CN204216026U - A kind of high-cooling property diode - Google Patents
A kind of high-cooling property diode Download PDFInfo
- Publication number
- CN204216026U CN204216026U CN201420587786.7U CN201420587786U CN204216026U CN 204216026 U CN204216026 U CN 204216026U CN 201420587786 U CN201420587786 U CN 201420587786U CN 204216026 U CN204216026 U CN 204216026U
- Authority
- CN
- China
- Prior art keywords
- copper electrode
- glue
- adhering layer
- backlight unit
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Abstract
The utility model discloses a kind of high-cooling property diode, comprise diode chip for backlight unit, the first copper electrode, the second copper electrode, protection glue-line and epoxy insulation glue, diode chip for backlight unit is between the first copper electrode and the second copper electrode, described first copper electrode has and its first the going between of one each other, second copper electrode has and its second the going between of one each other, the top of described first copper electrode and the second copper electrode all has middle part projection, the middle part of the first copper electrode and the second copper electrode projects through the first welding adhering layer and the second welding adhering layer and is welded to connect with the both positive and negative polarity contact-making surface of diode chip for backlight unit respectively and is integrated, first copper electrode and the second copper electrode sleeve are in the heat radiation sleeve of aluminum, heat radiation sleeve and the first copper electrode, second copper electrode, first lead-in wire, second lead-in wire, epoxy insulation glue is filled with between the outer wall of protection glue-line, it can improve radiating effect, and it can prevent protecting glue from skidding off from the first copper electrode and the second copper electrode.
Description
Technical field:
The utility model relates to electric component technical field, relates to a kind of high-cooling property diode in particular.
Background technology:
At present, existing axial diode is arranged on electronic circuit board by its lead-in wire, plays rectified action.And the protecting glue included by the axial diode of this structure is coated in the periphery of diode chip for backlight unit, the first copper electrode, the second copper electrode, the first welding adhering layer and the second welding adhering layer, seal protection effect can only be played.Detect the electrical property of workpiece in 85 ~ 90% scopes, and comparatively large on the electrical property impact under workpiece high temperature, and due to temperature too high, it easily makes protecting glue easily delay on the lead-in wire of copper electrode.In industry, this phenomenon is referred to as silicon rubber " easy kiss-coating ".This equally also can affect the electrical property of workpiece, make the qualification rate of product low, and production efficiency is low.
And lead-in wire in existing diode easily ruptures after repeatedly bending, at this moment be generally directly change diode, low for its cost of low-power diode, can directly change, when high-power or large-scale its price of diode, whole replacing adds cost.
Utility model content:
The purpose of this utility model overcomes the deficiencies in the prior art, and provide a kind of high-cooling property diode, it can improve radiating effect, and it can prevent protecting glue from skidding off from the first copper electrode and the second copper electrode.
The scheme that the utility model solve the technical problem is:
A kind of high-cooling property diode, comprises diode chip for backlight unit, the first copper electrode, the second copper electrode, protection glue-line and epoxy insulation glue; Diode chip for backlight unit is between the first copper electrode and the second copper electrode; Described first copper electrode has and its first the going between of one each other, second copper electrode has and its second the going between of one each other, the top of described first copper electrode and the second copper electrode all has middle part projection, the middle part of the first copper electrode and the second copper electrode projects through the first welding adhering layer and the second welding adhering layer and is welded to connect with the both positive and negative polarity contact-making surface of diode chip for backlight unit respectively and is integrated, and protection glue-line is coated on diode chip for backlight unit, the first welding adhering layer, the second welding adhering layer, the end face of the first copper electrode and end face of the second copper electrode; First copper electrode and the second copper electrode sleeve in the heat radiation sleeve of aluminum, heat radiation sleeve and the first copper electrode, the second copper electrode, first go between, second go between, protect between the outer wall of glue-line and be filled with epoxy insulation glue;
The outer end of the first lead-in wire and the second lead-in wire all has connector, and connector stretches out the two ends of epoxy insulation glue, connector is bolted with main connecting lead wire.
Described protection glue-line is polyimides glue, and the first welding adhering layer and the second welding adhering layer are weld tabs or soldering paste.
The outer wall of described heat radiation sleeve and inwall form multiple raised item.
Outstanding effect of the present utility model is:
Compared with prior art, it can improve radiating effect, and it can prevent protecting glue from skidding off from the first copper electrode and the second copper electrode.
Accompanying drawing illustrates:
Fig. 1 is structural representation of the present utility model.
Embodiment:
Below in conjunction with accompanying drawing and concrete preferred embodiment, the utility model is elaborated, can be easier to be readily appreciated by one skilled in the art to make advantage of the present utility model and feature, these embodiments are only illustrative objects, are not intended to limit scope of the present utility model.
Embodiment, is shown in as shown in Figure 1, a kind of high-cooling property diode, comprises diode chip for backlight unit 1, first copper electrode 2, second copper electrode 3, protection glue-line 4 and epoxy insulation glue 5, diode chip for backlight unit 1 is between the first copper electrode 2 and the second copper electrode 3, described first copper electrode 2 have with its each other one first go between 21, second copper electrode 3 have with its each other one second go between 31, the top of described first copper electrode 2 and the second copper electrode 3 all has middle part protruding 6, the middle part projection 6 of the first copper electrode 2 and the second copper electrode 3 is welded to connect with the both positive and negative polarity contact-making surface of diode chip for backlight unit 1 respectively by the first welding adhering layer 7 and the second welding adhering layer 8 and is integrated, protection glue-line 4 is coated in diode chip for backlight unit 1, first welding adhering layer 7, second welding adhering layer 8, on the end face of the first copper electrode 2 and the end face of the second copper electrode 3, first copper electrode 2 and the second copper electrode 3 sleeve are in the heat radiation sleeve 9 of aluminum, and heat radiation sleeve 9 and the first copper electrode 2, second copper electrode 3, first go between and 21, second go between 31, protect between the outer wall of glue-line 4 and be filled with epoxy insulation glue 5,
The outer end of the first lead-in wire 21 and the second lead-in wire 31 all has connector 10, and connector 10 stretches out the two ends of epoxy insulation glue 5, connector 10 is bolted with main connecting lead wire 20.
Described protection glue-line 4 is polyimides glue, and the first welding adhering layer 7 and the second welding adhering layer 8 are weld tabs or soldering paste.
The outer wall of described heat radiation sleeve 9 and inwall form multiple raised item 91.
Heat can be dispelled the heat by the heat radiation sleeve 9 of aluminum by it, prevent from protecting the temperature of glue-line 4 and epoxy insulation glue 5 too high, protection glue-line 4 is produced mobile, simultaneously, the top of its first copper electrode 2 and the second copper electrode 3 can prevent protection glue-line 4 to be moved out to the first lead-in wire 21 and the second lead-in wire 31 places, simultaneously, the outer end of its first lead-in wire 21 and the second lead-in wire 31 all has connector 10, connector 10 stretches out the two ends of epoxy insulation glue 5, connector 10 is bolted with main connecting lead wire 20, main connecting lead wire 20 is for removably connecting, when main connecting lead wire 20 fractures, can directly main connecting lead wire 20 be carried out changing, without the need to whole diode is changed, reduce costs.
Above execution mode is only for illustration of the utility model; and be not limitation of the utility model; the those of ordinary skill of relevant technical field; when not departing from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.
Claims (3)
1. a high-cooling property diode, comprises diode chip for backlight unit (1), the first copper electrode (2), the second copper electrode (3), protection glue-line (4) and epoxy insulation glue (5), diode chip for backlight unit (1) is positioned between the first copper electrode (2) and the second copper electrode (3), described first copper electrode (2) have with its each other one first go between (21), second copper electrode (3) have with its each other one second go between (31), it is characterized in that: the top of described first copper electrode (2) and the second copper electrode (3) all has middle part protruding (6), the middle part projection (6) of the first copper electrode (2) and the second copper electrode (3) is welded to connect with the both positive and negative polarity contact-making surface of diode chip for backlight unit (1) respectively by the first welding adhering layer (7) and the second welding adhering layer (8) and is integrated, protection glue-line (4) is coated in diode chip for backlight unit (1), first welding adhering layer (7), second welding adhering layer (8), on the end face of the first copper electrode (2) and the end face of the second copper electrode (3), first copper electrode (2) and the second copper electrode (3) sleeve in the heat radiation sleeve (9) of aluminum, heat radiation sleeve (9) and the first copper electrode (2), the second copper electrode (3), first go between (21), second go between (31), protect between the outer wall of glue-line (4) and be filled with epoxy insulation glue (5),
The outer end of the first lead-in wire (21) and the second lead-in wire (31) all has connector (10), connector (10) stretches out the two ends of epoxy insulation glue (5), connector (10) is bolted with main connecting lead wire (20).
2. a kind of high-cooling property diode according to claim 1, is characterized in that: described protection glue-line (4) is polyimides glue, and the first welding adhering layer (7) and the second welding adhering layer (8) are weld tabs or soldering paste.
3. a kind of high-cooling property diode according to claim 2, is characterized in that: the outer wall of described heat radiation sleeve (9) and inwall form multiple raised item (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420587786.7U CN204216026U (en) | 2014-10-11 | 2014-10-11 | A kind of high-cooling property diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420587786.7U CN204216026U (en) | 2014-10-11 | 2014-10-11 | A kind of high-cooling property diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204216026U true CN204216026U (en) | 2015-03-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420587786.7U Expired - Fee Related CN204216026U (en) | 2014-10-11 | 2014-10-11 | A kind of high-cooling property diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204216026U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362137A (en) * | 2014-10-11 | 2015-02-18 | 东莞市柏尔电子科技有限公司 | High-heat-dissipativity diode |
-
2014
- 2014-10-11 CN CN201420587786.7U patent/CN204216026U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362137A (en) * | 2014-10-11 | 2015-02-18 | 东莞市柏尔电子科技有限公司 | High-heat-dissipativity diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20181011 |