CN108398063B - A kind of electric detonator chip and its packaging method - Google Patents
A kind of electric detonator chip and its packaging method Download PDFInfo
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- CN108398063B CN108398063B CN201810213796.7A CN201810213796A CN108398063B CN 108398063 B CN108398063 B CN 108398063B CN 201810213796 A CN201810213796 A CN 201810213796A CN 108398063 B CN108398063 B CN 108398063B
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- electric detonator
- protective layer
- glue
- detonator chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title abstract description 33
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims description 39
- 239000011241 protective layer Substances 0.000 claims description 38
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 238000001746 injection moulding Methods 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 19
- 238000007711 solidification Methods 0.000 claims description 19
- 230000008023 solidification Effects 0.000 claims description 19
- 239000004831 Hot glue Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000004513 sizing Methods 0.000 claims description 5
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 239000000539 dimer Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000012536 packaging technology Methods 0.000 claims 7
- 238000002360 preparation method Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 15
- 239000000047 product Substances 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000011265 semifinished product Substances 0.000 abstract description 3
- 239000000428 dust Substances 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 210000001217 buttock Anatomy 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001548 drop coating Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012946 outsourcing Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
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- 230000007812 deficiency Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
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- 238000011056 performance test Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42C—AMMUNITION FUZES; ARMING OR SAFETY MEANS THEREFOR
- F42C19/00—Details of fuzes
- F42C19/08—Primers; Detonators
- F42C19/12—Primers; Detonators electric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Air Bags (AREA)
Abstract
The present invention discloses a kind of electric detonator chip and packaging method, and the packaging method carries out an adhesive curing hard encapsulation by the electric detonator chip to semi-finished product and low pressure injection formaing encapsulates, and realizes the secondary encapsulation to electric detonator chip.It ensure that it is moisture-proof that product has in this way, under the premise of dust reduction capability, improving the quality of production consistency and yield rate of electric detonator chip, the double-deck packaging protection also greatly improves the anti-seismic performance of product in use.
Description
Technical field
The present invention relates to electric detonator technical field more particularly to a kind of electric detonator chip and its packaging methods.
Background technique
In the prior art, electric detonator chip directlys adopt low-pressure injection molding technology in patch and after completing semi-finished product test
Double of completed electronic detonator chip is packaged, and forms a protective layer in chip periphery, to reach on protection electric detonator chip
Component, make it have the functions such as moisture-proof and dust-proof.But current electric detonator chip production packaging method there is
Two disadvantages: first disadvantage is that low-pressure injection molding is directly carried out to the component on electric detonator chip with the resin after fusing
Encapsulation, and the resin temperature after melting is up to 170 DEG C, briquetting pressure 2Kg/cm2, high temperature and pressure be easy to electric detonator chip
Component damages, and causes product quality consistency not high, yield rate is low；Second disadvantage is electric detonator chip in explosion
In use process, since row's spacing is closer, during delayed ignition, the seismic wave that the electric detonator that center is first detonated generates can be right
The electric detonator at edge generates impact, will cause the component damage failure on chip, generates phenomenon of miss-firing, make to demolition site
At security risk.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of electric detonator chip and its encapsulation sides
Method.
Technical scheme is as follows:
A kind of electric detonator chip comprising be equipped with the chip of electronic component, packet on the outside of the electric detonator chip
It is wrapped with hard protective layer, the hard protective layer covers the electronic component being loaded on the chip；The hard protective layer
Outside is enclosed with protective layer, and the protective layer wraps up the chip and hard protective layer disposed thereon.
The electric detonator chip, wherein the hard protective layer is epoxy resin black glue layer, with a thickness of 2-3mm.
A kind of packaging method of electric detonator chip comprising:
Step A, the chip for having mounted electronic component is preheated, dispensing is carried out to the chip after preheating, with covering
All electronic components on chip；
Step B, the chip after dispensing is solidified, so that chip outer layer forms the hard protective layer of fitting chip；
Step C, low-pressure injection molding is carried out to the chip after solidification using packaging plastic, to form protective layer in chip outer surface,
Complete the molding of electric detonator chip package.
The packaging method of the electric detonator chip, in the step A, the sizing material that the dispensing uses is epoxy resin
The hot glue of black glue, and dispensing is with a thickness of 1-1.2mm.
The packaging method of the electric detonator chip, wherein the temperature of the hot glue of the epoxy resin black glue is 45 DEG C ± 5
DEG C degree Celsius.
The packaging method of the electric detonator chip, in the step A, the preheating time of the preheating is 3-5min,
Preheating temperature is 80-100 DEG C.
The packaging method of the electric detonator chip, in the step B, the cured solidification temperature is 80-100
DEG C, curing time 55-65min.
The packaging method of the electric detonator chip, the step C are specifically included:
Chip after solidification is put into the lower mold of low-pressure injection molding machine, and upper/lower die is molded；
Low-pressure injection molding machine is by the packaging plastic in liquid after melting into the injection of glue mouth, so that packaging plastic is full of up and down
Mold forms the gap between confined space and electric detonator chip after solidifying；
Upper/lower die is opened after low-pressure injection molding machine delay preset time, the chip after solidification is wrapped up entirely with realization secondary
Encapsulation.
The packaging method of the electric detonator chip, in the step C, packaging plastic that the low-pressure injection molding uses be with
The black particle shape macromolecule resin hot melt adhesive synthesized based on dimer (fatty acid) yl.
The packaging method of the electric detonator chip, wherein the low pressure injection formaing pressure is 2kg/cm2, resin temperature
Degree is 170 DEG C ± 5 DEG C.
The utility model has the advantages that the present invention provides a kind of electric detonator chip and packaging method, the packaging method by pair
The electric detonator chip of semi-finished product carries out an adhesive curing hard encapsulation and low pressure injection formaing encapsulation, realizes to electric detonator core
The secondary encapsulation of piece.It ensure that it is moisture-proof that product has in this way, under the premise of dust reduction capability, improving the life of electric detonator chip
Yield and quality consistency and yield rate, the double-deck packaging protection also greatly improve the anti-seismic performance of product in use.Together
When, it is had the advantages that using the electric detonator chip that this technique encapsulates
1, electric detonator chip is all carried out to secondary processes encapsulation in addition to igniter wire and buttock line solder terminal, improves electronics
The leakproofness of detonator, antistatic impact, high-low temperature resistant, anti-vibration and anti-low frequency oscillation impact property, enhance electronics thunder comprehensively
The service performance of pipe；
2, packaging plastic all has melting temperature low, good fluidity, height insulation, high-low temperature resistant, strong viscous force, shock resistance, sealing
Good, the fast advantage of curing molding of property, it is easy to use, it is at low cost, it is high-efficient.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of electric detonator chip provided by the invention.
Fig. 2 is the explosive view of electric detonator chip provided by the invention.
Fig. 3 is the flow chart of the packaging method of electric detonator chip provided by the invention.
Fig. 4 is the schematic diagram of electric detonator chip before encapsulating in the packaging method of electric detonator chip provided by the invention.
Fig. 5 is the signal of electric detonator chip after once encapsulating in the packaging method of electric detonator chip provided by the invention
Figure.
Fig. 6 is the signal of electric detonator chip after secondary encapsulation in the packaging method of electric detonator chip provided by the invention
Figure.
Specific embodiment
The present invention provides a kind of electric detonator chip and its packaging method, to make the purpose of the present invention, technical solution and effect
Fruit is clearer, clear, and the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
Only to explain the present invention, it is not intended to limit the present invention.
The present invention provides a kind of electric detonator chips, as illustrated in fig. 1 and 2 comprising are equipped with the core of electronic component
Piece 100, hard protective layer 200 and protective layer 300；The hard protective layer 200 wraps up the portion that chip is equipped with electronic component
Divide and is fitted closely with chip；The protective layer 300 covers the outer surface for being equipped with the chip of hard protective layer 200, by core
Piece and the package of hard protective layer 200 are in the inner.The present embodiment is by hard protective layer 200 to the electronics member device being assemblied on chip
The effect of part starting protection, can be to avoid high temperature and pressure when generating protective layer 300 using low-pressure injection molding technology to electronic component
Influence, play a protective role to the electronic component on electronic radar chip, to improve the production of electric detonator chip
Quality conformance and yield rate.In the present embodiment, the electric detonator chip is preferably dimensioned to be wide 5mm, length 45mm,
Overall thickness is the electronic component aggregate of 3mm, and two neighboring electric detonator is, side fixed for the connecting bridge of 1mm by width
Just whole attachment component, electric performance test.There are two the circular holes of 3mm for the edges of boards setting of the chip 100, facilitate positioning solid
Fixed, connecting bridge spacing dimension is 2.5mm.In addition, cutting for convenience, there is V to cut at 100 edges of boards 0.4mm of connecting bridge off-chip piece
Line facilitates scoreboard after welding buttock line.
Further, the thickness of the hard protective layer 200 is preferably 2-3mm, and the hard protective layer 200 fills electronics member
Gap between 100 ontology of device and chip, and the part that chip 100 assembles electronic component is covered, on chip 100
Electronic component plays the role of protection.In the present embodiment, the hard protective layer 200 is preferably epoxy resin black glue layer,
The epoxy resin black glue layer is by carrying out dispensing to chip 100 and being solidified to form, sizing material used by the dispensing
For the hot glue of epoxy resin black glue, wherein the temperature of the hot glue of epoxy resin black glue is preferably 45 DEG C ± 5 DEG C.
Further, the protective layer 300 is the tubular structure with hollow channel, and the chip 100 passes through hollow channel
And be partially disposed in the hollow channel, the hard protective layer 200 is placed in the hollow channel, and is placed in chip 100
Part in middle control channel fits.In the present embodiment, the protective layer 300 is resin layer, is by hard to being equipped with
The chip 100 of quality guarantee sheath 200 carries out low-pressure injection molding and gets along.
The present invention also provides a kind of packaging methods of electric detonator, and as seen in figures 3-6, the technique includes following step
It is rapid:
S1, the chip 100 for having mounted electronic component is preheated, dispensing is carried out to the chip 100 after preheating, to cover
All electronic components on cover core piece 100；
S2, the chip 100 after dispensing is solidified, so that the hard that 100 outer layer of chip forms fitting chip 100 is protected
Sheath 200；
S3, low-pressure injection molding is carried out to the chip 100 after solidification using packaging plastic, is protected with being formed in 100 outer surface of chip
Layer 300 completes the molding of electric detonator chip package.
Specifically, in the step S1, the preheating for by dispenser to having mounted electronic component
Chip 100 is preheated, wherein the technological parameter of the preheating are as follows: preheating time 3-5min, preheating temperature 80-100
℃.If pre- thermal parameter is unsatisfactory for above-mentioned requirements, it is unable to reach the moisture of evaporated electron detonator chip wiring board absorption, is avoided
It expands with heat and contract with cold in subsequent handling the effect that deforms.Meanwhile the electric detonator chip after preheating increases black glue in dispensing
Mobility and penetration, adhesive force is stronger, improves the reliability of product.Further, since the dispensing is carried out by dispenser,
It can also include upper plate step so before preheating and dispensing, the upper plate step, which is specifically as follows, will mount electronics member
The electric detonator chip of device is put into aluminium box jig and enters dispensing machine worktable.Wherein, the aluminium box can be disposably put into
Multi-disc electric detonator chip (for example, 50 electric detonator chips), dispensing machine worktable can disposably be put into several aluminium box (examples
Such as, 4 aluminium boxes), to be preheated to multi-disc electric detonator chip (for example, 4*50=200 piece electric detonator chip).And point
Glue machine successively carries out dispensing to multiple electric detonator chips in several aluminium boxes, and when electric detonator chips whole in an aluminium box
After dispensing, taken out and be reentered into the new aluminium box equipped with electric detonator chip being preheated, dispensing successively follows
Ring production；Dispensing be epoxy resin binding glue in hot glue, hot glue have high reliability, adhesive force is strong, cold-and-heat resistent impact
The strong advantage of power.
Further, the hot glue of sizing material epoxy resin black glue used by the dispensing, and the epoxy resin black glue
The temperature of hot glue is preferably 45 DEG C ± 5 DEG C.For example, the temperature of the hot glue of epoxy resin black glue is 45 in a preferable example
DEG C, 45 DEG C of epoxy resin black glue is obtained and epoxy resin black glue is heated to 45 DEG C, can evaporate ring by heating
The moisture of oxygen resin black glue absorption, discharges mixed bubble in epoxy resin black glue, so that plastic emitting disengaging Jiao Zui is more smooth, keeps away
Exempt from wire drawing phenomenon, increase the mobility and penetration of black glue, black glue is made to cover all component top surfaces and fills up entire
Gap between electric detonator chip component improves the reliability of product.
In addition, it is specially uniformly to drip heating preheating epoxy resin black glue that the chip 100 after described pair of preheating, which carries out dispensing,
It is coated on the electric detonator chip being placed in aluminium box, wherein the standard of the drop coating is that epoxy resin black glue wraps electronics thunder
All components in tube chip.It is described for dispensing glue with a thickness of 1-1.2mm.For example, in a preferable example, dispensing with a thickness of
1.2mm。
Further, in the step S2, in solidification, the electric detonator chip for filling epoxy resin black glue is put into solid
Change and carry out heat cure in furnace, is protected so that electric detonator chip outer layer forms the epoxy resin packaging plastic hard that one layer fits closely
Sheath.The cured cure parameter are as follows: solidification temperature is 80-100 DEG C, curing time 55-65min, the hard protection
Layer with a thickness of 1-1.2mm.For example, solidification temperature is 90 DEG C in a preferable example, curing time is 60 minutes, hard
Protective layer with a thickness of 1.2mm.Cure parameter and hard thickness use above-mentioned parameter, and the hard after solidifying can be made to protect
Layer has good high-insulativity, can prevent electrostatic from causing electric detonator chip failure, and the glue-line after solidify with by
Pressure is unlikely to deform, and the heated characteristic also not softened more improves the reliability and stability of product.
It, after hardening, can be to the electricity after epoxy resin adhesive curing in addition, in order to improve the protectiveness of hard protective layer
Sub- detonator chip is detected, and judges whether encapsulate appearance and properties of product reaches standard.Wherein, detection process is specific after solidification
It can be with are as follows: first carry out sight check to the electric detonator chip after epoxy resin cure first, be completely covered with solidifying black glue
There is component top surface in residence and fills up the gap between entire electric detonator chip component, and cannot be standard beyond edges of boards edge, no
Qualified point adhesive curing again；Then both-way communication detection is carried out to electric detonator chip with special inspecting equipment, guarantees solidification
The sub- detonator chip of each power generation afterwards reaches requirement.
Further, in the step S3, the packaging plastic that the low-pressure injection molding uses is to be closed based on dimer (fatty acid) yl
At black particle shape macromolecule resin hot melt adhesive, and the technological parameter of the low-pressure injection molding are as follows: briquetting pressure 2kg/
cm2, resin temperature is 170 DEG C ± 5 DEG C.Since electric detonator chip has had the glue-line after solidifying, glue-line, which has to be pressurized, to be not easy
Deformation, the heated characteristic also not softened, so low-pressure injection molding will not the hard protective layer to the chip surface after solidification generate shadow
It rings.For example, low pressure injection formaing pressure is 2kg/cm in a preferred example2, resin temperature is 170 DEG C, solidified forming time
For 25S.
In addition, the detailed process of the low-pressure injection molding can be that the electric detonator chip after solidifying is put into low-pressure injection molding machine
Lower mold in, upper/lower die molding, low-pressure injection molding machine is by the way that into the resin for being in liquid after the injection melting of glue mouth, resin fills
The gap between electric detonator chip after expiring the confined space and solidifying.After fixing, forming after liquid resin, open up and down
Mold, finally electric detonator chip outsourcing after hardening wraps the resin layer for covering one layer of good seal, realizes electronics thunder
The secondary encapsulation of tube chip.In addition, it is semi-circular recesses that the low pressure injection mould, which is upper and lower mould, diameter solidifies greater than black glue
The width of electric detonator chip afterwards, the cylinder package formed after injection molding be less than or equal to detonator shell internal diameter, facilitate by
The electric detonator chip of secondary encapsulation is fitted into capsule.For example, electric detonator shell internal diameter is 6mm, the outer diameter of protective layer is
5.9mm。
It further, can also include finished product test step after the completion of low-pressure injection molding, the finished product test step is specially
The electric detonator chip of 2 encapsulated mouldings is subjected to final product quality detection.
The electric detonator packaging method provided in order to further illustrate the present invention is subject to below with reference to a specific embodiment
Explanation.
Embodiment one
A kind of packaging method of electric detonator chip is present embodiments provided, the technique specifically includes:
The aluminium box for being placed with electric detonator chip module is put into 90 DEG C of automatic dispensing machine heating platen temperature first, preheats 4 points
Secondly clock passes through the epoxy resin binding black glue for heating 45 DEG C in dispenser drop coating to each electric detonator chip front and back sides,
There is component top surface in all standing residence and fills up the gap between entire electric detonator chip component, forms the wide 5mm in two sides, long 21mm
And the epoxy resin black glue layer of thickness 1.2mm, then the electric detonator chip for having put glue is put by the successive dispensing sequence in front and back sides
Into 90 DEG C of curing ovens, solidify 60 minutes, the electric detonator chip after solidification is taken out cooling to get to the electricity once encapsulated
Sub- detonator chip.The electric detonator chip after solidification is put into the lower mold of low-pressure injection molding machine again, upper/lower die molding is low
Pressure injection molding machine by into glue mouth injection melting after be in liquid hot-fusible high-molecular glue, hot melt adhesive full of the confined space with
The gap between electric detonator chip after solidification；The cooling fixed, molding of hot melt adhesive, low-pressure injection molding machine open upper and lower mould after 30 seconds
Tool, finally electric detonator chip outsourcing after hardening wraps the cylindrical resin layer for covering one layer of good seal, realizes pair
The full package secondary encapsulation of electric detonator chip after solidification, electric detonator chip integral diameter is 5.9mm, mold after secondary encapsulation
Thimble entirety ejecting product to get arrive the molding electric detonator chip of final secondary encapsulation.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (9)
1. a kind of electric detonator chip, which is characterized in that it includes the chip for being equipped with electronic component, the electric detonator core
Hard protective layer is enclosed on the outside of piece, the hard protective layer covers the electronic component being loaded on the chip；It is described hard
Quality guarantee sheath fills the gap between electronic component and the ontology of the chip, and covers the portion of chip assembly electronic component
Point；Protective layer is enclosed on the outside of the hard protective layer, the protective layer wraps up the chip and hard disposed thereon is protected
Sheath；
The preparation process of the hard protective layer are as follows:
The chip for having mounted electronic component is preheated, dispensing is carried out to the chip after preheating, to cover the institute on chip
There is electronic component；
Chip after dispensing is solidified, so that chip outer layer forms the hard protective layer of fitting chip；
The dispensing using sizing material epoxy resin black glue hot glue, and the hot glue temperature of the epoxy resin black glue be 45
℃±5℃。
2. electric detonator chip according to claim 1, which is characterized in that the hard protective layer is epoxy resin black glue
Layer, with a thickness of 2-3mm.
3. a kind of packaging technology of electric detonator chip, characterized in that it comprises:
Step A, the chip for having mounted electronic component is preheated, dispensing is carried out to the chip after preheating, to cover chip
On all electronic components；
Step B, the chip after dispensing is solidified, so that chip outer layer forms the hard protective layer of fitting chip；
Step C, low-pressure injection molding is carried out to the chip after solidification using packaging plastic, to form protective layer in chip outer surface, completed
The molding of electric detonator chip package；
The dispensing using sizing material epoxy resin black glue hot glue, and the hot glue temperature of the epoxy resin black glue be 45
℃±5℃。
4. the packaging technology of electric detonator chip according to claim 3, which is characterized in that in the step A, the point
Glue is with a thickness of 1-1.2mm.
5. the packaging technology of electric detonator chip according to claim 3, which is characterized in that described pre- in the step A
The preheating time of heat is 3-5min, and preheating temperature is 80-100 DEG C.
6. the packaging technology of electric detonator chip according to claim 3, which is characterized in that described solid in the step B
The solidification temperature of change is 80-100 DEG C, curing time 55-65min.
7. the packaging technology of electric detonator chip according to claim 3, which is characterized in that the step C is specifically included:
Chip after solidification is put into the lower mold of low-pressure injection molding machine, and upper/lower die is molded；
Low-pressure injection molding machine is by the packaging plastic in liquid after melting into the injection of glue mouth, so that packaging plastic is full of upper/lower die
The gap between electric detonator chip after forming confined space and solidifying；
Upper/lower die is opened after low-pressure injection molding machine delay preset time, to realize the secondary envelope wrapped up entirely the chip after solidification
Dress.
8. according to the packaging technology of the electric detonator chip of claim 3 or 7, which is characterized in that in the step C, institute
Stating the packaging plastic that low-pressure injection molding uses is the black particle shape macromolecule resin hot melt adhesive synthesized based on dimer (fatty acid) yl.
9. the packaging technology of electric detonator chip according to claim 3, which is characterized in that the low pressure injection formaing pressure
For 2kg/cm2, resin temperature is 170 DEG C ± 5 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810213796.7A CN108398063B (en) | 2018-03-15 | 2018-03-15 | A kind of electric detonator chip and its packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810213796.7A CN108398063B (en) | 2018-03-15 | 2018-03-15 | A kind of electric detonator chip and its packaging method |
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| CN108398063B true CN108398063B (en) | 2019-07-30 |
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| CN108942006B (en) * | 2018-09-19 | 2020-07-14 | 四川航天川南火工技术有限公司 | Automatic accurate drawing and covering positioning device and method for ultra-fine metal bridge wire |
| CN109631690B (en) * | 2018-12-17 | 2023-08-22 | 江西新余国泰特种化工有限责任公司 | A vertical mould of spool for electronic detonator automatic assembly production |
| CN112071645B (en) * | 2020-09-10 | 2022-03-08 | 闽江学院 | Lead frame type electronic component packaging method |
| CN113835170B (en) * | 2021-11-26 | 2022-03-29 | 长芯盛（武汉）科技有限公司 | Injection molding packaging method of photoelectric module and photoelectric module thereof |
| CN114314495A (en) * | 2021-12-24 | 2022-04-12 | 苏州捷研芯电子科技有限公司 | MEMS integrated packaging structure and preparation method thereof |
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| US7690303B2 (en) * | 2004-04-22 | 2010-04-06 | Reynolds Systems, Inc. | Plastic encapsulated energetic material initiation device |
| US20130075892A1 (en) * | 2011-09-27 | 2013-03-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for Three Dimensional Integrated Circuit Fabrication |
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| CN1996575A (en) * | 2005-12-31 | 2007-07-11 | 财团法人工业技术研究院 | Chip encapsulation structure and technology |
| CN102368493A (en) * | 2011-10-11 | 2012-03-07 | 常熟市广大电器有限公司 | Method for packaging integrated circuit chip |
| CN107394031A (en) * | 2017-07-21 | 2017-11-24 | 东莞中之光电股份有限公司 | A kind of LED flip-chip packageds method |
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