CN108398063A - A kind of electric detonator chip and its packaging method - Google Patents
A kind of electric detonator chip and its packaging method Download PDFInfo
- Publication number
- CN108398063A CN108398063A CN201810213796.7A CN201810213796A CN108398063A CN 108398063 A CN108398063 A CN 108398063A CN 201810213796 A CN201810213796 A CN 201810213796A CN 108398063 A CN108398063 A CN 108398063A
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- Prior art keywords
- chip
- electric detonator
- protective layer
- detonator chip
- glue
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title abstract description 32
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims description 39
- 239000011241 protective layer Substances 0.000 claims description 39
- 238000001746 injection moulding Methods 0.000 claims description 26
- 238000007711 solidification Methods 0.000 claims description 25
- 230000008023 solidification Effects 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000004831 Hot glue Substances 0.000 claims description 15
- 239000004033 plastic Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000004513 sizing Methods 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 239000000539 dimer Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 238000012536 packaging technology Methods 0.000 claims 8
- 238000005538 encapsulation Methods 0.000 abstract description 15
- 239000000047 product Substances 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000011265 semifinished product Substances 0.000 abstract description 3
- 239000000428 dust Substances 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000001548 drop coating Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 210000001217 buttock Anatomy 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42C—AMMUNITION FUZES; ARMING OR SAFETY MEANS THEREFOR
- F42C19/00—Details of fuzes
- F42C19/08—Primers; Detonators
- F42C19/12—Primers; Detonators electric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Air Bags (AREA)
Abstract
The present invention discloses a kind of electric detonator chip and packaging method, and the packaging method carries out an adhesive curing hard encapsulation by the electric detonator chip to semi-finished product and low pressure injection formaing encapsulates, and realizes the secondary encapsulation to electric detonator chip.It ensure that it is moisture-proof that product has in this way, under the premise of dust reduction capability, improving the quality of production consistency and yield rate of electric detonator chip, the double-deck packaging protection also greatly improves the anti-seismic performance of product in use.
Description
Technical field
The present invention relates to electric detonator technical field more particularly to a kind of electric detonator chip and its packaging methods.
Background technology
In the prior art, electric detonator chip directly uses low-pressure injection molding technology in patch and after completing semi-finished product test
Double of completed electronic detonator chip is packaged, and a protective layer is formed in chip periphery, to reach on protection electric detonator chip
Component, make it have the functions such as moisture-proof and dust-proof.But current electric detonator chip production packaging method there is
Two disadvantages：First disadvantage is that low-pressure injection molding is directly carried out to the component on electric detonator chip with the resin after fusing
Encapsulation, and the resin temperature after melting is up to 170 DEG C, briquetting pressure 2Kg/mc2, high temperature and pressure be easy to electric detonator chip
Component damages, and causes product quality consistency not high, yield rate is low；Second disadvantage is electric detonator chip in explosion
During use, since row's spacing is closer, during delayed ignition, the seismic wave for the electric detonator generation that center is first detonated can be right
The electric detonator at edge generates impact, and the component damage on chip can be caused to fail, and generates phenomenon of miss-firing, is made to demolition site
At security risk.
Therefore, the existing technology needs to be improved and developed.
Invention content
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of electric detonator chip and its encapsulation sides
Method.
Technical scheme is as follows：
A kind of electric detonator chip comprising be equipped with the chip of electronic component, be enclosed on the outside of the electric detonator chip
Hard protective layer, the hard protective layer covering are loaded into the electronic component on the chip；On the outside of the hard protective layer
It is enclosed with protective layer, the protective layer wraps up the chip and hard protective layer disposed thereon.
The electric detonator chip, wherein the hard protective layer is epoxy resin black glue layer, thickness 2-3mm.
A kind of packaging method of electric detonator chip comprising：
Step A, the chip for having mounted electronic component is preheated, dispensing is carried out to the chip after preheating, to cover chip
On all electronic components；
Step B, the chip after dispensing is cured, so that chip outer layer forms the hard protective layer of fitting chip；
Step C, low-pressure injection molding is carried out to the chip after solidification using packaging plastic, to form protective layer in chip outer surface, completed
Electric detonator chip package is molded.
The packaging method of the electric detonator chip, in the step A, the sizing material that the dispensing uses is epoxy resin
The hot glue of black glue, and dispensing thickness is 1-1.2mm.
The packaging method of the electric detonator chip, wherein the temperature of the hot glue of the epoxy resin black glue is 45 DEG C ± 5
DEG C degree Celsius.
The packaging method of the electric detonator chip, in the step A, the preheating time of the preheating is 3-5min,
Preheating temperature is 80-100 DEG C.
The packaging method of the electric detonator chip, in the step B, the cured solidification temperature is 80-100
DEG C, hardening time 55-65min.
The packaging method of the electric detonator chip, the step C are specifically included：
Chip after solidification is put into the lower mold of low-pressure injection molding machine, and upper/lower die is molded；
Low-pressure injection molding machine is by the packaging plastic in liquid after being melted into the injection of glue mouth, so that packaging plastic is full of upper/lower die
Form the gap between the electric detonator chip after confined space and solidification；
Upper/lower die is opened after low-pressure injection molding machine delay preset time, to realize the secondary envelope wrapped up entirely the chip after solidification
Dress.
The packaging method of the electric detonator chip, in the step C, packaging plastic that the low-pressure injection molding uses be with
The black particle shape macromolecule resin hot melt adhesive synthesized based on dimer (fatty acid) yl.
The packaging method of the electric detonator chip, wherein the low pressure injection formaing pressure is 2kg/mc2, resin temperature
Degree is 170 DEG C ± 5 DEG C.
Advantageous effect：The present invention provides a kind of electric detonator chip and packaging methods, and it is right that the packaging method passes through
The electric detonator chip of semi-finished product carries out an adhesive curing hard encapsulation and low pressure injection formaing encapsulation, realizes to electric detonator core
The secondary encapsulation of piece.It ensure that it is moisture-proof that product has in this way, under the premise of dust reduction capability, improving the life of electric detonator chip
Yield and quality consistency and yield rate, the double-deck packaging protection also greatly improve the anti-seismic performance of product in use.Together
When, the electric detonator chip encapsulated using this technique is had the following advantages that：
1, electric detonator chip in addition to igniter wire and buttock line solder terminal is all carried out to secondary processes encapsulation, improve electric detonator
Leakproofness, antistatic impact, high-low temperature resistant, anti-vibration and anti-low frequency oscillation impact property, enhance electric detonator comprehensively
Performance；
2, packaging plastic all has melting temperature low, good fluidity, height insulation, high-low temperature resistant, strong viscous force, shock resistance, good airproof performance,
The fast advantage of curing molding, it is easy to use, it is at low cost, it is efficient.
Description of the drawings
Fig. 1 is the structural schematic diagram of electric detonator chip provided by the invention.
Fig. 2 is the explosive view of electric detonator chip provided by the invention.
Fig. 3 is the flow chart of the packaging method of electric detonator chip provided by the invention.
Fig. 4 be electric detonator chip provided by the invention packaging method in encapsulate before electric detonator chip schematic diagram.
Fig. 5 be electric detonator chip provided by the invention packaging method in once encapsulate after electric detonator chip signal
Figure.
Fig. 6 be electric detonator chip provided by the invention packaging method in after secondary encapsulation electric detonator chip signal
Figure.
Specific implementation mode
A kind of electric detonator chip of present invention offer and its packaging method, to make the purpose of the present invention, technical solution and effect
Fruit is clearer, clear, and the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
Only to explain the present invention, it is not intended to limit the present invention.
The present invention provides a kind of electric detonator chips, as illustrated in fig. 1 and 2 comprising are equipped with the core of electronic component
Piece, hard protective layer and protective layer；Hard protective layer package chip is equipped with the part of electronic component and tight with chip
Closely connected conjunction；The protective layer covering is equipped with the outer surface of the chip of hard protective layer, and chip and hard protective layer are wrapped up
In the inner.The present embodiment acts on the electronic component starting protection that is assemblied on chip by hard protective layer, can be to avoid
Influence of the high temperature and pressure to electronic component when using low-pressure injection molding technology generation protective layer, to the electricity on electronic radar chip
Sub- component plays a protective role, to improve the quality of production consistency and yield rate of electric detonator chip.In this implementation
In example, the electric detonator chip is preferably dimensioned to be wide 5mm, length 45mm, and overall thickness is the electronic component set of 3mm
Body, two neighboring electric detonator are fixed for the connecting bridge of 1mm by width, and whole attachment component, electrical property is facilitated to survey
Examination.There are two the circular holes of 3mm for the edges of boards setting of the chip, and positioning is facilitated to fix, and connecting bridge spacing dimension is 2.5mm.In addition,
It cuts for convenience, has V secants at connecting bridge off-chip piece edges of boards 0.4mm, facilitate scoreboard after welding buttock line.
Further, the thickness of the hard protective layer is preferably 2-3mm, hard protective layer filling electronic component with
Gap between chip body, and the part of chip assembly electronic component is covered, to be played to the electronic component on chip
The effect of protection.In the present embodiment, the hard protective layer is preferably epoxy resin black glue layer, the epoxy resin black glue layer
By carrying out dispensing to chip and being solidified to form, sizing material used by the dispensing is the hot glue of epoxy resin black glue,
Wherein, the temperature of the hot glue of epoxy resin black glue is preferably 45 DEG C ± 5 DEG C.
Further, the protective layer is the tubular structure with hollow channel, and the chip passes through hollow channel and part
It is placed in the hollow channel, the hard protection is placed in the hollow channel, and is placed in middle control channel with chip
Part fits.In the present embodiment, the protective layer is resin layer, be by be equipped with the chip of hard protective layer into
Row low-pressure injection molding and get along.
The present invention also provides a kind of packaging methods of electric detonator, and as seen in figures 3-6, the technique includes following step
Suddenly：
S1, the chip for having mounted electronic component is preheated, dispensing is carried out to the chip after preheating, to cover on chip
All electronic components；
S2, the chip after dispensing is cured, so that chip outer layer forms the hard protective layer of fitting chip；
S3, low-pressure injection molding is carried out to the chip after solidification using packaging plastic, to form protective layer in chip outer surface, completes electronics
Detonator chip encapsulated moulding.
Specifically, in the step S1, the preheating is by dispenser to having mounted electronic component
Chip is preheated, wherein the technological parameter of the preheating is：Preheating time is 3-5min, and preheating temperature is 80-100 DEG C.
If pre- thermal parameter is unsatisfactory for above-mentioned requirements, it is unable to reach the moisture of evaporated electron detonator chip wiring board absorption, is avoided rear
Continue the effect that deforms of expanding with heat and contract with cold in process.Meanwhile the electric detonator chip after preheating increases the stream of black glue in dispensing
Dynamic property and penetration, adhesive force is stronger, improves the reliability of product.Further, since the dispensing is carried out by dispenser, that
Can also include upper plate step before preheating and dispensing, the upper plate step, which is specifically as follows, will mount electronics member device
The electric detonator chip of part is put into aluminium box jig and enters dispensing machine worktable.Wherein, the aluminium box can be disposably put into more
Piece electric detonator chip（For example, 50 electric detonator chips）, dispensing machine worktable can disposably be put into several aluminium boxes（Example
Such as, 4 aluminium boxes）, with to multi-disc electric detonator chip（For example, 4*50=200 piece electric detonator chip）It is preheated.And point
Glue machine carries out dispensing to multiple electric detonator chips in several aluminium boxes successively, and when whole electric detonator chips in an aluminium box
After dispensing, taken out and be reentered into the new aluminium box equipped with electric detonator chip being preheated, dispensing follows successively
Ring produces；Dispensing be epoxy resin binding glue in hot glue, hot glue have high reliability, strong adhesive force, cold-and-heat resistent impact
The strong advantage of power.
Further, the hot glue of sizing material epoxy resin black glue used by the dispensing, and the epoxy resin black glue
The temperature of hot glue is preferably 45 DEG C ± 5 DEG C.For example, in a preferable example, the temperature of the hot glue of epoxy resin black glue is 45
DEG C, 45 DEG C of epoxy resin black glue is obtained by epoxy resin black glue is heated to 45 DEG C, can evaporate ring by heating
The moisture of oxygen resin black glue absorption, discharges mixed bubble in epoxy resin black glue so that plastic emitting disengaging Jiao Zui is more smooth, keeps away
Exempt from wire drawing phenomenon, increase the mobility and penetration of black glue, black glue is made to cover all component top surfaces and fills up entire
Gap between electric detonator chip component improves the reliability of product.
In addition, it is specially to arrive the heating preheating uniform drop coating of epoxy resin black glue that the chip after described pair of preheating, which carries out dispensing,
It is placed on the electric detonator chip in aluminium box, wherein the standard of the drop coating is that epoxy resin black glue wraps electric detonator core
All components of on piece.The thickness for dispensing glue is 1-1.2mm.For example, in a preferable example, dispensing thickness is 1.2mm.
Further, in the step S2, in solidification, the electric detonator chip for filling epoxy resin black glue is put into solid
Change and carry out heat cure in stove, is protected so that electric detonator chip outer layer forms the epoxy encapsulation glue hard that one layer fits closely
Sheath.The cured cure parameter is：Solidification temperature is 80-100 DEG C, hardening time 55-65min, the hard protection
The thickness of layer is 1-1.2mm.For example, in a preferable example, solidification temperature is 90 DEG C, and hardening time is 60 minutes, hard
The thickness of protective layer is 1.2mm.Cure parameter and hard thickness use above-mentioned parameter, can make the hard protection after solidification
Layer has good high-insulativity, can prevent electrostatic from causing electric detonator chip failure, and the glue-line after curing have by
Pressure is unlikely to deform, and the heated characteristic also not softened more improves the reliability and stability of product.
It, after hardening, can be to the electricity after epoxy resin adhesive curing in addition, in order to improve the protectiveness of hard protective layer
Sub- detonator chip is detected, and judges whether encapsulate appearance and properties of product reaches standard.Wherein, detection process is specific after solidification
Can be：First to first carrying out sight check with the electric detonator chip after epoxy resin cure, it is completely covered with curing black glue
There is component top surface in residence and fills up the gap between entire electric detonator chip component, and it is standard that cannot exceed edges of boards edge, no
Qualified point adhesive curing again；Then both-way communication detection is carried out to electric detonator chip with special inspecting equipment, ensures solidification
The sub- detonator chip of each power generation afterwards reaches requirement.
Further, in the step S3, the packaging plastic that the low-pressure injection molding uses is to be closed based on dimer (fatty acid) yl
At black particle shape macromolecule resin hot melt adhesive, and the technological parameter of the low-pressure injection molding is：Briquetting pressure is 2kg/
mc2, resin temperature is 170 DEG C ± 5 DEG C.Since electric detonator chip has had the glue-line after solidification, glue-line, which has to be pressurized, to be not easy
Deformation, the heated characteristic also not softened, so low-pressure injection molding will not generate shadow to the hard protective layer of the chip surface after solidification
It rings.For example, in a preferred example, low pressure injection formaing pressure is 2kg/mc2, resin temperature is 170 DEG C, solidified forming time
For 25S.
In addition, the detailed process of the low-pressure injection molding can be that the electric detonator chip after solidification is put into low-pressure injection molding machine
Lower mold in, upper/lower die molding, low-pressure injection molding machine is by the way that into the resin for being in liquid after the injection melting of glue mouth, resin fills
The gap between electric detonator chip after the full confined space and solidification.After fixing, being molded after liquid resin, open up and down
Mold, finally the resin layer of electric detonator chip outer wrapping covering last layer good seal after hardening, realizes electronics thunder
The secondary encapsulation of tube chip.In addition, it is semi-circular recesses that the low pressure injection mould, which is upper and lower mould, diameter cures more than black glue
The width of electric detonator chip afterwards, the cylinder package formed after injection molding be less than or equal to detonator shell internal diameter, facilitate by
The electric detonator chip of secondary encapsulation is fitted into capsule.For example, electric detonator shell internal diameter is 6mm, the outer diameter of protective layer is
5.9mm。
Further, can also include finished product test step after the completion of low-pressure injection molding, the finished product test step is specially
The electric detonator chip of 2 encapsulated mouldings is subjected to final product quality detection.
The electric detonator packaging method provided in order to further illustrate the present invention is subject to reference to a specific embodiment
Explanation.
Embodiment one
A kind of packaging method of electric detonator chip is present embodiments provided, the technique specifically includes：
The aluminium box for being placed with electric detonator chip module is put into 90 DEG C of automatic dispensing machine heating platen temperature first, is preheated 4 minutes,
The secondary epoxy resin binding black glue by 45 DEG C of heating is by dispenser drop coating to each electric detonator chip positive and negative, all standing
There is component top surface in residence and fills up the gap between entire electric detonator chip component, forms the wide 5mm in two sides, long 21mm and thickness
Then the electric detonator chip for having put glue is put into 90 DEG C by the epoxy resin black glue layer of 1.2mm by positive and negative priority dispensing sequence
Curing oven in, cure 60 minutes, the electric detonator chip after solidification taken out cooling to get to the electric detonator once encapsulated
Chip.The electric detonator chip after solidification is put into the lower mold of low-pressure injection molding machine again, upper/lower die molding, low-pressure injection molding
Machine is by the hot-fusible high-molecular glue in liquid after being melted into the injection of glue mouth, after hot melt adhesive is full of the confined space and solidification
Electric detonator chip between gap；Hot melt adhesive cooling is fixed after 30 seconds, is molded, and low-pressure injection molding machine opens upper/lower die, most
The cylindrical resin layer of electric detonator chip outer wrapping covering last layer good seal after hardening eventually, realizes to after solidification
The full package secondary encapsulation of electric detonator chip, electric detonator chip integral diameter is 5.9mm after secondary encapsulation, and die ejector pin is whole
Body ejecting product is to get to the molding electric detonator chip of final secondary encapsulation.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of electric detonator chip, which is characterized in that it includes the chip for being equipped with electronic component, the electric detonator core
Hard protective layer is enclosed on the outside of piece, the hard protective layer covering is loaded into the electronic component on the chip；Described in institute
It is enclosed with protective layer on the outside of hard protective layer, the protective layer wraps up the chip and hard protective layer disposed thereon.
2. electric detonator chip according to claim 1, which is characterized in that the hard protective layer is epoxy resin black glue
Layer, thickness 2-3mm.
3. a kind of packaging technology of electric detonator chip, which is characterized in that it includes：
Step A, the chip for having mounted electronic component is preheated, dispensing is carried out to the chip after preheating, to cover chip
On all electronic components；
Step B, the chip after dispensing is cured, so that chip outer layer forms the hard protective layer of fitting chip；
Step C, low-pressure injection molding is carried out to the chip after solidification using packaging plastic, to form protective layer in chip outer surface, completed
Electric detonator chip package is molded.
4. the packaging technology of electric detonator chip according to claim 3, which is characterized in that in the step A, the point
The sizing material that glue uses is the hot glue of epoxy resin black glue, and dispensing thickness is 1-1.2mm.
5. the packaging technology of electric detonator chip according to claim 4, which is characterized in that the heat of the epoxy resin black glue
The temperature of glue is 45 DEG C ± 5 DEG C.
6. the packaging technology of electric detonator chip according to claim 3, which is characterized in that described pre- in the step A
The preheating time of heat is 3-5min, and preheating temperature is 80-100 DEG C.
7. the packaging technology of electric detonator chip according to claim 3, which is characterized in that described solid in the step B
The solidification temperature of change is 80-100 DEG C, hardening time 55-65min.
8. the packaging technology of electric detonator chip according to claim 3, which is characterized in that the step C is specifically included：
Chip after solidification is put into the lower mold of low-pressure injection molding machine, and upper/lower die is molded；
Low-pressure injection molding machine is by the packaging plastic in liquid after being melted into the injection of glue mouth, so that packaging plastic is full of upper/lower die
Form the gap between the electric detonator chip after confined space and solidification；
Upper/lower die is opened after low-pressure injection molding machine delay preset time, to realize the secondary envelope wrapped up entirely the chip after solidification
Dress.
9. according to the packaging technology of the electric detonator chip of claim 3 or 8, which is characterized in that in the step C, institute
It is the black particle shape macromolecule resin hot melt adhesive synthesized based on dimer (fatty acid) yl to state the packaging plastic that low-pressure injection molding uses.
10. the packaging technology of electric detonator chip according to claim 3, which is characterized in that the low pressure injection formaing pressure
Power is 2kg/mc2, resin temperature is 170 DEG C ± 5 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810213796.7A CN108398063B (en) | 2018-03-15 | 2018-03-15 | A kind of electric detonator chip and its packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810213796.7A CN108398063B (en) | 2018-03-15 | 2018-03-15 | A kind of electric detonator chip and its packaging method |
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| CN108398063B CN108398063B (en) | 2019-07-30 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108942006A (en) * | 2018-09-19 | 2018-12-07 | 四川航天川南火工技术有限公司 | Positioning device and method are covered in a kind of superfine metal bridge wire automatic and accurate drawing |
| CN109631690A (en) * | 2018-12-17 | 2019-04-16 | 江西国泰民爆集团股份有限公司 | A kind of spool vertical die for the production of electric detonator automatic assembling |
| CN112071645A (en) * | 2020-09-10 | 2020-12-11 | 闽江学院 | Lead frame type electronic component packaging method |
| CN113835170A (en) * | 2021-11-26 | 2021-12-24 | 长芯盛（武汉）科技有限公司 | Injection molding packaging method of photoelectric module and photoelectric module thereof |
| CN114314495A (en) * | 2021-12-24 | 2022-04-12 | 苏州捷研芯电子科技有限公司 | MEMS integrated packaging structure and preparation method thereof |
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| US5097317A (en) * | 1989-09-08 | 1992-03-17 | Mitsubishi Denki Kabushiki Kaisha | Resin-sealed semiconductor device |
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| CN108942006A (en) * | 2018-09-19 | 2018-12-07 | 四川航天川南火工技术有限公司 | Positioning device and method are covered in a kind of superfine metal bridge wire automatic and accurate drawing |
| CN108942006B (en) * | 2018-09-19 | 2020-07-14 | 四川航天川南火工技术有限公司 | Automatic accurate drawing and covering positioning device and method for ultra-fine metal bridge wire |
| CN109631690A (en) * | 2018-12-17 | 2019-04-16 | 江西国泰民爆集团股份有限公司 | A kind of spool vertical die for the production of electric detonator automatic assembling |
| CN109631690B (en) * | 2018-12-17 | 2023-08-22 | 江西新余国泰特种化工有限责任公司 | A vertical mould of spool for electronic detonator automatic assembly production |
| CN112071645A (en) * | 2020-09-10 | 2020-12-11 | 闽江学院 | Lead frame type electronic component packaging method |
| CN113835170A (en) * | 2021-11-26 | 2021-12-24 | 长芯盛（武汉）科技有限公司 | Injection molding packaging method of photoelectric module and photoelectric module thereof |
| CN113835170B (en) * | 2021-11-26 | 2022-03-29 | 长芯盛（武汉）科技有限公司 | Injection molding packaging method of photoelectric module and photoelectric module thereof |
| CN114314495A (en) * | 2021-12-24 | 2022-04-12 | 苏州捷研芯电子科技有限公司 | MEMS integrated packaging structure and preparation method thereof |
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