CN207398136U - Single phase bridge type rectifier circu and three-phase bridge rectifier circuit - Google Patents
Single phase bridge type rectifier circu and three-phase bridge rectifier circuit Download PDFInfo
- Publication number
- CN207398136U CN207398136U CN201721220377.3U CN201721220377U CN207398136U CN 207398136 U CN207398136 U CN 207398136U CN 201721220377 U CN201721220377 U CN 201721220377U CN 207398136 U CN207398136 U CN 207398136U
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- chip
- island
- pin
- phase bridge
- electrically connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model is related to a kind of single phase bridge type rectifier circu and three-phase bridge rectifier circuit, the single phase bridge type rectifier circu includes direct insertion component, including：Lead frame, including first, second, third pin, the first island and the second island；First chip is diode chip for backlight unit, on the first island；Second chip, for diode chip for backlight unit, on the second island, first, second chip is contacted by identical face with chip island, first pin is electrically connected to the first island, second pin is electrically connected to the second island, and one side of first chip away from the first island is connected with the second island, and the second chip is electrically connected to the 3rd pin on one side away from the second island；First, the 3rd pin of two components is respectively as two DC output ends of single phase bridge type rectifier circu；The second pin of two components is respectively as the ac input end of single phase bridge type rectifier circu.The utility model thermal diffusivity is good, can save processing program, cost-effective and improve homogeneity of product and reliability.
Description
Technical field
Become the circuit of direct current output the utility model is related to exchange input, more particularly to a kind of single-phase bridge rectification electricity
Road further relates to a kind of three-phase bridge rectifier circuit.
Background technology
Bridge rectifier (Bridge Rectifiers), also referred to as rectifier bridge stack are the one-way conductions using diode
The most common circuit of rectification is carried out, is commonly used to alternating current being changed into direct current.
A kind of traditional single-phase bridge rectifier is to make bridge-type connection by 4 rectifier diodes, wherein single two pole of rectification
Guan Weiyong ambroins and lead wire of conductor encapsulate a diode chip for backlight unit and form.However, 4 rectifier diodes are encapsulated in a dress
The single-phase bridge rectifier formed in vivo is put, since it is desired that forming common anode common cathode and the multilayer of series connection in packaging system body
Secondary relation, structure is complex, therefore can only generally all insulation formula be used to encapsulate, and causes poor radiation.And because chip package adds
Work needs the programs such as flip-chip, and also more difficult to use full-automatic processing mode, process is relatively complicated, homogeneity of product and can
It is poor by property.
Utility model content
Based on this, it is necessary to provide a kind of single phase bridge type rectifier circu.
A kind of single phase bridge type rectifier circu, including direct insertion component, the component includes：Lead frame, including
First pin, second pin, the 3rd pin and the chip island for setting chip, the chip island include the first island and with first
Second island of island isolation；First chip is diode chip for backlight unit, and the front of chip is with the polarity at the back side on the contrary, arranged on described first
On island；Second chip, is diode chip for backlight unit, the front of chip with the polarity at the back side on the contrary, on second island, described the
One chip and the second chip are contacted by identical face with the chip island, and first pin is electrically connected to described first
Island, the second pin are electrically connected to second island, one side and second island of first chip away from first island
Connection, second chip are electrically connected to the 3rd pin on one side away from second island；Insulation protection outer layer, covering
First chip and the second chip, part-structure of the lead frame in addition to first, second, third pin be not exhausted
Edge protects external sheath to radiate；The quantity for the component that the single phase bridge type rectifier circu includes is two,
First pin of two components is electrically connected with each other, the first DC output end as the single phase bridge type rectifier circu；Institute
The 3rd pin for stating two components is electrically connected with each other, the second DC output end as the single phase bridge type rectifier circu；
The second pin of described two components is respectively as the ac input end of the single phase bridge type rectifier circu.
Above-mentioned single phase bridge type rectifier circu is made of two direct insertion components, and component thermal diffusivity is good, better than biography
System is encapsulated in the single-phase bridge rectifier formed in a chip by 4 rectifier diodes.First chip and the second chip lead to
Identical face is crossed to contact with chip island, i.e., be all P-type semiconductor upwards or be all that N-type semiconductor is upward, therefore encapsulate when be not required to
Chip is overturn, processing program, cost-effective, raising production efficiency can be saved.
In one of the embodiments, the lead frame includes the exposed heat dissipation not covered by the insulation protection outer layer
Portion.
In one of the embodiments, first chip and the second chip are connect by cathode and the chip island
It touches, second chip is that anode is electrically connected to the 3rd pin by lead, and first chip is anode by drawing
Line is electrically connected to second island.
In one of the embodiments, the first chip of the component and the second chip are taken from the phase on one piece of wafer
Adjacent two chips.
In one of the embodiments, the frontal projected area on first island and the second island is close to consistent, so that described
It reaches unanimity to the heat dissipation performance of the first chip with the second island to the heat dissipation performance of the second chip on the first island.
It there is a need to and a kind of three-phase bridge rectifier circuit is provided.
A kind of three-phase bridge rectifier circuit, including direct insertion component, the component includes：Lead frame, including
First pin, second pin, the 3rd pin and the chip island for setting chip, the chip island include the first island and with first
Second island of island isolation；First chip is diode chip for backlight unit, and the front of chip is with the polarity at the back side on the contrary, arranged on described first
On island；Second chip, is diode chip for backlight unit, the front of chip with the polarity at the back side on the contrary, on second island, described the
One chip and the second chip are contacted by identical face with the chip island, and first pin is electrically connected to described first
Island, the second pin are electrically connected to second island, one side and second island of first chip away from first island
Connection, second chip are connected to the 3rd pin on one side away from second island；Insulation protection outer layer, described in covering
First chip and the second chip, part-structure of the lead frame in addition to first, second, third pin are not protected by insulation
External sheath is protected so as to radiate；The quantity for the component that the three-phase bridge rectifier circuit includes is three, three
First pin of component is electrically connected with each other, the first DC output end as the three-phase bridge rectifier circuit；Described three
3rd pin of a component is electrically connected with each other, the second DC output end as the three-phase bridge rectifier circuit；It is described
The second pin of three components is respectively as the ac input end of the three-phase bridge rectifier circuit.
Above-mentioned three-phase bridge rectifier circuit is made of three direct insertion components, and component thermal diffusivity is good, better than biography
System is encapsulated in the three-phase bridge rectifier formed in a chip by 6 rectifier diodes.First chip and the second chip lead to
Identical face is crossed to contact with chip island, i.e., be all P-type semiconductor upwards or be all that N-type semiconductor is upward, therefore encapsulate when be not required to
Chip is overturn, processing program, cost-effective, raising production efficiency can be saved.
In one of the embodiments, the lead frame includes the exposed heat dissipation not covered by the insulation protection outer layer
Portion.
In one of the embodiments, first chip and the second chip are connect by cathode and the chip island
It touches, second chip is that anode is electrically connected to the 3rd pin by lead, and first chip is anode by drawing
Line is electrically connected to second island.
In one of the embodiments, the first chip of the component and the second chip are taken from the phase on one piece of wafer
Adjacent two chips.
In one of the embodiments, the frontal projected area on first island and the second island is close to consistent, so that described
It reaches unanimity to the heat dissipation performance of the first chip with the second island to the heat dissipation performance of the second chip on the first island.
Description of the drawings
Fig. 1 is the circuit diagram of single phase bridge type rectifier circu in an embodiment；
Fig. 2 is the schematic diagram of component 100 in an embodiment；
Fig. 3 is the connection relationship diagram of the lead frame of component 100 and chip in an embodiment；
Fig. 4 is the circuit diagram of three-phase bridge rectifier circuit in an embodiment.
Specific embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can in many different forms come in fact
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is the public affairs made to the utility model
Open content more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood meaning of technical staff in domain is identical.It is simply in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more relevant Listed Items.
Fig. 1 is the circuit diagram of single phase bridge type rectifier circu in an embodiment, mainly includes two direct insertion first devices
Part 100.Fig. 2 and Fig. 3 are referred to, component 100 includes lead frame (Fig. 2 and Fig. 3 are not indicated), the first chip 102, the second core
Piece 104 and insulation protection outer layer 40.
Lead frame is conductive material, including the first pin 32, second pin 36, the 3rd pin 34, for setting chip
Chip island and connect the exposed radiating part 30 of chip island, chip island includes the first island 10 and the second island for isolating with the first island
20.It should be noted that Fig. 3 is to illustrate front, the back side and the lead frame of the first chip 102 and the second chip 104
Position relationship and connection relation schematic diagram, therefore the first pin 32 and the actual extending direction of second pin 34 in Fig. 3
It is different, it should to be parallel with the first chip 102, the second chip 104 as in figure 2, and Fig. 3 is omitted and is connected with the second island 20
The second pin 36 connect.
First chip 102 is diode chip for backlight unit, i.e. chip can be used as a diode.The pole in the front and the back side of chip
Property on the contrary, on the first island 10.
Second chip 104 is diode chip for backlight unit, and the front of chip is with the polarity at the back side on the contrary, on the second island 20.The
One chip 102 and the second chip 104 are covered by insulation protection outer layer 40, so two diodes shown in Figure 2 are simply illustrated
Go out the position of the first chip 102 and the second chip 104 on the lead frames.
First chip 102 and the second chip 104 are contacted by identical face with chip island.In Fig. 2 and embodiment illustrated in fig. 3
In, the front of chip is P-type semiconductor, the anode as diode, and the back side is N-type semiconductor, the cathode as diode.
The front that in other embodiment can also be chip is cathode, the back side is anode.
First pin 32 is electrically connected to the first island 10, and second pin 36 is electrically connected to the second island 20, the first chip 102
The second island 20 is connected on one side away from the first island 10, and the second chip 104 is electrically connected to the 3rd on one side away from the second island 20
Pin 34.
Insulation protection outer layer 40 covers the first chip 102 and the second chip 104.Referring to Fig. 2, exposed radiating part 30 is not exhausted
Edge protection outer layer 40 covers, preferably to radiate to the first chip 102 and the second chip 104.In one embodiment, absolutely
The material of edge protection outer layer 40 is epoxy resins insulation plastics.It should be understood that in other embodiments, the heat dissipation of lead frame
Design can not also use exposed cooling fin, such as chip island back (or structure of lead frame) not by insulation protection outside
Layer cladding, so as to direct and contacting external air.
Referring to Fig. 1, the first pin 32 of two first devices 100 is electrically connected with each other, and the as single phase bridge type rectifier circu
One DC output end.3rd pin 34 of two components 100 is electrically connected with each other, and second as single phase bridge type rectifier circu
DC output end.The second pin 36 of two components is respectively as the ac input end of single phase bridge type rectifier circu.
Above-mentioned single phase bridge type rectifier circu is made of two components 100, and component 100 itself carries exposed metal
Cooling fin (exposed radiating part 30), thermal diffusivity is good, is encapsulated in better than traditional by 4 rectifier diode chips in a device
The single-phase bridge rectifier of formation.First chip 102 and the second chip 104 are contacted by identical face with chip island, i.e., are all P
Type semiconductor is upward or N-type semiconductor is upward, therefore chip need not be overturn during encapsulation, can save processing program,
Cost-effective, raising production efficiency.
Referring to Fig. 2, in this embodiment, exposed radiating part 30 offers locking hole 41, for for fastener (such as spiral shell
Silk) through semiconductor device being fixed on other objects after locking hole 41.
In one embodiment, the first chip 102 of component 100 and the second chip 104 are taken from one piece of wafer
(wafer) the two neighboring chip on.It should be understood that the common automation die bond equipment of the art is picked up from wafer
Usually all it is putting in order one on wafer by chip when chip (die) is then placed within progress die bond on lead frame
A pickup, therefore two chips being easily done on component 100 are taken from the two neighboring chip on one piece of wafer.Relatively
In the scheme being made of 4 individual rectifier diodes, it can not ensure each rectifier diode when building single-phase bridge rectifier
Uniformity (because different rectifier diodes may be from different wafers), the single-phase bridge rectification electricity of the utility model
Road uniformity higher, better reliability.
In one embodiment, the frontal projected area on the first island 10 and the second island 20 is close to consistent, so that the first island 10
Heat dissipation performance and the second island 20 to the first chip 102 tend to consistent to the heat dissipation performance of the second chip 104, so as to avoid first
102 and second chip 104 of chip temperature when single phase bridge type rectifier circu works is inconsistent, causes the chips from thermal of component not
Generate difference together.
The utility model also provides a kind of three-phase bridge rectifier circuit, referring to Fig. 4, including 3 components 100.This yuan of device
Part 100 can be the component 100 described in foregoing any embodiment.First pin of three components 100 is electrically connected with each other,
The first DC output end as three-phase bridge rectifier circuit.3rd pin of three components 100 is electrically connected with each other, as
Second DC output end of three-phase bridge rectifier circuit.The second pin of three components 100 is respectively as three-phase bridge rectification
The ac input end of circuit.
Above-mentioned three-phase bridge rectifier circuit is made of three components 100, and component 100 itself carries exposed metal
Cooling fin, thermal diffusivity is good, and the three-phase bridge rectification formed in a chip is encapsulated in by 6 rectifier diodes better than traditional
Device (power module).First chip 102 and the second chip 104 are contacted by identical face with chip island, i.e., are all P-type semiconductors
Upwards or N-type semiconductor is upward, therefore while encapsulating need not overturn chip, can save processing program, cost-effective,
Improve production efficiency.
In one embodiment, the first chip 102 of component 100 and the second chip 104 are taken from one piece of wafer
(wafer) the two neighboring chip on.It should be understood that the common automation die bond equipment of the art is picked up from wafer
Usually all it is putting in order one on wafer by chip when chip (die) is then placed within progress die bond on lead frame
A pickup, therefore two chips being easily done on component 100 are taken from the two neighboring chip on one piece of wafer.Relatively
In the scheme being made of 6 individual rectifier diodes, it can not ensure each rectifier diode when building three-phase bridge rectifier
Uniformity (because different rectifier diodes may be from different wafers), the three-phase bridge rectification electricity of the utility model
Road uniformity higher, good reliability.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of single phase bridge type rectifier circu, which is characterized in that including direct insertion component, the component includes：
Lead frame, including the first pin, second pin, the 3rd pin and chip island for setting chip, the chip island
The second island isolated including the first island and with the first island；
First chip is diode chip for backlight unit, and the front of chip is with the polarity at the back side on the contrary, on first island；
Second chip, is diode chip for backlight unit, the front of chip with the polarity at the back side on the contrary, on second island, described the
One chip and the second chip are contacted by identical face with the chip island, and first pin is electrically connected to described first
Island, the second pin are electrically connected to second island, one side and second island of first chip away from first island
Connection, second chip are electrically connected to the 3rd pin on one side away from second island；
Insulation protection outer layer, covers first chip and the second chip, and the lead frame removes described first, second, third
Part-structure outside pin is not by insulation protection external sheath so as to radiating；
The quantity for the component that the single phase bridge type rectifier circu includes is two, and the first pin of two components is mutual
It is electrically connected, the first DC output end as the single phase bridge type rectifier circu；3rd pin phase of described two components
It is mutually electrically connected, the second DC output end as the single phase bridge type rectifier circu；The second pin of described two components
Respectively as the ac input end of the single phase bridge type rectifier circu.
2. single phase bridge type rectifier circu according to claim 1, which is characterized in that the lead frame includes not described
The exposed radiating part of insulation protection outer layer covering.
3. single phase bridge type rectifier circu according to claim 1, which is characterized in that first chip and the second chip are equal
It is to be contacted by cathode with the chip island, second chip is that anode is electrically connected to the 3rd pin by lead,
First chip is that anode is electrically connected to second island by lead.
4. single phase bridge type rectifier circu according to claim 1, which is characterized in that the first chip of the component and
Two chips are taken from the two neighboring chip on one piece of wafer.
5. single phase bridge type rectifier circu according to claim 1, which is characterized in that the positive throwing on first island and the second island
Shadow area close to consistent so that first island to the heat dissipation performance of the first chip and the second island to the thermal diffusivity of the second chip
It can reach unanimity.
6. a kind of three-phase bridge rectifier circuit, which is characterized in that including direct insertion component, the component includes：
Lead frame, including the first pin, second pin, the 3rd pin and chip island for setting chip, the chip island
The second island isolated including the first island and with the first island；
First chip is diode chip for backlight unit, and the front of chip is with the polarity at the back side on the contrary, on first island；
Second chip, is diode chip for backlight unit, the front of chip with the polarity at the back side on the contrary, on second island, described the
One chip and the second chip are contacted by identical face with the chip island, and first pin is electrically connected to described first
Island, the second pin are electrically connected to second island, one side and second island of first chip away from first island
Connection, second chip are connected to the 3rd pin on one side away from second island；
Insulation protection outer layer, covers first chip and the second chip, and the lead frame removes described first, second, third
Part-structure outside pin is not by insulation protection external sheath so as to radiating；
The quantity for the component that the three-phase bridge rectifier circuit includes is three, and the first pin of three components is mutual
It is electrically connected, the first DC output end as the three-phase bridge rectifier circuit；3rd pin phase of three components
It is mutually electrically connected, the second DC output end as the three-phase bridge rectifier circuit；The second pin of three components
Respectively as the ac input end of the three-phase bridge rectifier circuit.
7. three-phase bridge rectifier circuit according to claim 6, which is characterized in that the lead frame includes not described
The exposed radiating part of insulation protection outer layer covering.
8. three-phase bridge rectifier circuit according to claim 6, which is characterized in that first chip and the second chip are equal
It is to be contacted by cathode with the chip island, second chip is that anode is electrically connected to the 3rd pin by lead,
First chip is that anode is electrically connected to second island by lead.
9. three-phase bridge rectifier circuit according to claim 6, which is characterized in that the first chip of the component and
Two chips are taken from the two neighboring chip on one piece of wafer.
10. three-phase bridge rectifier circuit according to claim 6, which is characterized in that first island and the second island are just
Projected area is close consistent, so that first island is to the heat dissipation of the heat dissipation performance and the second island of the first chip to the second chip
Performance reaches unanimity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721220377.3U CN207398136U (en) | 2017-09-21 | 2017-09-21 | Single phase bridge type rectifier circu and three-phase bridge rectifier circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721220377.3U CN207398136U (en) | 2017-09-21 | 2017-09-21 | Single phase bridge type rectifier circu and three-phase bridge rectifier circuit |
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| Publication Number | Publication Date |
|---|---|
| CN207398136U true CN207398136U (en) | 2018-05-22 |
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| CN201721220377.3U Active CN207398136U (en) | 2017-09-21 | 2017-09-21 | Single phase bridge type rectifier circu and three-phase bridge rectifier circuit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107464799A (en) * | 2017-09-21 | 2017-12-12 | 深圳市矽莱克半导体有限公司 | Single phase bridge type rectifier circu and three-phase bridge rectifier circuit |
-
2017
- 2017-09-21 CN CN201721220377.3U patent/CN207398136U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107464799A (en) * | 2017-09-21 | 2017-12-12 | 深圳市矽莱克半导体有限公司 | Single phase bridge type rectifier circu and three-phase bridge rectifier circuit |
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