CN104816264B - Forming clamp for potted composite heat conduction materials of traveling-wave tube and method for potting composite materials - Google Patents
Forming clamp for potted composite heat conduction materials of traveling-wave tube and method for potting composite materials Download PDFInfo
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- CN104816264B CN104816264B CN201510167979.6A CN201510167979A CN104816264B CN 104816264 B CN104816264 B CN 104816264B CN 201510167979 A CN201510167979 A CN 201510167979A CN 104816264 B CN104816264 B CN 104816264B
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- Prior art keywords
- wave tube
- composite heat
- travelling
- conducting material
- heat conducting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constitution Of High-Frequency Heating (AREA)
Abstract
The invention discloses a forming clamp for potted composite heat conduction materials of a traveling-wave tube, and a method for potting the composite materials. The forming clamp comprises two bondage plates, screws and grooves, and screw through holes for being fixedly connected with the screws are further formed in the bondage plates; the screw through holes are formed in the grooves, and threaded holes are formed in high frequency circuit supporting seats on a traveling-wave tube substrate; and through the depth of the grooves and cooperation of the high frequency circuit supporting seats on the traveling-wave tube substrate, the forming position of the composite heat conduction materials is set. Through the technical scheme, the composite heat conduction materials of the potted traveling-wave tube are controlled within the designed range, and the mechanical means is not required to be used for removing redundant composite heat conduction materials; and the damage of vibration and impact generated in the process of removing the redundant composite heat conduction materials to the traveling-wave tube is avoided.
Description
Technical field
The present invention relates to a kind of fixture and its using method, specifically one kind are used for travelling-wave tube embedding composite heat-conducting material
The shaping jig of material and the method for embedding composite.
Background technology
Electronic devices and components operationally need to radiate, the particularly electronic devices and components of high power density, and electronic devices and components dissipate
The quality of hot measure directly influences the reliability of electronic devices and components, life-span, or even the electrical quantity that can affect electronic devices and components.
The radiating of electronic devices and components, is the important step in electronic devices and components design, the high frequency of embedding composite heat conducting material to travelling-wave tube
During slow wave region, need composite heat conducting material is fettered, if the constraint method of traditional Embedding Material is applied to compound
Heat Conduction Material embedding, first when tamping composite heat conducting material, the certain extrusion stress of generation of composite heat conducting material offside wall,
Binding plate is promoted to shift, the composite heat conducting material after embedding exceeds scope of design, the subsequent handling of impact Subsequent electronic components and parts；
Secondly when carrying out heat treatment to composite heat conducting material, due to the thermal expansion of composite heat conducting material itself, binding plate is promoted to shift,
Composite heat conducting material after embedding exceeds scope of design, also can affect the subsequent handling of Subsequent electronic components and parts, many in order to remove
Remaining composite heat conducting material, generally uses hammer, unnecessary part rejected by chisel, when serious, or even it is unnecessary to need milling machine car to fall
Composite heat conducting material, then just carry out subsequent handling.During rejecting unnecessary composite heat conducting material, to electronic devices and components
Create vibration, impulse machine damages, the performance of impact electronic devices and components, even result in electronic devices and components and damage.
Content of the invention
The present invention is directed to the problems referred to above, there is provided a kind of shaping jig for travelling-wave tube embedding composite heat conducting material and filling
The method of envelope composite.
Present disclosure is: a kind of shaping jig for travelling-wave tube embedding composite heat conducting material, described shaping jig
Including two binding plates, with the screw for being fixed described binding plate with travelling-wave tube substrate, described binding plate be provided with and
The groove that high-frequency circuit support seat on travelling-wave tube substrate matches, described binding plate is additionally provided with for being fixed even with screw
The screwing through hole connecing, in groove, the high-frequency circuit support seat on described travelling-wave tube substrate is provided with spiral shell to described screwing through hole
Pit, sets the molding position of composite heat conducting material by the cooperation of the depth of groove and travelling-wave tube substrate high-frequency circuit support seat
Put.
A kind of method using described travelling-wave tube embedding composite heat conducting material shaping jig embedding composite, methods described
Comprise the steps:
1) prepare composite heat conducting material, travelling-wave tube substrate, treat the travelling-wave tube of embedding composite heat conducting material and be used for travelling-wave tube
The shaping jig of embedding composite heat conducting material；
2) determine the shaping position of composite heat conducting material, determine the depth of groove according to the shaping position of composite heat conducting material
Degree, sets the shaping position of composite heat conducting material by the cooperation of the depth of groove and travelling-wave tube substrate high-frequency circuit support seat；
3) by screw, binding plate is fixed with travelling-wave tube substrate；
4) composite heat conducting material is filled in the shaping jig for travelling-wave tube embedding composite heat conducting material, carries out adding
After heat, constant temperature and cooling are processed, take off the shaping jig for travelling-wave tube embedding composite heat conducting material at normal temperatures, complete traveling wave
The embedding of pipe embedding composite heat conducting material.
Compared with prior art, the method have the advantages that
Using the technology of the present invention, the travelling-wave tube after embedding, its composite heat conducting material controls within scope of design, is not required to
To reject unnecessary composite heat conducting material using mechanical means, it is to avoid the generation during the unnecessary composite heat conducting material of rejecting
Vibration, the damage to travelling-wave tube for the impact.
Brief description
The shaping jig that Fig. 1 embodiment of the present invention one is used for travelling-wave tube embedding composite heat conducting material is fixed with travelling-wave tube substrate
Schematic diagram afterwards；
Travelling-wave tube schematic diagram after the embedding composite heat conducting material of Fig. 2 embodiment one；
The schematic diagram of Fig. 3 travelling-wave tube substrate；
The structural representation of Fig. 4 embodiment one binding plate.
In above-mentioned accompanying drawing, the corresponding component names of reference are as follows:
1- travelling-wave tube substrate, 2- binding plate, 3- screw, 4- composite heat conducting material, 5- high-frequency circuit support seat, 6- groove,
7- screwing through hole, 8- screwed hole.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples, and embodiments of the present invention include but is not limited to
The following example.
Embodiment one
As shown in figure 1, one of embodiment is used for the shaping jig of travelling-wave tube embedding composite heat conducting material, described molding
Fixture includes two binding plates, and the screw for being fixed described binding plate with travelling-wave tube substrate, and described binding plate sets
There is the groove matching with the high-frequency circuit support seat on travelling-wave tube substrate, described binding plate is additionally provided with for being carried out admittedly with screw
The fixed screwing through hole connecting, described screwing through hole, in groove, the high-frequency circuit support seat on described travelling-wave tube substrate sets
There is screwed hole, set the molding of composite heat conducting material by the cooperation of the depth of groove and travelling-wave tube substrate high-frequency circuit support seat
Position, the present embodiment concave groove depth 1mm.
A kind of method using described travelling-wave tube embedding composite heat conducting material shaping jig embedding composite, methods described
Comprise the steps:
1) prepare composite heat conducting material 100g, travelling-wave tube substrate, treat the travelling-wave tube of embedding composite heat conducting material and be used for going
The shaping jig of wave duct embedding composite heat conducting material；
2) determine the shaping position of composite heat conducting material, determine the depth of groove according to the shaping position of composite heat conducting material
For 1mm, set the molding position of composite heat conducting material by the cooperation of the depth of groove and travelling-wave tube substrate high-frequency circuit support seat
Put；
3) by screw, binding plate is fixed with travelling-wave tube substrate；
4) composite heat conducting material is filled in the shaping jig for travelling-wave tube embedding composite heat conducting material, carries out adding
After heat, constant temperature and cooling are processed, take off the shaping jig for travelling-wave tube embedding composite heat conducting material at normal temperatures, complete traveling wave
The embedding of pipe embedding composite heat conducting material.
Had the advantages that using the present embodiment
Using the technology of the present invention, the travelling-wave tube after embedding, its composite heat conducting material controls within scope of design, is not required to
To reject unnecessary composite heat conducting material using mechanical means, it is to avoid the generation during the unnecessary composite heat conducting material of rejecting
Vibration, the damage to travelling-wave tube for the impact.
Above-described embodiment is only the preferred embodiments of the present invention, not limiting the scope of the invention, as long as adopting
The design principle of the present invention, and the change carrying out non-creativeness work on this basis and making, all should belong to the present invention's
Within protection domain.
Claims (2)
1. a kind of shaping jig for travelling-wave tube embedding composite heat conducting material is it is characterised in that described shaping jig includes two
Individual binding plate, the screw for being fixed described binding plate and travelling-wave tube substrate, described binding plate is provided with and travelling-wave tube base
The groove that high-frequency circuit support seat on plate matches, described binding plate is additionally provided with the screw for being fixedly connected with screw
Through hole, in groove, the high-frequency circuit support seat on described travelling-wave tube substrate is provided with screwed hole to described screwing through hole, passes through
The cooperation of the depth of groove and travelling-wave tube substrate high-frequency circuit support seat sets the shaping position of composite heat conducting material.
2. the method for shaping jig embedding composite described in a kind of use claim 1, methods described comprises the steps:
(1) prepare composite heat conducting material, travelling-wave tube substrate, treat the travelling-wave tube of embedding composite heat conducting material and be used for travelling-wave tube embedding
The shaping jig of composite heat conducting material；
(2) determine the shaping position of composite heat conducting material, determine the depth of groove according to the shaping position of composite heat conducting material, lead to
The cooperation of the depth and travelling-wave tube substrate high-frequency circuit support seat of crossing groove sets the shaping position of composite heat conducting material；
(3) by screw, binding plate is fixed with travelling-wave tube substrate；
(4) composite heat conducting material is filled in the shaping jig for travelling-wave tube embedding composite heat conducting material, carries out heating, permanent
After gentle cooling is processed, take off the shaping jig for travelling-wave tube embedding composite heat conducting material at normal temperatures, complete travelling-wave tube and fill
The embedding of envelope composite heat conducting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510167979.6A CN104816264B (en) | 2015-04-10 | 2015-04-10 | Forming clamp for potted composite heat conduction materials of traveling-wave tube and method for potting composite materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510167979.6A CN104816264B (en) | 2015-04-10 | 2015-04-10 | Forming clamp for potted composite heat conduction materials of traveling-wave tube and method for potting composite materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104816264A CN104816264A (en) | 2015-08-05 |
| CN104816264B true CN104816264B (en) | 2017-02-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510167979.6A Active CN104816264B (en) | 2015-04-10 | 2015-04-10 | Forming clamp for potted composite heat conduction materials of traveling-wave tube and method for potting composite materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104816264B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742142A (en) * | 2016-04-06 | 2016-07-06 | 成都国光电气股份有限公司 | Encapsulating method for composite heat conduction material of travelling wave tube |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005158991A (en) * | 2003-11-26 | 2005-06-16 | Calsonic Kansei Corp | Waterproof structure of substrate |
| CN101286462B (en) * | 2008-05-27 | 2010-10-20 | 北京海升天达科技有限公司 | Sealing apparatus, sealing method and encapsulation method of integrated circuit chip |
| JP5542318B2 (en) * | 2008-09-29 | 2014-07-09 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Resin sheet and circuit device manufacturing method using the same |
| CN101577236B (en) * | 2009-06-08 | 2011-01-12 | 美新半导体（无锡）有限公司 | Epoxy resin encapsulating die of substrate flip-chip type electronic device and encapsulating method thereof |
| CN203788624U (en) * | 2014-02-20 | 2014-08-20 | 成都国光电气股份有限公司 | Clamp used for potting composite thermal conductive material |
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2015
- 2015-04-10 CN CN201510167979.6A patent/CN104816264B/en active Active
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| Publication number | Publication date |
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| CN104816264A (en) | 2015-08-05 |
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