CN202651073U - Integrated circuit plastic packaging mold for preventing horizontal material overflow at cored hole - Google Patents
Integrated circuit plastic packaging mold for preventing horizontal material overflow at cored hole Download PDFInfo
- Publication number
- CN202651073U CN202651073U CN 201220298830 CN201220298830U CN202651073U CN 202651073 U CN202651073 U CN 202651073U CN 201220298830 CN201220298830 CN 201220298830 CN 201220298830 U CN201220298830 U CN 201220298830U CN 202651073 U CN202651073 U CN 202651073U
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- mold insert
- core
- hole
- integrated circuit
- plastic packaging
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Abstract
The utility model discloses an integrated circuit plastic packaging mold for preventing horizontal material overflow at a cored hole. The integrated circuit plastic packaging mold comprises an upper insert seat, a lower insert seat, an upper forming insert, a lower forming insert and a core, wherein the cored hole is formed in the center of a contact position of the upper forming insert and the lower forming insert; a step-shaped through hole is formed in the lower forming insert; the core is positioned in the step-shaped through hole; and the upper end surface of the core is elastically extruded on the surface of the upper forming insert forming the cored hole. The integrated circuit plastic packaging mold is in a gapless state in a filling process, the thickness of the horizontal material overflow of a packaged product is not increased, the horizontal material overflow is convenient to remove, and production efficiency is substantially increased.
Description
Technical field
The utility model relates to the integrated circuit plastic packaging molds, especially with the encapsulating mould of core.
Background technology
The integrated circuit plastic packaging molds is widely used in the encapsulation of integrated circuit, as shown in Figure 1, integrated circuit plastic packaging molds commonly used comprises mold insert seat 1, lower mold insert seat 5, at superimposed upper moulding mold insert 3 and compacted under mold insert 4 and core 2 between the mold insert seat up and down, upper moulding mold insert 3 and center, compacted under mold insert 4 contact position are provided with cored hole 7, compacted under mold insert 4 is provided with the stairstepping through hole, core 2 is positioned at the stairstepping through hole, in order to control the horizontal flash of the rear cored hole periphery of product encapsulation, must control the fit-up gap A size between core 2 and the upper moulding mold insert 3, the A size is the smaller the better, but in the actual processing, A size and compacted under mold insert 4 height D sizes, the depth of cavity B size of upper moulding mold insert 3 and core 2 height C sizes are relevant, in order to ensure the A size less than the minimum of the plastic packaging material boundary values of overflowing, to B, D, the allowance control of C size is very tight, processing cost is high, and constantly washing away of plastic packaging material causes core 2 top end faces constantly to wear and tear in the use procedure, spacing A size between core 2 tops and the upper moulding mold insert 3 can become large gradually, the horizontal flash thickness of final products increases, remove difficulty, affected production efficiency.
The utility model content
The purpose of this utility model is exactly that solution integrated circuit plastic packaging molds is large because of the spacing between core top and the upper moulding mold insert, so that Product Level flash thickness increases, removes hard problem.
The technical solution adopted in the utility model is: a kind of integrated circuit plastic packaging molds that prevents horizontal flash, it comprises mold insert seat, lower mold insert seat, at superimposed upper moulding mold insert and compacted under mold insert and core between the mold insert seat up and down, upper moulding mold insert and center, compacted under mold insert contact position are provided with cored hole, the compacted under mold insert is provided with the stairstepping through hole, described core is positioned at the stairstepping through hole, it is characterized in that described core upper surface elasticity is squeezed on the upper moulding mold insert face of cored hole.
Adopt technique scheme, because the core upper surface is adjacent to the die cavity bottom surface of upper moulding mold insert all the time, be in the gapless state in stowing operation, the Product Level flash thickness that therefore encapsulates out can not increase.
The bottom surface of the above-mentioned larger end of stairstepping through-hole diameter and be provided with the gap between the corresponding surface of the core end of larger end is provided with spring between core bottom surface and the lower mold insert seat, realizes that core upper surface elasticity is squeezed on the upper moulding mold insert face of cored hole.
Above-mentioned spring is butterfly spring, has better effect.
Also be provided with the gap between the above-mentioned larger end of core diameter and the inwall of shoulder hole, can guarantee that so more the core upper surface is squeezed on the moulding mold insert all the time.
In sum, the utility model beneficial effect is: because the core upper surface is adjacent to the die cavity bottom surface of upper moulding mold insert all the time, be in the gapless state in stowing operation, the Product Level flash thickness that encapsulates out can not increase, it is convenient to remove, and has greatly increased production efficiency.
Description of drawings
Fig. 1 is known integrated circuit plastic packaging molds schematic diagram.
Fig. 2 is the utility model schematic diagram.
Among the figure, 1, upper mold insert seat, 2, core, 3, upper moulding mold insert, 4, the compacted under mold insert, 5, lower mold insert seat, 6, butterfly spring, 7, cored hole, 8, the stairstepping through hole.
Embodiment
Present embodiment as shown in Figure 2, it comprises mold insert seat 1, lower mold insert seat 5, at superimposed upper moulding mold insert 3 and compacted under mold insert 4 and core 2 between the mold insert seat up and down, upper moulding mold insert 3 and center, compacted under mold insert 4 contact position are provided with cored hole 7, compacted under mold insert 4 is provided with stairstepping through hole 8, core 2 is positioned at stairstepping through hole 8, the bottom surface of the larger end of stairstepping through hole 8 diameters and between the corresponding surface of the core end of larger end, be provided with the gap, be provided with spring 6 between core 2 bottom surfaces and the lower mold insert seat 5, realize that core 2 upper surface elasticity are squeezed on 3 of the upper moulding mold inserts of cored hole.The optimal way of spring 6 is butterfly spring.Also be provided with the gap between the inwall of the larger end of core 2 diameters and shoulder hole.
The utility model arranges spring 6 between the bottom of core 2 countersunk heads and lower mold insert seat 5, under the effect of spring 6 precompressions, core 2 upper surfaces are adjacent to the die cavity bottom surface of upper moulding mold insert 3 all the time, are in the gapless state in stowing operation.On size Control, need guarantee has certain gap between core 2 countersunk heads and the counter sink degree of depth, E size among Fig. 2 is fully dodged, and avoids interfering, and the simultaneously design of spring 6 decrements need be considered the impact of the dimensional tolerance of core 2 height C sizes and upper impression depth B size.By such processing, the relative traditional structure of machining accuracy for core 2 height C sizes and upper impression depth B size no longer includes high request on the one hand, has reduced processing cost; The cored hole of encapsulating products periphery is guaranteed the quality requirements of encapsulating products without horizontal flash on the other hand.
Claims (4)
1. integrated circuit plastic packaging molds that prevents the horizontal flash in cored hole place, it comprises mold insert seat (1), lower mold insert seat (5), at superimposed upper moulding mold insert (3) and compacted under mold insert (4) and core (2) between the mold insert seat up and down, upper moulding mold insert (3) and compacted under mold insert (4) center, contact position are provided with cored hole (7), compacted under mold insert (4) is provided with stairstepping through hole (8), described core is positioned at stairstepping through hole (8), it is characterized in that described core (2) upper surface elasticity is squeezed on upper moulding mold insert (3) face that consists of cored hole.
2. the integrated circuit plastic packaging molds that prevents the horizontal flash in cored hole place according to claim 1, it is characterized in that the bottom surface of the larger end of described stairstepping through hole (8) diameter and between the corresponding surface of the core end of larger end, be provided with the gap, be provided with spring (6) between core (2) bottom surface and the lower mold insert seat (5), realize that core (2) upper surface elasticity is squeezed on upper moulding mold insert (3) face of cored hole.
3. the integrated circuit plastic packaging molds that prevents the horizontal flash in cored hole place according to claim 1 and 2 is characterized in that described spring (6) is butterfly spring.
4. the integrated circuit plastic packaging molds that prevents the horizontal flash in cored hole place according to claim 3 is characterized in that also being provided with the gap between the inwall of the larger end of described core diameter and shoulder hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220298830 CN202651073U (en) | 2012-06-26 | 2012-06-26 | Integrated circuit plastic packaging mold for preventing horizontal material overflow at cored hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220298830 CN202651073U (en) | 2012-06-26 | 2012-06-26 | Integrated circuit plastic packaging mold for preventing horizontal material overflow at cored hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202651073U true CN202651073U (en) | 2013-01-02 |
Family
ID=47420137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220298830 Expired - Fee Related CN202651073U (en) | 2012-06-26 | 2012-06-26 | Integrated circuit plastic packaging mold for preventing horizontal material overflow at cored hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202651073U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738020A (en) * | 2012-06-26 | 2012-10-17 | 铜陵三佳山田科技有限公司 | Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole |
| CN114571664A (en) * | 2022-02-28 | 2022-06-03 | 邵周明 | Flash removing device and method for semiconductor chip packaging |
-
2012
- 2012-06-26 CN CN 201220298830 patent/CN202651073U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738020A (en) * | 2012-06-26 | 2012-10-17 | 铜陵三佳山田科技有限公司 | Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole |
| CN114571664A (en) * | 2022-02-28 | 2022-06-03 | 邵周明 | Flash removing device and method for semiconductor chip packaging |
| CN114571664B (en) * | 2022-02-28 | 2024-01-16 | 广东风华芯电科技股份有限公司 | Flash removing device and method for semiconductor chip packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20180626 |