CN101577236B - Epoxy resin encapsulating die of substrate flip-chip type electronic device and encapsulating method thereof - Google Patents
Epoxy resin encapsulating die of substrate flip-chip type electronic device and encapsulating method thereof Download PDFInfo
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- CN101577236B CN101577236B CN2009100330246A CN200910033024A CN101577236B CN 101577236 B CN101577236 B CN 101577236B CN 2009100330246 A CN2009100330246 A CN 2009100330246A CN 200910033024 A CN200910033024 A CN 200910033024A CN 101577236 B CN101577236 B CN 101577236B
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Abstract
The invention discloses an epoxy resin encapsulating die of a substrate flip-chip type electronic device, which comprises an upper template, an intermediate template and a lower template, and is characterized in that the inner lateral surface of the upper template is provided with a vacuum wire slot, and simultaneously the upper template is connected with a vacuum tube so as to adsorb a substrate which is fixedly pasted with a chip; the inner lateral surface of the upper template is provided with positioning pins corresponding to positioning holes on the substrate, the intermediate template and the lower template; the upper template is provided with epoxy resin pouring holes corresponding to the pouring holes on the substrate and the intermediate template; the middle of the intermediate template is provided with one or more cavities for pouring epoxy resin glue, and the thickness of the intermediate template is the thickness of a packaged electronic device; and the upper surface of thelower template is a polished surface, and the lower template is provided with a fixing device for fixing the whole set of the die. The surface quality of an epoxy resin encapsulated device produced b y the epoxy resin encapsulating die is improved obviously.
Description
Technical field
The present invention relates to a kind of electronic device epoxy resin encapsulating die and encapsulating method thereof of substrate flip-chip type, belong to the microelectronic device package field.
Background technology
The develop rapidly of Electronic Packaging technology has promoted the development of encapsulating material, is the main Plastic Package that turns to from the metal in past and ceramic packaging.Advantages such as because it is relatively cheap that Plastic Package has price, moulding process is simple, is fit to large-scale production, and reliability and ceramic packaging are suitable have accounted for more than 95% of whole encapsulating material.
The dielectric property of epoxy resin, mechanical property, adhesive property, excellent anti-corrosion performance, cure shrinkage and linear expansion coefficient are little, dimensional stability is good, good manufacturability, combination property is splendid, more, make it possible to obtain almost to adapt to the epoxy material that various specialized performances require, thereby it is widely used in field of electronics owing to the flexibility and the diversity of the design of epoxy material prescription.And its growth is very violent.The liquid-state epoxy resin compound is normal to adopt mechanical or manual mode to be poured in electronic component, the device, and the heat that is solidified into excellent performance under normal temperature or heating condition is because of the property insulating polymeric material.Its effect is: the globality of strengthening electronic device, improve the resistance to external shock, vibrations; Improve between inner member, circuit and insulate, help device miniaturization, lightweight; Avoid element, circuit directly to expose, improve waterproof, the humidity resistance of device.
Poured with epoxy resin is that epoxy resin, curing agent and other batches are poured in the mould of setting, is become the process of product by thermoplastic liquid's crosslinking curing.The problem that epoxy resin embedding product is easy to occur has apparent problem, and apparent problem mainly shows as bubble, cracking, defective, distortion etc.Epoxy resin embedding product apparent mass need be controlled mold design by strictness, pouring technology waits and realizes.
Summary of the invention
Technical problem to be solved by this invention provides a kind of electronic device epoxy resin encapsulating die and encapsulating method thereof of obtaining the electronics plastic device of high-quality profile.
For solving the problems of the technologies described above, the invention provides a kind of electronic device epoxy resin encapsulating die of substrate flip-chip type, comprise cope match-plate pattern, intermediate die plate and lower bolster, it is characterized in that: the medial surface at described cope match-plate pattern offers the vacuum wire casing, cope match-plate pattern links to each other with vacuum tube simultaneously, be used to adsorb the substrate that fixed table posts chip, medial surface at described cope match-plate pattern is provided with alignment pin, and and substrate, intermediate die plate, location hole on the lower bolster is corresponding, described cope match-plate pattern is provided with the poured with epoxy resin hole, and with substrate on plug hole, the plug hole of intermediate die plate is corresponding;
The centre of described intermediate die plate has one or more cavitys that are used for casting epoxy resin glue, and the thickness of intermediate die plate is the thickness of packaged electronic device;
Described lower bolster upper surface is a polished surface, and lower bolster is provided with and the cope match-plate pattern corresponding positioning hole, makes cope match-plate pattern, intermediate die plate and lower bolster three location, and lower bolster is provided with the fixture that a whole set of mould is fixing simultaneously.
The method that the present invention provides a kind of electronic device epoxy resin encapsulating die that utilizes the aforesaid substrate flip-over type to carry out embedding simultaneously is characterized in that may further comprise the steps:
1) utilizes the substrate of the good chip of vacuum wire casing absorption upside-down mounting of cope match-plate pattern
(a) substrate is attached on the cope match-plate pattern, utilizes alignment pin on the cope match-plate pattern and the location hole on the substrate that both are had good positioning;
(b) cope match-plate pattern connects vacuum substrate is adsorbed;
(c) plug hole of cope match-plate pattern is corresponding with the plug hole on the substrate;
2) intermediate die plate and lower bolster are combined and are formed the embedding cavity
(a) on intermediate die plate and lower bolster, evenly apply release agent, make the easier demoulding behind the epoxide-resin glue water cure;
(b) utilize the alignment pin on the cope match-plate pattern that cope match-plate pattern and intermediate die plate are fixed together, form the embedding cavity of glue, the plug hole of intermediate die plate is aimed at the plug hole of cope match-plate pattern;
3) substrate is upside down on the embedding cavity
(a) utilize fixture that a whole set of mould is fixed;
4) inject epoxy resin glue by plug hole, elevated temperature solidifies epoxy resin cure the back cooling and more a plurality of electronic encapsulation device demouldings of array arrangement is taken out
(a) injecting condition according to epoxy resin glue carries out preliminary drying with mould, and the temperature of mould reaches the temperature that is fit to cast;
(b) inject epoxy resin glue by the top pouring hole, after the glue chip package that array mounts on the embedding cavity flows substrate, glue flows out from plug hole;
(c) on heating station, carry out hot setting according to the specification requirement of epoxy resin glue;
(d) solidify the back cooling, the electronic device demoulding of packaged a plurality of array arrangements is taken out.
The beneficial effect that the present invention reached:
Utilize the electronic device epoxy resin encapsulating die and the encapsulating method thereof of substrate flip-chip type of the present invention, electronic device is being poured into a mould in the embedding process with epoxy resin glue, in order to obtain the plastic device of high-quality profile, adopt the injecting glue technology of flip-over type, use in conjunction with mould, utilize vacuum to be upside down in the cavity of encapsulating die base plate for packaging, after injecting epoxy resin glue in the plug hole, its mould smooth along the bottom is flowed in mould cavity, and the epoxy resin glue that touches lower surface is heated earlier and carries out even curing of glue, and the surface quality of epoxy resin embedding device is obviously improved.
Description of drawings
Fig. 1 is the structural representation of cope match-plate pattern among the present invention;
Fig. 2 is the structural representation of intermediate die plate among the present invention;
Fig. 3 is the structural representation of lower bolster among the present invention;
Fig. 4 is cope match-plate pattern and the substrate schematic diagram that is fixed together in the encapsulating method process of the present invention;
Fig. 5 is that intermediate die plate and lower bolster are combined schematic diagram in the encapsulating method process of the present invention;
Fig. 6 be in the encapsulating method process of the present invention with the cope match-plate pattern upside-down mounting in cavity and with a whole set of die assembly schematic diagram;
Fig. 7 solidifies back cooling and demolding schematic diagram in the encapsulating method process of the present invention.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing.
Fig. 1 to Fig. 3 is respectively the structural representation of cope match-plate pattern, intermediate die plate and lower bolster among the present invention.The electronic device epoxy resin encapsulating die of a kind of substrate flip-chip type of the present invention, comprise cope match-plate pattern 1, intermediate die plate 2 and lower bolster 3, it is characterized in that: the medial surface at described cope match-plate pattern 1 offers vacuum wire casing 13, cope match-plate pattern 1 links to each other with vacuum tube 12 simultaneously, be used to adsorb the substrate 4 that fixed table posts chip 5, medial surface at described cope match-plate pattern 1 is provided with alignment pin 11, and with substrate 4, intermediate die plate 2 is corresponding with the location hole on the lower bolster 3, described cope match-plate pattern 1 is provided with poured with epoxy resin hole 14, and with substrate on plug hole, the plug hole 24 of intermediate die plate is corresponding;
The centre of described intermediate die plate 2 has one or more cavitys 22 that are used for casting epoxy resin glue, and the thickness of intermediate die plate is the thickness of packaged electronic device, has the location hole 21 of intermediate die plate on the intermediate die plate 2.
Described lower bolster 3 upper surfaces are polished surface, and lower bolster 3 is provided with and cope match-plate pattern 1 corresponding positioning hole 31, make cope match-plate pattern 1, intermediate die plate 2 and lower bolster 3 threes location, and lower bolster 3 is provided with the fixture 32 that a whole set of mould is fixing simultaneously.
The material of described cope match-plate pattern 1, intermediate die plate 2 and lower bolster 3 can be selected steel, iron, aluminum alloy materials.
The plug hole 24 of described intermediate die plate is provided with two at each cavity place, and is positioned at the diagonal positions of each cavity.
Encapsulating die utilizes the injecting glue technology of flip-over type, and the electronic device of array arrangement is carried out embedding, obtains the epoxy resin embedding device on high-quality surface.The alignment pin of cope match-plate pattern is used for itself and substrate, intermediate die plate and lower bolster are positioned, and has vacuum wire casing absorption substrate on it, and it can smoothly be attached on the cope match-plate pattern.The thickness of intermediate die plate is the thickness that is used for controlling the can device.The lower bolster surface is polished so that embedding device high-quality surface.
Fig. 4 to Fig. 6 is an encapsulating die assembling process schematic diagram, earlier substrate is fixed by the alignment pin of location hole and upper substrate, and the plug hole of mould and substrate is corresponding, opens vacuum suction and lives substrate; Middle substrate and infrabasal plate are combined by location hole, formed the embedding cavity; On middle template and lower bolster, evenly apply release agent; With cope match-plate pattern together with substrate flip-chip in cavity, a whole set of die assembly is fixed.
Fig. 7 solidifies back cooling and demolding schematic diagram in the encapsulating method process of the present invention.
First-selection is placed on preheating on the heating station with the mould that combines, preheat temperature is determined according to the epoxy resin glue pouring condition, in plug hole energy injection ring epoxy resins, epoxy resin glue is flowed in cavity naturally, wait epoxy resin glue after an interior end plug hole flows out, to stop the glue cast.The mould that cast is good is placed on the heating station of higher temperature and solidifies, and curing temperature is determined by the condition of cure of epoxy resin glue.After the epoxy resin glue full solidification, take out from heating station, when being cooled to room temperature, the electronic device of the array arrangement that plastic packaging is good takes out.
Described baseplate material adopts rigidity pcb board or flexible PCB plate, can carry out the Surface Mount routing of chip or the interconnection that reverse installation process is finished chip and substrate on the PCB substrate.
In described step 2) in, described release agent adopts oiliness or dryness release agents such as silicone oil, wax.
In described step 4), described epoxy resin is the epoxy resin that contains cilicon oxide filler.
In the operating temperature range of heating station described in the described step 4) is room temperature to 250 ℃, satisfies the requirement of epoxy resin cure.
Claims (9)
1. the electronic device epoxy resin encapsulating die of a substrate flip-chip type, comprise cope match-plate pattern (1), intermediate die plate (2) and lower bolster (3), it is characterized in that: the medial surface at described cope match-plate pattern (1) offers vacuum wire casing (13), cope match-plate pattern (1) links to each other with vacuum tube (12) simultaneously, medial surface at described cope match-plate pattern (1) is provided with alignment pin (11), and with substrate (4), intermediate die plate (2), location hole on the lower bolster (3) is corresponding, described cope match-plate pattern (1) is provided with poured with epoxy resin hole (14), and with substrate on plug hole, the plug hole of intermediate die plate (24) is corresponding;
The centre of described intermediate die plate (2) has one or more cavitys (22) that are used for casting epoxy resin glue, and the thickness of intermediate die plate is the thickness of packaged electronic device;
Described lower bolster (3) upper surface is a polished surface, and lower bolster (3) is provided with the fixture (32) that a whole set of mould is fixing.
2. the electronic device epoxy resin encapsulating die of substrate flip-chip type according to claim 1, it is characterized in that: the material of described cope match-plate pattern (1), intermediate die plate (2) and lower bolster (3) is steel, iron or aluminum alloy materials.
3. the electronic device epoxy resin encapsulating die of substrate flip-chip type according to claim 1 and 2, it is characterized in that: the plug hole of described intermediate die plate (24) is provided with two at each cavity place, and is positioned at the diagonal positions of each cavity.
4. method that the electronic device epoxy resin encapsulating die that utilizes the described substrate flip-chip type of claim 1 carries out embedding is characterized in that may further comprise the steps:
1) utilizes the substrate of the good chip of vacuum wire casing absorption upside-down mounting of cope match-plate pattern
(a) substrate is attached on the cope match-plate pattern, utilizes alignment pin on the cope match-plate pattern and the location hole on the substrate that both are had good positioning;
(b) cope match-plate pattern connects vacuum substrate is adsorbed;
(c) plug hole of cope match-plate pattern is corresponding with the plug hole on the substrate;
2) intermediate die plate and lower bolster are combined and are formed the embedding cavity
(a) on intermediate die plate and lower bolster, evenly apply release agent, make the easier demoulding behind the epoxide-resin glue water cure;
(b) utilize the alignment pin on the cope match-plate pattern that cope match-plate pattern and intermediate die plate are fixed together, form the embedding cavity of glue, the plug hole of intermediate die plate is aimed at the plug hole of cope match-plate pattern;
3) substrate is upside down on the embedding cavity
(a) utilize fixture that a whole set of mould is fixed;
4) inject epoxy resin glue by plug hole, elevated temperature solidifies epoxy resin cure the back cooling and more a plurality of electronic encapsulation device demouldings of array arrangement is taken out
(a) injecting condition according to epoxy resin glue carries out preliminary drying with mould, and the temperature of mould reaches the temperature that is fit to cast;
(b) inject epoxy resin glue by the top pouring hole, after the glue chip package that array mounts on the embedding cavity flows substrate, glue flows out from plug hole;
(c) on heating station, carry out hot setting according to the specification requirement of epoxy resin glue;
(d) solidify the back cooling, the electronic device demoulding of packaged a plurality of array arrangements is taken out.
5. encapsulating method according to claim 4 is characterized in that: described baseplate material is rigidity pcb board or flexible PCB plate.
6. according to claim 4 or 5 described encapsulating methods, it is characterized in that: in described step 2) in, described release agent is oiliness or dryness release agent.
7. according to claim 4 or 5 described encapsulating methods, it is characterized in that: in described step 4), described epoxy resin is the epoxy resin that contains cilicon oxide filler.
8. encapsulating method according to claim 6 is characterized in that: in described step 4), described epoxy resin is the epoxy resin that contains cilicon oxide filler.
9. according to claim 4 or 5 described encapsulating methods, it is characterized in that: in the operating temperature range of heating station described in the described step 4) is room temperature to 250 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100330246A CN101577236B (en) | 2009-06-08 | 2009-06-08 | Epoxy resin encapsulating die of substrate flip-chip type electronic device and encapsulating method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100330246A CN101577236B (en) | 2009-06-08 | 2009-06-08 | Epoxy resin encapsulating die of substrate flip-chip type electronic device and encapsulating method thereof |
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| CN101577236A CN101577236A (en) | 2009-11-11 |
| CN101577236B true CN101577236B (en) | 2011-01-12 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103022721B (en) * | 2011-09-28 | 2015-07-22 | 深圳光启高等理工研究院 | Packaging mould of metamaterial board |
| CN104816264B (en) * | 2015-04-10 | 2017-02-01 | 成都国光电气股份有限公司 | Forming clamp for potted composite heat conduction materials of traveling-wave tube and method for potting composite materials |
| CN105281706B (en) * | 2015-11-06 | 2018-05-25 | 江苏长电科技股份有限公司 | A kind of SAW filter encapsulating structure and manufacturing method |
| CN106182584A (en) * | 2016-08-18 | 2016-12-07 | 中国人民解放军海军医学研究所 | For encapsulating the injection moulding process of underwater installation |
| CN106876355A (en) * | 2017-02-23 | 2017-06-20 | 日月光封装测试(上海)有限公司 | Base plate for packaging ball grid array and the spherical grid array package body using the substrate |
| CN110211804A (en) * | 2019-05-14 | 2019-09-06 | 安徽博微智能电气有限公司 | Coil glue-pouring device and method |
| CN113843115B (en) * | 2021-09-22 | 2022-09-23 | 浙江华帅特新材料科技有限公司 | Mold for substrate surface functionalization and substrate surface functionalization method |
| CN115910610B (en) * | 2023-03-09 | 2023-09-15 | 成都宏明电子股份有限公司 | High-voltage film capacitor for space traveling wave tube and filling and sealing mould |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101056754A (en) * | 2004-11-12 | 2007-10-17 | 松下电器产业株式会社 | Resin-sealed mold and resin-sealed device |
| CN101271850A (en) * | 2007-03-19 | 2008-09-24 | 富士通株式会社 | Resin sealing method, mold for resin sealing, and resin sealing apparatus |
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2009
- 2009-06-08 CN CN2009100330246A patent/CN101577236B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101056754A (en) * | 2004-11-12 | 2007-10-17 | 松下电器产业株式会社 | Resin-sealed mold and resin-sealed device |
| CN101271850A (en) * | 2007-03-19 | 2008-09-24 | 富士通株式会社 | Resin sealing method, mold for resin sealing, and resin sealing apparatus |
Non-Patent Citations (1)
| Title |
|---|
| JP平6-314717A 1994.11.08 |
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