely applicable, be applicable to all semiconductors and IC plastic package die.
Above embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with technique can understand content of the present utility model and accordingly enforcement, can not limit protection domain of the present utility model.All equalizations of doing with the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.
Claims (4)
1. runner that is used for Semi-conductor plastic capsulation mould, comprise runner main body (100) and a plurality of runner exit (101) that is evenly distributed on described runner main body (100) both sides, and described runner main body (100) one ends are feed end (102), the other end is tail end (103), it is characterized in that, the opening of described feed end (102) is greater than the opening of described tail end (103).
2. the runner for Semi-conductor plastic capsulation mould according to claim 1 is characterized in that, described runner main body (100) cross section in the longitudinal direction is stepped.
3. the runner for Semi-conductor plastic capsulation mould according to claim 2, it is characterized in that, described runner main body (100) comprises first flow main body (104), the second runner main body (105) that is communicated with described first flow main body (104) and the 3rd runner main body (106) that is communicated with described the second runner main body (105) at least, and the width of described first flow main body (104), the second runner main body (105) and the 3rd runner main body (106) successively decreases successively.
4. the runner for Semi-conductor plastic capsulation mould according to claim 1 is characterized in that, the openings of sizes of described feed end (102) and/or described tail end (103) reduces gradually along the direction that is fed to discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220442396 CN202846821U (en) | 2012-08-31 | 2012-08-31 | Flow channel for semiconductor plastic packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220442396 CN202846821U (en) | 2012-08-31 | 2012-08-31 | Flow channel for semiconductor plastic packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202846821U true CN202846821U (en) | 2013-04-03 |
Family
ID=47978057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220442396 Expired - Fee Related CN202846821U (en) | 2012-08-31 | 2012-08-31 | Flow channel for semiconductor plastic packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202846821U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109501149A (en) * | 2018-12-20 | 2019-03-22 | 华天科技（西安）有限公司 | A kind of novel flow channel structure of metaideophone molding IC package mold |
-
2012
- 2012-08-31 CN CN 201220442396 patent/CN202846821U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109501149A (en) * | 2018-12-20 | 2019-03-22 | 华天科技（西安）有限公司 | A kind of novel flow channel structure of metaideophone molding IC package mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20140831 |
|
| EXPY | Termination of patent right or utility model |