CN202549798U - Novel semiconductor packaging die - Google Patents
Novel semiconductor packaging die Download PDFInfo
- Publication number
- CN202549798U CN202549798U CN2012200669248U CN201220066924U CN202549798U CN 202549798 U CN202549798 U CN 202549798U CN 2012200669248 U CN2012200669248 U CN 2012200669248U CN 201220066924 U CN201220066924 U CN 201220066924U CN 202549798 U CN202549798 U CN 202549798U
- Authority
- CN
- China
- Prior art keywords
- packaging
- die
- mold insert
- novel semiconductor
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to a die, in particular to a novel semiconductor packaging die, comprising an upper die plate (1), a lower die plate (2), a packaging substrate (3), a packaging member (4) and a packaging insert (5), wherein between the upper die plate (1) and the lower die plate (2) there is provided a packaging substrate (3), inside the lower die plate (20 there is provided the packaging member (4), and the outer side of the packaging member (4) is provided with the packaging insert (5). The novel semiconductor packaging die is convenient in use and simple in package, is provided with the packaging insert, and enables the packaging insert to be directly replaced when the die is damaged, without replacing the whole die, thereby saving cost.
Description
Technical field:
The utility model relates to a kind of mould, is specifically related to a kind of novel semi-conductor encapsulating mould.
Background technology:
Along with improving constantly of semiconductor technology level; The encapsulation components and parts develop to the direction of " light, thin, short, little ", and the mould in the semiconductor packages moulding has direct influence as core component to product, but when semiconductor dies uses easily appearance wear and tear; Therefore cause packaging part to go wrong easily; Need the die package part all be changed, so not only trouble also causes the fund waste.
The utility model content:
The purpose of the utility model provides a kind of novel semi-conductor Encapsulation Moulds, and it is easy to use, and encapsulation is simple, is provided with the encapsulation mold insert, directly will encapsulate the mold insert replacing after mould damages and get final product, and does not need whole replacings, has practiced thrift fund.
In order to solve the existing problem of background technology; The utility model is taked following technical scheme: it comprises cope match-plate pattern 1, lower bolster 2, base plate for packaging 3, packaging part 4 and encapsulation mold insert 5; Be provided with base plate for packaging 3 between cope match-plate pattern 1 and the lower bolster 2; Be provided with packaging part 4 in the lower bolster 2, packaging part 4 arranged outside have encapsulation mold insert 5.
The utlity model has following beneficial effect: it is easy to use, and encapsulation is simple, is provided with the encapsulation mold insert, directly will encapsulate the mold insert replacing after mould damages and get final product, and does not need whole replacings, has practiced thrift fund.
Description of drawings:
Fig. 1 is the structural representation of the utility model.
Embodiment:
With reference to Fig. 1; This embodiment is taked following technical scheme: it comprises cope match-plate pattern 1, lower bolster 2, base plate for packaging 3, packaging part 4 and encapsulation mold insert 5; Be provided with base plate for packaging 3 between cope match-plate pattern 1 and the lower bolster 2; Be provided with packaging part 4 in the lower bolster 2, packaging part 4 arranged outside have encapsulation mold insert 5.
This embodiment is easy to use, and encapsulation is simple, is provided with the encapsulation mold insert, directly will encapsulate the mold insert replacing after mould damages and get final product, and does not need whole replacings, has practiced thrift fund.
Claims (1)
1. novel semi-conductor encapsulating mould; It is characterized in that it comprises cope match-plate pattern (1), lower bolster (2), base plate for packaging (3), packaging part (4) and encapsulation mold insert (5); Be provided with base plate for packaging (3) between cope match-plate pattern (1) and the lower bolster (2); Be provided with packaging part (4) in the lower bolster (2), packaging part (4) arranged outside has encapsulation mold insert (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200669248U CN202549798U (en) | 2012-02-28 | 2012-02-28 | Novel semiconductor packaging die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200669248U CN202549798U (en) | 2012-02-28 | 2012-02-28 | Novel semiconductor packaging die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202549798U true CN202549798U (en) | 2012-11-21 |
Family
ID=47170385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200669248U Expired - Fee Related CN202549798U (en) | 2012-02-28 | 2012-02-28 | Novel semiconductor packaging die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202549798U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107696422A (en) * | 2017-11-06 | 2018-02-16 | 环维电子(上海)有限公司 | A kind of plastic package die and plastic package method |
-
2012
- 2012-02-28 CN CN2012200669248U patent/CN202549798U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107696422A (en) * | 2017-11-06 | 2018-02-16 | 环维电子(上海)有限公司 | A kind of plastic package die and plastic package method |
| CN107696422B (en) * | 2017-11-06 | 2023-10-13 | 环维电子(上海)有限公司 | Plastic packaging mold and plastic packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121121 Termination date: 20140228 |