CN208938954U - A kind of island-free framework encapsulation structure - Google Patents
A kind of island-free framework encapsulation structure Download PDFInfo
- Publication number
- CN208938954U CN208938954U CN201820839176.XU CN201820839176U CN208938954U CN 208938954 U CN208938954 U CN 208938954U CN 201820839176 U CN201820839176 U CN 201820839176U CN 208938954 U CN208938954 U CN 208938954U
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- Prior art keywords
- island
- sheet metal
- hollow out
- out sheet
- free
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Originally practical to be related to a kind of island-free framework encapsulation structure, it includes island-free frame (1), island-free frame (1) front is provided with hollow out sheet metal (2), chip (3) are provided on the hollow out sheet metal (2), the chip (3) is electrically connected with island-free frame (1) by electrical junction (4), and the island-free frame (1), hollow out sheet metal (2), chip (3) and electric connection component (4) are encapsulated with plastic packaging material (5) outside.A kind of this practical island-free framework encapsulation structure, it fills the structure that hollow out sheet metal forms the support chip of Ji Dao effect on island-free frame, hollow out sheet metal is able to solve the problem of cured film can hinder plastic packaging material to fill cured film lower zone as Ji Dao, so as to improve the filling of mould stream and cavity；And the intensity of metal is better than resin material (cured film), load and routing can be more more stable than resin material (cured film).
Description
Technical field
Originally practical to be related to a kind of island-free framework encapsulation structure, belong to technical field of semiconductor encapsulation.
Background technique
The lead frame island-free product formed at present by etching, when chip load are framves on pin.In fact,
When chip carrier is on pin, it is easy to cause routing shakiness to shake or chip when routing since chip and pins contact area are too small
The abnormal phenomenon that stress is lifted on one side.
The existing way to solve the above problems is to paste cured film solidification on island-free frame as Ji Dao to support chip.So
And in actual process production process, cured film is the membrane material of half flow regime, in subsequent injection encapsulated process, cured film
The base island structure of formation can hinder the flowing of capsulation material up and down direction, be unfavorable for the flowing of the capsulation material of melting, be easy meeting
There are the flowing velocity of capsulation material between the flowing velocity and frame of frame upper layer capsulation material is inconsistent, mount structure is added
Exist for the flowing of capsulation material and hinder, cured film lower zone is further made to be also easy to produce cavity, unfilled problem.And
And cured film could form the chip supporting structure with some strength after solidifying, but support strength is not enough, load and
The operation of routing procedure is still not sufficiently stable, under the impact of chip load pressure and ball bonding pressure, can exist cured film cracking or
The problem of cured film and frame are layered.
Utility model content
This is practical the technical problem to be solved is that providing a kind of island-free framework encapsulation structure for the above-mentioned prior art,
It fills the structure that hollow out sheet metal forms the support chip of Ji Dao effect on island-free frame, and hollow out sheet metal can improve mould
Stream filling and cavity；And the intensity of metal is better than resin material (cured film), load and routing can be than resin material (cured films)
It is more stable.
This practical used technical solution that solves the above problems are as follows: a kind of island-free framework encapsulation structure, it includes nothing
Base island frame, island-free frame front are provided with hollow out sheet metal, chip, the core are provided on the hollow out sheet metal
Piece is electrically connected with island-free frame by electrical junction, the island-free frame, hollow out sheet metal, chip and electrical property
Plastic packaging material is encapsulated with outside connecting component, plastic packaging material is exposed at the island-free frame back side.
Preferably, the hollow out sheet metal surrounding offers hollow slots.
Preferably, the material of the hollow out sheet metal can be replaced high-intensitive ceramics or glass fiber plastic.
Preferably, the hollow out sheet metal is used through adhesive material on the pin of island-free frame.
Compared with prior art, this practical advantage is:
A kind of this practical island-free framework encapsulation structure, it fills hollow out sheet metal on island-free frame and forms Ji Dao effect
Support chip structure, hollow out sheet metal, which is able to solve cured film as Ji Dao, can hinder plastic packaging material to filling below cured film
The problem of, so as to improve the filling of mould stream and cavity；What engraved structure can improve sheet metal grabs glue ability, improves metal material and tree
Lamination problem caused by rouge material CTE (thermal expansion coefficient) difference；And the intensity of metal is better than resin material (cured film), load
And routing can be more more stable than resin material (cured film).
Detailed description of the invention
Fig. 1 is a kind of this practical schematic diagram of island-free framework encapsulation structure.
Fig. 2 is the top view of Fig. 1.
Fig. 3~Fig. 7 is a kind of this practical flow diagram of island-free framework encapsulation structure process method.
Wherein:
Island-free frame 1
Hollow out sheet metal 2
Chip 3
It is electrically connected component 4
Plastic packaging material 5
Hollow slots 6.
Specific embodiment
It is described in further detail below in conjunction with figure embodiment to originally practical.
As shown in Figure 1 and Figure 2, one of the present embodiment island-free framework encapsulation structure, it includes island-free frame 1, institute
It states 1 front of island-free frame and is provided with hollow out sheet metal 2, chip 3, the chip 3 and nothing are provided on the hollow out sheet metal 2
Base island frame 1 is electrically connected by electrical junction 4, the island-free frame 1, hollow out sheet metal 2, chip 3 and electrical property
Plastic packaging material 5 is encapsulated with outside connecting component 4, plastic packaging material 5 is exposed at 1 back side of island-free frame；
2 surrounding of hollow out sheet metal offers hollow slots 6；
The material of the hollow out sheet metal 2 is not limited to metal, high-strength material, such as ceramics, glass fiber plastic.
Its process is as follows:
Step 1: referring to Fig. 3, referring to Fig. 3, for the size of the pin positions design hollow out sheet metal of encapsulation, for core
The engraved structure (hollow slots) of hollow out sheet metal is designed in the load position of chip size and chip；The engraved structure side of can be designed as
The special designings such as shape, circle, flow up and down plastic packaging material by hollow design, thus to hollow out sheet metal bottom and pin
Region carries out encapsulating filling；Meanwhile engraved structure can increase hollow out sheet metal grab glue ability, improve metal material and resin
Lamination problem caused by material CTE (thermal expansion coefficient) difference；
Step 2: referring to fig. 4, by the hollow out sheet metal processed by adhesive material (non-conductive glue) mounted in no base
On the interior pin of island frame, this hollow out sheet metal is enable to support chip；
Step 3: chip is arranged on hollow out sheet metal referring to Fig. 5；
Step 4: being electrically connected component referring to Fig. 6 and being electrically connected chip and island-free frame；
Step 5: referring to Fig. 7, encapsulating, with plastic packaging material cladding island-free frame, hollow out sheet metal, chip and electric connection
Component, and the island-free frame back side is exposed to plastic packaging material.
In addition to the implementation, it further includes having other embodiments that this is practical, all to use equivalent transformation or equivalent replacement
The technical solution that mode is formed should all be fallen within this practical scope of protection of the claims.
Claims (4)
1. a kind of island-free framework encapsulation structure, it is characterised in that: it includes island-free frame (1), the island-free frame (1)
Front is provided with hollow out sheet metal (2), is provided with chip (3) on the hollow out sheet metal (2), the chip (3) and island-free
Frame (1) is electrically connected by being electrically connected component (4), the island-free frame (1), hollow out sheet metal (2), chip
(3) it is encapsulated with outside plastic packaging material (5) with electric connection component (4), plastic packaging material (5) are exposed at island-free frame (1) back side.
2. a kind of island-free framework encapsulation structure according to claim 1, it is characterised in that: the hollow out sheet metal (2)
Surrounding offers hollow slots (6).
3. a kind of island-free framework encapsulation structure according to claim 1, it is characterised in that: the hollow out sheet metal (2)
Material can be replaced high-strength ceramic or glass fiber plastic.
4. a kind of island-free framework encapsulation structure according to claim 1, it is characterised in that: the hollow out sheet metal (2)
It is mounted on the pin of island-free frame using by adhesive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820839176.XU CN208938954U (en) | 2018-05-31 | 2018-05-31 | A kind of island-free framework encapsulation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820839176.XU CN208938954U (en) | 2018-05-31 | 2018-05-31 | A kind of island-free framework encapsulation structure |
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| Publication Number | Publication Date |
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| CN208938954U true CN208938954U (en) | 2019-06-04 |
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| CN201820839176.XU Active CN208938954U (en) | 2018-05-31 | 2018-05-31 | A kind of island-free framework encapsulation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493169A (en) * | 2018-05-31 | 2018-09-04 | 江苏长电科技股份有限公司 | A kind of island-free framework encapsulation structure and its process |
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2018
- 2018-05-31 CN CN201820839176.XU patent/CN208938954U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493169A (en) * | 2018-05-31 | 2018-09-04 | 江苏长电科技股份有限公司 | A kind of island-free framework encapsulation structure and its process |
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