CN102151389A - Method for manufacturing golf ball and golf ball manufactured by same - Google Patents
Method for manufacturing golf ball and golf ball manufactured by same Download PDFInfo
- Publication number
- CN102151389A CN102151389A CN2011100691608A CN201110069160A CN102151389A CN 102151389 A CN102151389 A CN 102151389A CN 2011100691608 A CN2011100691608 A CN 2011100691608A CN 201110069160 A CN201110069160 A CN 201110069160A CN 102151389 A CN102151389 A CN 102151389A
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- protective layer
- spheroid
- outside
- rfid chip
- adhesive linkage
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Abstract
The invention relates to a method for manufacturing a golf ball. The method is characterized by comprising the following steps: (1) primary encapsulating: forming a rigid protective layer outside an RFID (radio frequency identification device) chip; (2) the secondary encapsulating: forming a bonding layer outside the protective layer; (3) ball molding: casting and molding a rubber ball outside the bonding layer; (4) shell molding: casting and molding a shell outside the ball. The method has the advantages that because the melting point of the bonding layer outside the high-temperature resisting protective layer is basically identical to the temperature of the material of the rubber ball, when the rubber ball is casted and molded, an epoxy resin bonding agent of the bonding layer is melted, while the high-temperature resisting protective layer at the inner side is not melted and plays a role of heat insulation; the gap between the molded rubber ball and the encapsulated protective layer can be filled with the melted bonding layer, the rubber ball and the protective layer can be melted tougher tightly, the combination is firm, and shock-proof property is strengthened; additionally, by adding the binding layer, the insulation effect is strengthened and damage rate of the radio frequency electronic chip is reduced.
Description
Technical field
The present invention relates to a kind of manufacture method of golf and the golf that adopts the method to make, be mainly used in the golf that production training and amusement are used.
Background technology
Existing be used to train golf with the entertainment place mainly to be included in to be packaged with radio frequency electric chip (RFID) in the flexible spheroid, and the radio frequency electric chip is solidificated in the hard shell that shields (mainly being the protective layer that epoxy resin is formed); And then adopt injection moulding that the rubber ball material is injected in the hard shell mould on every side, force cooling forming.Because the ball material temperature higher (being generally 130～150 ℃) of melting, in order not influence the hard shell of radio frequency electric chip when the injection moulding, temperature when the heatproof of hard shell need be higher than injection moulding, this just causes welding well between hard shell and the golf ball body, and bond strength is not high; And because the heat-proof quality of hard shell is relatively poor, the heat when causing injection moulding may damage the radio frequency electric chip.
Summary of the invention
The present invention aims to provide a kind of manufacture method of golf and the golf of making thus, and is not high with hard shell and the bond strength between the golf ball body that solves the radio frequency electric chip that prior art exists; And because the heat-proof quality of hard shell is relatively poor, the heat when causing injection moulding may damage the problem of radio frequency electric chip.
Technical scheme of the present invention is: a kind of manufacture method of golf, it is characterized in that, and comprise following processing step:
(1) embedding for the first time: the protective layer that forms hard in the outside of RFID chip;
(2) embedding for the second time: the outside at described protective layer forms adhesive linkage;
(3) spheroid moulding: at the outside of described adhesive linkage cast molding rubber spheroid;
(4) outer casing forming: at the outside of described spheroid cast molding shell.
The operating process of the described embedding first time is: the groove that is provided with diameter 16-18mm, dark 5mm on first mould; In the groove of mould, pour the epoxy encapsulation agent of 160～180 ℃ of the heatproofs of about 2mm successively into; insert the RFID chip; on the RFID chip, cover the epoxy encapsulation agent of 160～180 ℃ of the above-mentioned heatproofs of one deck again; promptly obtain described protective layer behind the cooling curing, the RFID chip that has this protective layer is first packaging body.
The operating process of the described embedding second time is: the groove that is provided with diameter 17-20mm, dark 7mm on second mould; In this groove, pour the epoxy encapsulation agent of 130～150 ℃ of the heatproofs of about 1mm successively into, insert described first packaging body, cover the epoxy encapsulation agent of 130～150 ℃ of the above-mentioned heatproofs of one deck again above first packaging body at this, promptly obtain described adhesive linkage behind the cooling curing, first packaging body that has this adhesive linkage is second packaging body.
In the described spheroid moulding process, ball material adopts butadiene rubber and some mixtures, and the melting point of ball material is 130-150 ℃; The mould that adopts is made of upper die and lower die, and its central authorities are provided with spherical hollow space; When mold temperature is controlled at 130-150 ℃, with the cast molding method ball material is injected counterdie for the first time; Place second packaging body in the ball material upper central of injecting counterdie, cover patrix; For the second time adopt horizontal injection press to be injected in the patrix with the material of injection moulding with surplus rubber spheroid; Behind cooling forming, obtain the semi-finished product spheroid.
The operating process of described outer casing forming is: insert in the vertical molding machine mould at described semi-finished product spheroid, resin mixed material is coated on the external table of ball with injection moulding, cooling curing forms shell.
A kind of golf of being made by the manufacture method of described golf comprises described shell, spheroid and RFID chip, and the RFID chip is located at the center of spheroid, is provided with shell at the outer surface of spheroid; Outside at the RFID chip is coated with protective layer, it is characterized in that, is provided with adhesive linkage in described protective layer outside, and this adhesive linkage adopts the epoxy encapsulation agent of 130～150 ℃ of heatproofs; Described protective layer adopts the epoxy encapsulation agent of 160～180 ℃ of heatproofs.
The diameter of described RFID chip is 14～16mm, and thickness is 0.5～1.5mm; The thickness of protective layer is 1～3mm.
The thickness of described adhesive linkage is 0.5～2mm.
Advantage of the present invention is: because the temperature of the melting point of the adhesive linkage outside the resistant to elevated temperatures protective layer and rubber ball material is basic identical, when injection moulding rubber spheroid, the epoxyn of adhesive linkage melts, and inboard resistant to elevated temperatures protective layer (epoxy encapsulation agent) does not melt, and plays heat insulation effect; Slit between the rubber spheroid that the adhesive linkage that melts can fill up moulding and the protective layer of encapsulation makes the two tight weld, in conjunction with firm, has strengthened shock resistance; And the adhesive linkage of increase has strengthened heat-blocking action, has reduced the spoilage of radio frequency electric chip.
Description of drawings
Fig. 1 is a process chart of the present invention;
Fig. 2 is the sectional structure schematic diagram of golf of the present invention;
Fig. 3 is the A-A cutaway view of Fig. 2.
The specific embodiment
Referring to Fig. 1～Fig. 3, a kind of manufacture method of golf is characterized in that, comprises the processing step that next coming in order carry out:
(1) embedding for the first time: form the protective layer 4 of hard in the outside of RFID chip 5, RFID chip 5 comprises IC chip and the antenna that is solidificated on the circuit board;
(2) embedding for the second time: the outside at described protective layer 4 forms adhesive linkage 3;
(3) spheroid moulding: at the outside of described adhesive linkage 3 cast molding rubber spheroid 2;
(4) outer casing forming: at the outside of described spheroid 2 cast molding shell 1.
The operating process of the described embedding first time (1) is: the groove that is provided with diameter 16-18mm, dark 5mm on first mould; In the groove of mould, pour the epoxy encapsulation agent of 160～180 ℃ of the heatproofs of about 2mm successively into; insert RFID chip 5; on RFID chip 5, cover the epoxy encapsulation agent of 160～180 ℃ of the above-mentioned heatproofs of one deck again; promptly obtain described protective layer 4 behind the cooling curing, this protective layer 4 and RFID chip 5 are formed first packaging body.
The operating process of the described embedding second time (2) is: the groove that is provided with diameter 17-20mm, dark 7mm on second mould; In this groove, pour the epoxy encapsulation agent of 130～150 ℃ of the heatproofs of about 1mm successively into, insert described first packaging body, cover the epoxy encapsulation agent of 130～150 ℃ of the above-mentioned heatproofs of one deck again above first packaging body at this, promptly obtain described adhesive linkage 3 behind the cooling curing, this adhesive linkage 3 and first packaging body constitute second packaging body.The epoxy resin of different heatproofs can directly have been bought in market.
In described spheroid moulding (3) technology, ball material adopts butadiene rubber and some mixtures, and the melting point of ball material is 130-150 ℃; The mould that adopts is made of upper die and lower die, and its central authorities are provided with spherical hollow space; When mold temperature is controlled at 130-150 ℃, adopt horizontal injection press ball material to be injected counterdie with the cast molding method; Place second packaging body in the ball material upper central of injecting counterdie, cover patrix; Be injected in the patrix with the material of injection moulding again surplus rubber spheroid; Behind cooling forming, obtain the semi-finished product spheroid.
The operating process of described parcel shell (4) is: insert in the vertical molding machine mould at described semi-finished product spheroid, resin mixed material is coated on spheroid 2 appearances with injection moulding, cooling curing forms shell 1.
A kind of novel golf of the present invention comprises shell 1, spheroid 2, protective layer 4 and RFID chip 5, and RFID chip 5 is located at the center of spheroid 2, is provided with shell 1 at the outer surface of spheroid 2, is coated with protective layer 4 in the outside of RFID chip 5.It is characterized in that, be provided with adhesive linkage 3 in described protective layer 4 outsides, this adhesive linkage 3 adopts the epoxy encapsulation agent of 130～150 ℃ of heatproofs; Described protective layer 4 adopts the epoxy encapsulation agent of 160～180 ℃ of heatproofs.
The diameter of described RFID chip 5 is 14～16mm, and thickness is 0.5～1.5mm; The thickness of protective layer 4 is 1～3mm; The thickness of adhesive linkage 3 is 0.5～2mm.
Various material and facilities involved in the present invention are prior art.The kind of the material by changing rubber spheroid 2 can be produced the golf that can float on the water surface that meets international standard.
Claims (8)
1. the manufacture method of a golf is characterized in that, comprises following processing step:
(1) embedding for the first time: the protective layer that forms hard in the outside of RFID chip;
(2) embedding for the second time: the outside at described protective layer forms adhesive linkage;
(3) spheroid moulding: at the outside of described adhesive linkage cast molding rubber spheroid;
(4) outer casing forming: at the outside of described spheroid cast molding shell.
2. the manufacture method of golf according to claim 1 is characterized in that, the operating process of the described embedding first time is: the groove that is provided with diameter 16-18mm, dark 5mm on first mould; In the groove of mould, pour the epoxy encapsulation agent of 160～180 ℃ of the heatproofs of about 2mm successively into; insert the RFID chip; on the RFID chip, cover the epoxy encapsulation agent of 160～180 ℃ of the above-mentioned heatproofs of one deck again; promptly obtain described protective layer behind the cooling curing, the RFID chip that has this protective layer is first packaging body.
3. the manufacture method of golf according to claim 1 is characterized in that, the operating process of the described embedding second time is: the groove that is provided with diameter 17-20mm, dark 7mm on second mould; In this groove, pour the epoxy encapsulation agent of 130～150 ℃ of the heatproofs of about 1mm successively into, insert described first packaging body, cover the epoxy encapsulation agent of 130～150 ℃ of the above-mentioned heatproofs of one deck again above first packaging body at this, promptly obtain described adhesive linkage behind the cooling curing, first packaging body that has this adhesive linkage is second packaging body.
4. the manufacture method of golf according to claim 3 is characterized in that, in the described spheroid moulding process, ball material adopts butadiene rubber and some mixtures, and the melting point of ball material is 130-150 ℃; The mould that adopts is made of upper die and lower die, and its central authorities are provided with spherical hollow space; When mold temperature is controlled at 130-150 ℃, with the cast molding method ball material is injected counterdie for the first time; Place second packaging body in the ball material upper central of injecting counterdie, cover patrix; For the second time adopt horizontal injection press to be injected in the patrix with the material of injection moulding with surplus rubber spheroid; Behind cooling forming, obtain the semi-finished product spheroid.
5. the manufacture method of golf according to claim 4, it is characterized in that, the operating process of described outer casing forming is: insert in the vertical molding machine mould at described semi-finished product spheroid, resin mixed material is coated on the external table of ball with injection moulding, and cooling curing forms shell.
6. a golf of being made by the manufacture method of any one described golf of claim 1～5 comprises described shell, spheroid and RFID chip, and the RFID chip is located at the center of spheroid, is provided with shell at the outer surface of rubber spheroid; Outside at the RFID chip is coated with protective layer, it is characterized in that, is provided with adhesive linkage in described protective layer outside, and this adhesive linkage adopts the epoxy encapsulation agent of 130～150 ℃ of heatproofs; Described protective layer adopts the epoxy encapsulation agent of 160～180 ℃ of heatproofs.
7. golf according to claim 6 is characterized in that, the diameter of described RFID chip is 14～16mm, and thickness is 0.5～1.5mm; The thickness of protective layer is 1～3mm.
8. novel golf according to claim 6 is characterized in that, the thickness of described adhesive linkage is 0.5～2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100691608A CN102151389A (en) | 2011-03-22 | 2011-03-22 | Method for manufacturing golf ball and golf ball manufactured by same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100691608A CN102151389A (en) | 2011-03-22 | 2011-03-22 | Method for manufacturing golf ball and golf ball manufactured by same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102151389A true CN102151389A (en) | 2011-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100691608A Pending CN102151389A (en) | 2011-03-22 | 2011-03-22 | Method for manufacturing golf ball and golf ball manufactured by same |
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| Country | Link |
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| CN (1) | CN102151389A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103083876A (en) * | 2011-11-03 | 2013-05-08 | 林茂宪 | Golf ball structure with rubber recovery function and manufacturing method thereof |
| CN103302782A (en) * | 2013-04-23 | 2013-09-18 | 上海欣展橡胶有限公司 | Method for bonding colored part and white part of phenolic resin billiard |
| CN104998385A (en) * | 2015-07-14 | 2015-10-28 | 程有福 | Method for implanting chip in ball |
| CN103418118B (en) * | 2012-05-17 | 2015-11-18 | 邓禄普体育用品株式会社 | The manufacture method of golf |
| CN105582658A (en) * | 2014-10-24 | 2016-05-18 | 明扬国际科技股份有限公司 | Manufacturing method of golf ball and finished product of the manufacturing method |
| TWI548439B (en) * | 2014-09-26 | 2016-09-11 | The method of manufacturing golf and its products | |
| CN110465055A (en) * | 2019-08-27 | 2019-11-19 | 梵高夫科技控股(深圳)有限公司 | Golf |
-
2011
- 2011-03-22 CN CN2011100691608A patent/CN102151389A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103083876A (en) * | 2011-11-03 | 2013-05-08 | 林茂宪 | Golf ball structure with rubber recovery function and manufacturing method thereof |
| CN103418118B (en) * | 2012-05-17 | 2015-11-18 | 邓禄普体育用品株式会社 | The manufacture method of golf |
| CN103302782A (en) * | 2013-04-23 | 2013-09-18 | 上海欣展橡胶有限公司 | Method for bonding colored part and white part of phenolic resin billiard |
| TWI548439B (en) * | 2014-09-26 | 2016-09-11 | The method of manufacturing golf and its products | |
| CN105582658A (en) * | 2014-10-24 | 2016-05-18 | 明扬国际科技股份有限公司 | Manufacturing method of golf ball and finished product of the manufacturing method |
| CN105582658B (en) * | 2014-10-24 | 2017-12-15 | 明扬国际科技股份有限公司 | The manufacture method and its product of golf |
| CN104998385A (en) * | 2015-07-14 | 2015-10-28 | 程有福 | Method for implanting chip in ball |
| CN110465055A (en) * | 2019-08-27 | 2019-11-19 | 梵高夫科技控股(深圳)有限公司 | Golf |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110817 |