CN108878377A - Power module and preparation method thereof and air conditioner - Google Patents
Power module and preparation method thereof and air conditioner Download PDFInfo
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- CN108878377A CN108878377A CN201810695061.2A CN201810695061A CN108878377A CN 108878377 A CN108878377 A CN 108878377A CN 201810695061 A CN201810695061 A CN 201810695061A CN 108878377 A CN108878377 A CN 108878377A
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- thermosetting property
- power module
- plastic packaging
- power
- thermoset package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The present invention discloses a kind of power module and preparation method thereof and air conditioner, the power module include：(PCC) power, and, thermoset package shell, (PCC) power is set in thermoset package shell；Wherein, the material of thermoset package shell includes thermosetting property plastic packaging material and thermosetting property filler material, and the softening point of thermosetting property plastic packaging material is less than the softening point of thermosetting property filler material.The present invention, which is solved, repair the stomata occurred on encapsulating housing can not since the manufacture craft of thermosetting property plastic packaging is irreversible, the problem of production is bad, and the scrappage of power module is caused to increase occurs.The present invention improves the yields of power module production.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of power module and preparation method thereof and air conditioner.
Background technique
Power module, i.e. IPM (Intelligent Power Module) are a kind of by power electronics and integrated circuit skill
The power drive class product that art combines is generally used on the electric-controlled plates of equipment such as driving blower, compressor.
Power module generally has (PCC) power and the encapsulating housing for encapsulating (PCC) power, and encapsulating housing can be adopted
With thermoplastic material or thermosetting material, thermosetting property plastic packaging material can not restore mobility after shaping.But power module exists
After completing encapsulation, there may be encapsulation stomatas on the outer side surface of the encapsulating housing of power module.The encapsulation stomata is again due to warm
The manufacture craft of solidity plastic packaging is irreversible and can not repair, and appearance production is bad, and the scrappage of power module is caused to increase.
Summary of the invention
The main object of the present invention is to propose a kind of power module and preparation method thereof and air conditioner, it is intended to improve power
The yields of module making.
To achieve the above object, the present invention proposes that a kind of power module, the power module include：
(PCC) power, and,
Thermoset package shell, the (PCC) power are set in the thermoset package shell；Wherein,
The material of the thermoset package shell includes thermosetting property plastic packaging material and thermosetting property filler material, the thermosetting property plastic packaging
The softening point of material is less than the softening point of the thermosetting property filler material.
Optionally, the adding proportion of the thermosetting property filler material is 10%~15%.
Optionally, the thermoset package shell further includes silica and/or aluminium oxide；
The size of the thermosetting property filler material is not more than the size of the silica and the aluminium oxide.
Optionally, the thermosetting property plastic packaging material and thermosetting property filler material are epoxy resin, polyurethane, one in phenolic resin
Kind is a variety of.
Optionally, the (PCC) power includes：
Installation base plate；
Insulating layer, the insulating layer are set on the installation base plate；
Circuit-wiring layer, is formed in the surface of the insulating layer, and the circuit-wiring layer has for the power module
The installation position of electronic component installation；
Power switch tube and driving chip, the driving chip and the power switch tube are respectively arranged at corresponding described
On the installation position of circuit-wiring layer.
Optionally, the installation base plate is in inside the encapsulating housing, or is at least partly revealed in the thermosetting property
Outside encapsulating housing.
Optionally, the outer side surface of the thermoset package shell is also coated with sealant.
The production method that the present invention also proposes a kind of power module, includes the following steps：
Prepare installation base plate, insulating materials, copper foil, power switch tube, driving chip, multiple pins and thermoset package shell
Body material；The material of the thermoset package shell includes thermosetting property plastic packaging material and thermosetting property filler material, wherein the thermosetting property
The material of encapsulating housing includes thermosetting property plastic packaging material and thermosetting property filler material, and the softening point of the thermosetting property plastic packaging material is less than described
The softening point of thermosetting property filler material；
Insulating layer and circuit-wiring layer are sequentially formed in the installation base plate；And it configures on the circuit-wiring layer for function
The installation position of the electronic component installation of rate module；
The power switch tube of power module and driving chip are installed on the corresponding installation position of the circuit-wiring layer；
Multiple pins are welded in the corresponding position of the circuit-wiring layer, and multiple pins pass through the circuit-wiring layer
It is connected with the corresponding power switch tube and driving chip, to form wiring board；
It is fabricated to thermosetting property plastic part；
Thermoset package plastic part is heated to the first preset temperature, in the thermoset package shell plastic part
When thermosetting property plastic packaging material softens, by the installation base plate, the circuit-wiring layer, the power switch tube and the main control chip
It is packaged in the thermosetting property plastic packaging shell of thermoset package plastic part formation, obtains power module；
In the outer side surface for detecting the thermosetting property plastic packaging shell there are when stomata, the thermosetting property plastic packaging shell is added
Heat is to the second preset temperature, when with thermosetting property filler material softening in the thermoset package shell plastic part, the thermosetting
Property filler material is filled to the stomata.
Optionally, the thermoset package shell plastic part that is fabricated to specifically includes：
Thermosetting property plastic packaging material and thermosetting property filler material are mixed, the first mixing is formed；
First mixing is successively carried out to heating and cooling treatment；
First mixing after cooling is crushed；
First mixing is subjected to roll forming with ingot grain moulding process, it is described at thermosetting property dress shell plastic packaging to be formed
Part.
The present invention also proposes a kind of air conditioner, including power module as described above；The power module includes：Power packages
Part, and, thermoset package shell, the (PCC) power is set in the thermoset package shell；Wherein, the thermosetting property
The material of encapsulating housing includes thermosetting property plastic packaging material and thermosetting property filler material, and the softening point of the thermosetting property plastic packaging material is less than described
The softening point of thermosetting property filler material.
The (PCC) power made is put into die cavity by power module of the present invention during production, and by thermosetting property
Plastic packaging material and thermosetting property filler material carry out mixing, then heat the above-mentioned thermoset package case material mixed；To
Thermoset package case material is crushed after cooling, then is rolled into thermoset package case material with ingot grain moulding process
Shape, to form thermosetting property plastic part.Again through being heated at high temperature in the injecting glue pipeline of mold, and reach thermosetting property modeling in heating temperature
When sealing the softening point of material, thermosetting property plastic packaging material becomes flow regime and is injected into die cavity, is then heated again in die cavity,
With curing molding, thermoset package shell is formed, thus by including power device package.Hereafter it can be set by ultrasound examination
It is standby to detect whether there is stomata on thermoset package shell, and detect stomata there are when, continue to thermoset package
Shell is heated, until reach the softening point of thermosetting property packing material, and makes thermosetting property packing material from solid phase to flowing shape
The encapsulation stomata on encapsulating housing surface is carried out secondary filling by the conversion of state, the thermosetting property packing material after softening, to eliminate envelope
Fill stomata.Then it is again heated to solidification temperature T3, with curing molding after progress, thermoset package shell is formed, thus by function
Including rate component package, and then realize that thermoset package shell is wholely set with (PCC) power.The present invention is solved due to thermosetting
Property plastic packaging manufacture craft it is irreversible and the stomata occurred on encapsulating housing can not be repaired, it is bad production occur, leads to function
The problem of scrappage of rate module increases.The present invention improves the yields of power module production.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of power module of the present invention；
Fig. 2 is the flow diagram of one embodiment of production method of intelligent power module of the present invention.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 10 | (PCC) power | 14 | Insulating layer |
| 11 | Installation base plate | 20 | Thermoset package shell |
| 12 | Circuit-wiring layer | 30 | Pin |
| 13 | Metal wiring |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that if relating to directionality instruction (such as up, down, left, right, before and after ...) in the embodiment of the present invention,
Then directionality instruction be only used for explain under a certain particular pose (as shown in the picture) between each component relative positional relationship,
Motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, being somebody's turn to do " first ", " second " etc. if relating to the description of " first ", " second " etc. in the embodiment of the present invention
Description be used for description purposes only, be not understood to indicate or imply its relative importance or implicitly indicate indicated skill
The quantity of art feature." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one spy
Sign.It in addition, the technical solution between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
It is enough realize based on, will be understood that the knot of this technical solution when conflicting or cannot achieve when occurs in the combination of technical solution
Conjunction is not present, also not the present invention claims protection scope within.
The present invention proposes a kind of power module.
Referring to Fig.1, in an embodiment of the present invention, which includes：
(PCC) power 10, and,
Thermoset package shell 20, the (PCC) power 10 are set in the thermoset package shell 20；Wherein,
The material of the thermoset package shell 20 includes thermosetting property plastic packaging material and thermosetting property filler material, the thermosetting property modeling
The softening point T1 of envelope material is less than the softening point T2 of the thermosetting property filler material.
In the present embodiment, (PCC) power 10 includes the driving chip of power switch tube and the work of driving power switching tube,
In some embodiments, (PCC) power 10 can also include main control chip, and in power module work, driving chip is receiving master
When controlling the control instruction of chip output, control instruction is converted into corresponding driving signal, to drive corresponding power switch
Pipe conducting, thus output driving electric energy.Power switch tube can realize that quantity is generally six using metal-oxide-semiconductor or IGBT
Or four, six power switch tubes form three-phase inversion bridge circuit, or form two-phase inverter by four power switch tubes
Bridge circuit, for driving the loaded work pieces such as blower, compressor.
During specific implementation, (PCC) power 10 is also specifically included：
Installation base plate 11；
Insulating layer 14, the insulating layer 14 are set on the installation base plate 11.
Circuit-wiring layer 12 is formed in the surface of the insulating layer 14, and the circuit-wiring layer 12, which has, supplies the power
The installation position of the electronic component installation of module；
Power switch tube (figure does not indicate) and driving chip (figure does not indicate), the driving chip and the power switch tube
It is respectively arranged on the installation position of the corresponding circuit-wiring layer 12.
The power module further includes that pin 30 described in pin 30 is set on the circuit-wiring layer 12, and is passed through described
Metal wire is electrically connected with the power component and the driving chip.
In the present embodiment, the pin 30 can use gull wing type or direct plugging-in, and pin 30 is welded on installation base plate 11
On, the pad locations on the corresponding installation position of circuit-wiring layer 12.
Wherein, driving chip, main control chip and each power switch tube are arranged using paster technique in circuit-wiring layer 12
After on corresponding installation position, it can be electrically connected by conductive materials such as scolding tin with the realization of circuit-wiring layer 12, and form current loop.
Driving chip, main control chip and each power switch tube can also be attached at the corresponding peace of circuit-wiring layer 12 by the technique of upside-down mounting
It fills on position, and by forming current loop between circuit-wiring layer 12 and metal wiring 13 and each circuit element, completes power mould
The production of block circuit board.It is understood that the electronic component in above-mentioned each power switch tube, driving chip and main control chip can
To be realized using bare silicon wafer, can also be realized using the surface mount elements after encapsulation.
Installation base plate 11 can be real using substrate made by the materials such as lead frame, cardboard, half glass-fiber-plate, glass-fiber-plate
It is existing, it can also be using the aluminium perhaps aluminum alloy copper perhaps metal substrates such as copper alloy or aluminium oxide (Al2O3) or nitridation
Substrate made from the ceramic substrates such as aluminium (AlN) or other materials with high thermal conductivity heat dissipation performance is realized.The present embodiment is excellent
Choosing is realized using glass-fiber-plate.The shape of installation base plate 11 can be according to circuit-wiring layer 12, the quantity of power switch tube and position
Set and power module in other electronic components specific location and size determine, can be to be rectangular, but be not limited to rectangular.
Circuit-wiring layer 12 forms corresponding route and right according to the circuit design of power module on installation base plate 11
The installation position that should be installed for each electronic component, i.e. pad, specifically, after installation base plate 11 sets insulating layer 14, by copper foil
It is laid on insulating layer 14, and etches the copper foil according to preset circuit design, to form circuit-wiring layer 12.Certainly exist
In other embodiments, such as the ceramic substrate that uses of installation base plate 11 is come when realizing, no setting is required insulating layer 14 and by circuit cloth
Line layer 12 is directly arranged at the surface of ceramic substrate, or is embedded in ceramic substrate.
In the present embodiment, thermoset package shell 20 is made of the materials such as thermosetting property plastic packaging material and thermosetting property filler material, heat
Solidity plastic packaging material can be one of epoxy resin, polyurethane, phenolic resin or by epoxy resin, polyurethane, phenolic resin
The mixture of multiple material composition；Thermosetting property filler material can be one of epoxy resin, polyurethane, phenolic resin or by ring
Oxygen resin, polyurethane, phenolic resin multiple material composition mixture, the adding proportion of thermosetting property filler material is 10%~
15%.
It referring to Fig.1, in some embodiments, further include the insulating properties such as silica, aluminium oxide in thermosetting property plastic packaging shell
Preferably, and according to its heat resistance and the preferable characteristic of heat conductivity thermosetting property can be improved in the higher highly heat-conductive material of thermal conductivity
20 heat-transfer capability of encapsulating housing, to improve the radiating efficiency of power module.
In the present embodiment, softening point it can be appreciated that when conversion of the thermosetting material from temperature from solid phase to molten condition
Degree.Namely during high-temperature heating, in the softening point for reaching thermosetting material, the state of thermosetting material can be by solid-state
It is changed into flow regime, therefore thermosetting material can be passed through into the thermosetting property plastic packaging shell after being injected into die sinking after high-temperature heating
In mold, thermosetting property plastic packaging shell can be obtained.In the present embodiment, the softening point T1 of thermosetting property plastic packaging material is filled less than thermosetting property
The softening point T2 of material, after high-temperature heating, in the softening point T1 for reaching thermosetting property plastic packaging material, so that thermosetting property plastic packaging material is by solid-state
Be changed into flow regime, at this time due to and not up to thermosetting property filler material softening point T2, thermosetting property packing material still protects
Hold solid states.
It, can be by epoxy resin, polyurethane, phenolic resin, aluminium oxide, titanium dioxide when making thermoset package shell 20
The materials such as silicon carry out mixing, then heat above-mentioned 20 material of thermoset package shell mixed；After cooling, it crushes
20 material of thermoset package shell, then 20 material of thermoset package shell is carried out by roll forming with ingot grain moulding process,
To form thermosetting property plastic part.Later, the power module circuit plate made can be put into die cavity, thermosetting property plastic part exists
Reach the softening of the thermosetting property plastic packaging material in thermosetting property plastic part through being heated at high temperature, and in heating temperature in the injecting glue pipeline of mold
When point T1, thermosetting property plastic packaging material becomes flow regime and is injected into die cavity, and solidification temperature is then again heated in die cavity
T3 is spent, with curing molding, forms thermoset package shell 20, thus in (PCC) power 10 is encapsulated in, and then realize thermosetting property
Encapsulating housing 20 is wholely set with (PCC) power 10.
It should be noted that since thermosetting property plastic packaging material can not restore mobility after shaping.Therefore, when in power module
Thermoset package shell 20 be wholely set with (PCC) power 10, namely complete power module encapsulation after, the envelope of power module
There may be encapsulation stomatas 100 on the outer side surface of dress shell.Extraneous vapor, dust etc. be possible to lead to the stomata 100 into
Enter the inside of power module, and driving chip, main control chip and each power switch tube in power module is made short circuit etc. occur
Failure causes power module can not work normally.Alternatively, due to stomata 100 presence and cause external electromagnetic wave interference influence
The normal work of power module.The encapsulation stomata 100 can not be repaired since the manufacture craft of thermosetting property plastic packaging is irreversible again, out
It now makes bad, the scrappage of power module is caused to increase.
To solve the above-mentioned problems, power module of the present invention puts the (PCC) power 10 made during production
Enter in die cavity, and thermosetting property plastic packaging material and thermosetting property filler material are subjected to mixing, the above-mentioned thermoset package that then will be mixed
20 material of shell is heated；20 material of thermoset package shell is crushed after cooling, then with ingot grain moulding process by thermosetting property
20 material of encapsulating housing carries out roll forming, to form thermosetting property plastic part.Again through being heated at high temperature in the injecting glue pipeline of mold,
And when heating temperature reaches the softening point T1 of thermosetting property plastic packaging material, thermosetting property plastic packaging material becomes flow regime and is injected into die cavity
It is interior, it is then heated again in die cavity, with curing molding, thermoset package shell 20 is formed, thus by 10 envelope of (PCC) power
Mounted in interior.Whether hereafter can be detected by ultrasonic detecting equipment has stomata 100 on thermoset package shell 20, and
Detect stomata 100 there are when, continue to heat thermoset package shell 20, until reach thermosetting property packing material
Softening point, and make conversion of the thermosetting property packing material from solid phase to flow regime, the thermosetting property packing material after softening will encapsulate
The encapsulation stomata 100 of surface of shell carries out secondary filling, encapsulates stomata 100 to eliminate.Then it is again heated to solidification temperature T3,
With curing molding after carrying out, thermoset package shell 20 is formed, thus in (PCC) power 10 is encapsulated in, and then realize thermosetting property
Encapsulating housing 20 is wholely set with (PCC) power 10.The present invention solves and makes since the manufacture craft of thermosetting property plastic packaging is irreversible
Obtaining the stomata 100 occurred on encapsulating housing can not repair, and appearance production is bad, cause the scrappage of power module is raised to ask
Topic.The present invention improves the yields of power module production.
It is understood that in above-described embodiment, the softening point of the softening point T1 of thermosetting property plastic packaging material, thermosetting property filler material
There is following relationship, T1 between T2 and solidification temperature T3<T2<T3；T1~T3 is that thermosetting property plastic packaging material softens completely to rear solidification
Temperature range, T2~T3 be thermosetting property filler material soften completely to rear cured temperature range.The temperature range of T1 be 175~
185 DEG C, the temperature range of T2 is 180~190 DEG C, and the temperature range of T3 is 195~200 DEG C.
Referring to Fig.1, in an alternative embodiment, the thermoset package shell 20 further includes silica and/or oxidation
Aluminium；
The size of the thermosetting property filler material is not more than the size of the silica and the aluminium oxide.
In the present embodiment, it is highly heat-conductive material that silica and aluminium oxide are additionally provided in thermosetting property plastic packaging shell, to mention
The rate of heat addition of high power module, silica and aluminium oxide are macromolecular particle object, in encapsulation process, in order to make thermosetting property
Filler material can smoothly fill in mold, which exists in the form of molecule mostly, and size can be with
The size of silica and alumina particle is suitable, but is not more than the size of silica and the aluminium oxide, and the present embodiment can
The size for being selected as thermosetting property filler material is identical as the size of thermosetting property plastic packaging material.
Referring to Fig.1, in an alternative embodiment, the installation base plate 11 is in inside the encapsulating housing, or at least
Part is revealed in outside the thermoset package shell 20.
In the present embodiment, when installation base plate 11 is in thermoset package 20 inside of shell, driving chip, main control chip and
The heat that each power switch tube generates is conducted by insulating layer 14 to installation base plate 11, then through the conduction of installation base plate 11 to heat
It after solidity encapsulating housing 20, is conducted heat in air by thermoset package shell 20, accelerates the heat dissipation speed of power module
Rate.Or installation base plate 11 side it is some or all of be revealed in outside thermoset package shell 20, so set, to drive
The heat that chip, main control chip and each power switch tube generate is conducted by insulating layer 14 to installation base plate 11, then through pacifying
It fills substrate 11 directly to radiate to air, further increases the contact area of heat and air, improve rate of heat dispation.
Referring to Fig.1, in an alternative embodiment, in order to eliminate the stomata 100 on thermoset package shell 20, in the heat
The outer side surface of solidity encapsulating housing 20 can also coat sealant, in the outer side surface shape of sealing thermoset package shell 20
At sealant.
Specifically, in being encapsulated in (PCC) power 10, realize that thermoset package shell 20 is integrally set with (PCC) power 10
It postpones, if detecting the power that the surface of thermoset package shell 20 has stomata 100, can will have encapsulation stomata 100
Modular surface coats high fluidity sealant, and then the power module for being coated with sealant is placed in low vacuum environment, height flowing
Property sealant can continue to be heated to rear solidification temperature T3 to be filled inside encapsulation stomata 100, it is solid to realize at high temperature
Change, encapsulation stomata 100 is sealed, to be heating and curing.
The production method that the present invention also proposes a kind of power module.
Referring to Fig. 2, the production method of the power module includes the following steps：
S10, prepare installation base plate, insulating materials, copper foil, power switch tube, multiple pins and thermoset package shell material
Material；The material of the thermoset package shell includes thermosetting property plastic packaging material and thermosetting property filler material, wherein the thermoset package
The material of shell includes thermosetting property plastic packaging material and thermosetting property filler material, and the softening point of the thermosetting property plastic packaging material is less than the thermosetting
The softening point of property filler material；
In the present embodiment, power module is mainly made of installation base plate, power switch tube, driving chip and encapsulating housing.
S20, insulating layer and circuit-wiring layer are sequentially formed in the installation base plate；And it is configured on the circuit-wiring layer
For the installation position of the electronic component installation of power module；
It is laid with insulating material, on installation base plate to form insulating layer.
Corresponding electric current cabling and correspondence is formed on the insulating layer according to the circuit design of power module in circuit-wiring layer
The installation position of power component installation, i.e. pad.
Specifically, it is laid with copper foil in the upper surface of the hot substrate, and etches the copper foil according to preset circuit design,
To form circuit-wiring layer.
S30, the power switch tube of power module and driving chip are installed on to the corresponding installation position of the circuit-wiring layer
On；
The power switch tube of power module is installed on the corresponding installation position of the circuit-wiring layer；
Driving chip, main control chip and each power switch tube can be attached at circuit cloth by the technique of patch or upside-down mounting
It is complete on the corresponding installation position of line layer, and by forming current loop between circuit-wiring layer and metal wiring and each circuit element
The production of success rate module circuit board.It is understood that the electricity in above-mentioned each power switch tube, driving chip and main control chip
Subcomponent can be realized using bare silicon wafer, can also be realized using the surface mount elements after encapsulation.
S40, multiple pins are welded in the corresponding position of the circuit-wiring layer, and multiple pins pass through the circuit cloth
Line layer is connected with the corresponding power switch tube and driving chip, to form wiring board；
Pin can be gull wing type, and perhaps direct plugging-in metal wire can be aluminum steel or gold thread, driving chip and power member
Part realizes electrical connection by metal wire and circuit-wiring layer.
S50, it is fabricated to thermosetting property plastic part；
In the present embodiment, the thermoset package shell plastic part that is fabricated to is specifically included：
Thermosetting property plastic packaging material and thermosetting property filler material are mixed, the first mixing is formed；
First mixing is successively carried out to heating and cooling treatment；
First mixing after cooling is crushed；
First mixing is subjected to roll forming with ingot grain moulding process, it is described at thermosetting property dress shell plastic packaging to be formed
Part.
S60, thermoset package plastic part is heated to the first preset temperature, in the thermoset package shell plastic part
When interior thermosetting property plastic packaging material softens, by the installation base plate, the circuit-wiring layer, the power switch tube and the master control
Chip package obtains power module in the thermosetting property plastic packaging shell that thermoset package plastic part is formed；
In the present embodiment, the first preset temperature be thermosetting property plastic packaging material softening point namely thermosetting material from solid phase to
The temperature of the conversion of molten condition.Thermosetting property plastic packaging material becomes flow regime and is injected into die cavity, then through again in die cavity
It is secondary to be heated to solidification temperature T3, with curing molding, thermoset package shell is formed, thus by including power device package, in turn
Realize that thermoset package shell is wholely set with (PCC) power.
S70, in the outer side surface for detecting the thermosetting property plastic packaging shell there are when stomata, by the thermosetting property plastic packaging shell
Body is heated to the second preset temperature, described when being softened with the thermosetting property filler material in the thermoset package shell plastic part
Thermosetting property filler material is filled to the stomata.
Whether in the present embodiment, can be detected by ultrasonic detecting equipment on thermoset package shell has stomata,
And detect stomata there are when, continue to heat thermoset package shell, until reach thermosetting property packing material
Softening point, and make conversion of the thermosetting property packing material from solid phase to flow regime, the thermosetting property packing material after softening will encapsulate
The encapsulation stomata of surface of shell carries out secondary filling, to eliminate encapsulation stomata.Then it is again heated to solidification temperature T3, and will be warm
Degree maintains in T2~T3 temperature range, and thermosetting property packing material can be made to soften, after realizing the secondary filling to encapsulation stomata,
After heat preservation in through a long time (10~20 minutes), molding is fully cured in thermosetting property packing material, forms thermoset package shell, thus
Including power device package, and then realize that thermoset package shell is wholely set with (PCC) power.
It will also be appreciated that when on detecting thermoset package shell without encapsulation stomata, it only need to be by thermoset package
The temperature of shell, which maintains, carries out long-time heat preservation solidification in T1~T3.
The present invention improves the yields of power module production.
The present invention also proposes that a kind of air conditioner, the air conditioner include power module as described above.The power module
Detailed construction can refer to above-described embodiment, and details are not described herein again；It is understood that due to being used in the air condition of that present invention
Above-mentioned power module, therefore, the embodiment of the air condition of that present invention include whole technical sides of above-mentioned power module whole embodiments
Case, and technical effect achieved is also identical, details are not described herein.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (10)
1. a kind of power module, which is characterized in that the power module includes：
(PCC) power, and,
Thermoset package shell, the (PCC) power are set in the thermoset package shell；Wherein,
The material of the thermoset package shell includes thermosetting property plastic packaging material and thermosetting property filler material, the thermosetting property plastic packaging material
Softening point is less than the softening point of the thermosetting property filler material.
2. power module as described in claim 1, which is characterized in that the adding proportion of the thermosetting property filler material be 10%~
15%.
3. power module as described in claim 1, which is characterized in that the thermoset package shell further includes silica
And/or aluminium oxide；
The size of the thermosetting property filler material is not more than the size of the silica and the aluminium oxide.
4. power module as described in claim 1, which is characterized in that the thermosetting property plastic packaging material and thermosetting property filler material are ring
One of oxygen resin, polyurethane, phenolic resin are a variety of.
5. power module as described in claim 1, which is characterized in that the (PCC) power includes：
Installation base plate；
Insulating layer, the insulating layer are set on the installation base plate；
Circuit-wiring layer, is formed in the surface of the insulating layer, and the circuit-wiring layer has the electronics for the power module
The installation position of element installation；
Power switch tube and driving chip, the driving chip and the power switch tube are respectively arranged at the corresponding circuit
On the installation position of wiring layer.
6. power module as claimed in claim 5, which is characterized in that the installation base plate is in inside the encapsulating housing,
Or it is at least partly revealed in outside the thermoset package shell.
7. the power module as described in claim 1 to 6 any one, which is characterized in that outside the thermoset package shell
Side wall surface is also coated with sealant.
8. a kind of production method of power module, which is characterized in that include the following steps：
Prepare installation base plate, insulating materials, copper foil, power switch tube, driving chip, multiple pins and thermoset package shell material
Material；The material of the thermoset package shell includes thermosetting property plastic packaging material and thermosetting property filler material, wherein the thermoset package
The material of shell includes thermosetting property plastic packaging material and thermosetting property filler material, and the softening point of the thermosetting property plastic packaging material is less than the thermosetting
The softening point of property filler material；
Insulating layer and circuit-wiring layer are sequentially formed in the installation base plate；And it configures on the circuit-wiring layer for power mould
The installation position of the electronic component installation of block；
The power switch tube of power module and driving chip are installed on the corresponding installation position of the circuit-wiring layer；
Multiple pins are welded in the corresponding position of the circuit-wiring layer, and multiple pins by the circuit-wiring layer with it is right
The power switch tube and the driving chip connection answered, to form wiring board；
It is fabricated to thermosetting property plastic part；
Thermoset package plastic part is heated to the first preset temperature, with the thermosetting in the thermoset package shell plastic part
Property plastic packaging material softening when, by the installation base plate, the circuit-wiring layer, the power switch tube and the main control chip encapsulate
In in the thermosetting property plastic packaging shell that thermoset package plastic part is formed, power module is obtained；
In the outer side surface for detecting the thermosetting property plastic packaging shell there are when stomata, the thermosetting property plastic packaging shell is heated to
Second preset temperature, when being softened with the thermosetting property filler material in the thermoset package shell plastic part, the thermosetting property is filled out
Charge is filled to the stomata.
9. the production method of power module as claimed in claim 8, which is characterized in that described to be fabricated to thermoset package shell
Plastic part specifically includes：
Thermosetting property plastic packaging material and thermosetting property filler material are mixed, the first mixing is formed；
First mixing is successively carried out to heating and cooling treatment；
First mixing after cooling is crushed；
First mixing is subjected to roll forming with ingot grain moulding process, it is described at thermosetting property dress shell plastic part to be formed.
10. a kind of air conditioner, which is characterized in that including power module as claimed in any one of claims 1 to 7.
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| CN108878377B (en) | 2020-10-20 |
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