CN102347246A - Method for encapsulating chip with excellent radiating performance - Google Patents
Method for encapsulating chip with excellent radiating performance Download PDFInfo
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- CN102347246A CN102347246A CN2011102919021A CN201110291902A CN102347246A CN 102347246 A CN102347246 A CN 102347246A CN 2011102919021 A CN2011102919021 A CN 2011102919021A CN 201110291902 A CN201110291902 A CN 201110291902A CN 102347246 A CN102347246 A CN 102347246A
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- encapsulating
- radiation performance
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Abstract
The invention discloses a method for encapsulating a chip with excellent radiating performance. The method for encapsulating the chip mainly comprises the following steps of: a) installing a substrate; b) installing the chip; c) detecting the performance of the chip; d) sealing by using a sealing gum; e) coating a heat-radiating layer; and f) detecting a finished product. The invention discloses the method for encapsulating the chip with excellent radiating performance. In the process of executing the encapsulating method, two encapsulating processes are carried out on the chip; the heat radiating performance of the chip can be effectively improved while a favorable encapsulating performance is ensured; and the high-efficiency operation of the chip is ensured. Simultaneously, in the process of executing the encapsulating method, an external auxiliary radiating device does not need to be added, thus the encapsulating cost is reduced, the encapsulating process is easy to achieve, and the practicality is excellent.
Description
Technical field
The present invention relates to a kind of chip-packaging structure, relate in particular to a kind of chip packaging method of effective raising chip cooling performance, belong to the chip encapsulation technology field.
Background technology
Chip encapsulation technology wraps up chip exactly, contacts with extraneous to avoid chip, prevents a kind of technology of the infringement of outer bound pair chip.Airborne impurity and bad air, so steam all can corrode the precision circuit on the chip, and then cause electric property to descend.Different encapsulation technologies is widely different in manufacturing process and process aspect, and crucial effects is also played to the performance of memory chip self performance in the encapsulation back.Along with the develop rapidly of photoelectricity, little electric manufacturing process technology, electronic product all the time towards littler, gentlier, more cheap direction develops, so the packing forms of chip component also constantly is improved.
In the existing chip encapsulating structure, chip is wrapped in the injection molding body mostly, mainly carries out heat transmission through the metal and the external world that is connected with chip, and heat-sinking capability is limited, influences the stability of chip operation.
Summary of the invention
To the demand; The invention provides a kind of chip packaging method of excellent radiation performance; In this method for packing implementation process chip has been adopted packaging technology twice; When guaranteeing encapsulation performance, effectively improve the heat dispersion of chip-packaging structure; And need not to add external servicing unit in the encapsulation process; Packaging cost is low, and the chip operation conditions is good.
The present invention is a kind of chip packaging method of excellent radiation performance, and this chip packaging method comprises the steps: that mainly a) peace connects substrate, and b) peace connects chip, c) Performance Detection, and d) sealing encapsulation e) applies heat dissipating layer, f) finished product detection.
In the present invention's one preferred embodiment, in the described step a), at first, between substrate and circuit board, apply the heat curing-type viscose glue, the adhesive-layer THICKNESS CONTROL is at 10-20um; Then, use gold thread, adopt welding procedure that the solder joint on substrate and the circuit board is electrically connected.
In the present invention's one preferred embodiment, in the described step b), chip adopts soldering technology and substrate to electrically connect.
In the present invention's one preferred embodiment, in the described step d), when implementing encapsulation, outside the exposed packaging body of segment chip, the height of its exposed part is the 10%-20% of chip thickness.
In the present invention's one preferred embodiment, employed equipment has glue-injection machine and sealing hot curing machine in the described sealing packaging technology.
In the present invention's one preferred embodiment, in the described step e), heat dissipating layer material selection heat radiating type silica gel adopts spraying coating process in the implementation process.
In the present invention's one preferred embodiment, described spraying coating process is a spray gun spray technology, and its spray temperature is controlled at 80 ℃-100 ℃; Spray finishes, and under 60 ℃ of-70 ℃ of conditions, solidifies 2 hours; The heat dissipating layer thickness of gained is 10-30um.
The present invention has disclosed a kind of chip packaging method of excellent radiation performance, in this method for packing implementation process chip has been adopted packaging technology twice, when guaranteeing the well packaged performance, can effectively improve the heat dispersion of chip, has guaranteed the efficient operation of chip; Simultaneously, need not to add external heat radiation servicing unit in this chip packaging method implementation process, it is low to have reduced packaging cost, and packaging technology is easy to implement, and Practical Performance is good.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed explanation:
Fig. 1 is the process figure of the chip packaging method of embodiment of the invention excellent radiation performance.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
Fig. 1 is the process figure of the chip packaging method of embodiment of the invention excellent radiation performance; This chip packaging method comprises the steps: that mainly a) peace connects substrate, and b) peace connects chip, c) Performance Detection, and d) sealing encapsulation e) applies heat dissipating layer, f) finished product detection.
The practical implementation step is following:
A) peace connects substrate, at first, between substrate and circuit board, applies the heat curing-type viscose glue, and the adhesive-layer THICKNESS CONTROL is at 10-20um; Then, use gold thread, adopt welding procedure that the solder joint on substrate and the circuit board is electrically connected;
B) peace connects chip, and chip adopts soldering technology and substrate to electrically connect;
C) Performance Detection, the electrical connection properties between checking chip and the circuit board, the rate of reducing the number of rejects and seconds;
D) sealing encapsulation; When implementing encapsulation; Outside the exposed packaging body of segment chip; The height of its exposed part is the 10%-20% of chip thickness; This exposed part will apply the better coating material of heat dispersion; When guaranteeing encapsulation performance, effectively improve the heat dispersion of chip, and practice thrift packaging cost, process implementing is easy; Employed equipment mainly contains glue-injection machine and sealing hot curing machine in the sealing packaging technology of carrying out;
E) apply heat dissipating layer, heat dissipating layer material selection heat radiating type silica gel adopts spraying coating process in the implementation process.Spraying coating process is a spray gun spray technology, and its spray temperature is controlled at 85 ℃; Spray finishes, and under 60 ℃ of conditions, solidifies 2 hours; The heat dissipating layer thickness of gained is 12um;
F) finished product detection is carried out electric property to finished product and is detected.
The present invention has disclosed a kind of chip packaging method of excellent radiation performance; Be characterized in: in this method for packing implementation process chip has been adopted packaging technology twice; When guaranteeing the well packaged performance, can effectively improve the heat dispersion of chip, guarantee the efficient operation of chip; Simultaneously, need not to add external heat radiation servicing unit in this chip packaging method implementation process, it is low to have reduced packaging cost, and packaging technology is easy to implement, and Practical Performance is good.
The above; It only is the specific embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed; Variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claims were limited.
Claims (7)
1. the chip packaging method of an excellent radiation performance, this chip packaging method comprise the steps: that mainly a) peace connects substrate, and b) peace connecing chip, c) Performance Detection, and d) sealing encapsulation e) applies heat dissipating layer, f) finished product detection.
2. the chip packaging method of excellent radiation performance according to claim 1 is characterized in that, in the described step a), at first, between substrate and circuit board, applies the heat curing-type viscose glue, and the adhesive-layer THICKNESS CONTROL is at 10-20um; Then, use gold thread, adopt welding procedure that the solder joint on substrate and the circuit board is electrically connected.
3. the chip packaging method of excellent radiation performance according to claim 1 is characterized in that, in the described step b), chip adopts soldering technology and substrate to electrically connect.
4. the chip packaging method of excellent radiation performance according to claim 1 is characterized in that, in the described step d), when implementing encapsulation, outside the exposed packaging body of segment chip, the height of its exposed part is the 10%-20% of chip thickness.
5. the chip packaging method of excellent radiation performance according to claim 4 is characterized in that, employed equipment has glue-injection machine and sealing hot curing machine in the described sealing packaging technology.
6. the chip packaging method of excellent radiation performance according to claim 1 is characterized in that, in the described step e), heat dissipating layer material selection heat radiating type silica gel adopts spraying coating process in the implementation process.
7. the chip packaging method of excellent radiation performance according to claim 6 is characterized in that, described spraying coating process is a spray gun spray technology, and its spray temperature is controlled at 80 ℃-100 ℃; Spray finishes, and under 60 ℃ of-70 ℃ of conditions, solidifies 2 hours; The heat dissipating layer thickness of gained is 10-30um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102919021A CN102347246A (en) | 2011-09-30 | 2011-09-30 | Method for encapsulating chip with excellent radiating performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102919021A CN102347246A (en) | 2011-09-30 | 2011-09-30 | Method for encapsulating chip with excellent radiating performance |
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| CN102347246A true CN102347246A (en) | 2012-02-08 |
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| CN2011102919021A Pending CN102347246A (en) | 2011-09-30 | 2011-09-30 | Method for encapsulating chip with excellent radiating performance |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715328A (en) * | 2012-10-08 | 2014-04-09 | 深圳市子元技术有限公司 | LED chip packaging method |
| CN104485245A (en) * | 2014-12-10 | 2015-04-01 | 东莞市嘉田电子科技有限公司 | Glue-sealing process for welding switch board |
| CN105042387A (en) * | 2015-08-27 | 2015-11-11 | 刘海兵 | Lamp with LED lamp wick |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201311929Y (en) * | 2007-12-07 | 2009-09-16 | 利顺精密科技股份有限公司 | Radiating structure of improved transistor |
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- 2011-09-30 CN CN2011102919021A patent/CN102347246A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201311929Y (en) * | 2007-12-07 | 2009-09-16 | 利顺精密科技股份有限公司 | Radiating structure of improved transistor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715328A (en) * | 2012-10-08 | 2014-04-09 | 深圳市子元技术有限公司 | LED chip packaging method |
| CN104485245A (en) * | 2014-12-10 | 2015-04-01 | 东莞市嘉田电子科技有限公司 | Glue-sealing process for welding switch board |
| CN105042387A (en) * | 2015-08-27 | 2015-11-11 | 刘海兵 | Lamp with LED lamp wick |
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Application publication date: 20120208 |