CN104064612A - Solar Powered Ic Chip - Google Patents

Solar Powered Ic Chip Download PDF

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Publication number
CN104064612A
CN104064612A CN201410112304.7A CN201410112304A CN104064612A CN 104064612 A CN104064612 A CN 104064612A CN 201410112304 A CN201410112304 A CN 201410112304A CN 104064612 A CN104064612 A CN 104064612A
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CN
China
Prior art keywords
type surface
solar cell
chip
sealant
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410112304.7A
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Chinese (zh)
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CN104064612B (en
Inventor
刘德明
卢威耀
熊正德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
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Filing date
Publication date
Priority claimed from US13/849,543 external-priority patent/US8778704B1/en
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN104064612A publication Critical patent/CN104064612A/en
Application granted granted Critical
Publication of CN104064612B publication Critical patent/CN104064612B/en
Active legal-status Critical Current
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • General Physics & Mathematics (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A self-powered circuit package includes a substrate and an integrated circuit (IC). The IC is mounted on a surface of the substrate. An electrical interconnector electrically couples the IC to the substrate. A solar cell is provided having opposing first and second main surfaces. A portion of the first main surface of the solar cell is configured to receive light from an external source. The solar cell converts energy of the received light into electrical power. The solar cell is disposed above the IC and electrically connected to the IC by way of the substrate to supply the generated power to the IC. A clear mold compound encapsulates a surface of the substrate, the IC, the electrical interconnector, and the solar cell.

Description

Solar powered IC chip
The cross reference of related application
The present invention is continuation-in-part application that submit to and that transfer the Application No. 13/766,771 of Freescale semiconductor limited company on February 13rd, 2013.
Technical field
The present invention is directed to integrated antenna package and a kind of making by the method for the self-powered integrated antenna package of use of integrated solar cell.
Background technology
Along with the progress of wafer technology, size and the power requirement of integrated circuit (IC) chip reduce.For example, ball grid array (BGA) encapsulation is widely used in mobile device, because they are very little and have low power requirements.But the power that offers IC chip comes from external power source conventionally, such as battery.Therefore, the placement of IC chip must think over all the time, and IC chip can fully be accessed for being coupled with external power source.This makes IC chip very difficult in the embedding such as in clothes, shoes, bicycle, human body etc. article.
Meanwhile, the efficiency of solar cell is updated.Particularly, under optimum condition, the optical receiving surface area of the solar cell of required generating has reduced.Find, the size of the solar cell identical with the big or small magnitude of IC chip can be enough effectively to meet the power demand of this IC chip under low-power environment.
Therefore be desirable to provide and there is the IC chip package of integrated solar cell so that reduction or eliminating IC chip depend on the needs of external power source.
Brief description of the drawings
The present invention do not illustrate by way of example and limited by the embodiment shown in accompanying drawing, and similarly reference symbol represents identical element in the accompanying drawings.Element in accompanying drawing is for easy and clear and be illustrated, and not necessarily draws in proportion.Note, some vertical dimension is exaggerated with respect to some horizontal size.
In the accompanying drawings:
Fig. 1 is according to the cross sectional side view of the integrated circuit (IC)-components of the first embodiment of the present invention;
Fig. 2 is the cross sectional side view of integrated antenna package according to a second embodiment of the present invention;
Fig. 3 is the cross sectional side view of the integrated antenna package of a third embodiment in accordance with the invention;
Fig. 4 is the cross sectional side view of the integrated antenna package of a fourth embodiment in accordance with the invention;
Fig. 5 A1 and Fig. 5 A2 are solar cell wafers and encapsulate ground floor plan and the top floor plan view with lamination thereon;
Fig. 5 B is the ground floor plan of the wafer of Fig. 5 A1 before separating thus each solar cell and Fig. 5 A2; And
Fig. 5 C-5H is a series of charts that illustrate according to an embodiment of the invention the step of assembling self-power integrated circuit (IC) device.
Embodiment
In one embodiment, the invention provides a kind of self-power integrated circuit (IC) device.Described device comprises lead frame, chip supporting zone and the multiple lead-in wires around described chip supporting zone with the first relative first type surface and the second first type surface.Solar cell has the first relative first type surface and the second first type surface, at least a portion of wherein said the first first type surface is configured to receive light from external source, and described second first type surface of described solar cell is attached to the described chip supporting zone of described first first type surface of described lead frame.The power conversion of the light of reception is become electric energy by described solar cell.Integrated circuit (IC) chip has the first relative first type surface and the second first type surface, and described second first type surface of described first first type surface of wherein said IC chip and described solar cell is in the face of arranging.Described IC chip is electrically connected to described solar cell to receive the electric power being generated by described solar cell.In one embodiment, described solar cell utilizes closing line be electrically connected to described IC chip and be electrically connected to described IC chip by tin ball in another embodiment.In one embodiment, described IC chip also utilizes closing line and utilizes in another embodiment tin ball to be electrically connected to the described lead-in wire of described lead frame.Described in lead frame described at least a portion, described IC chip, electrical connection between the electrical connection between described IC chip and described solar cell and described IC chip and described lead-in wire and at least a portion, solar cell utilizes capsulation material packed.
Referring now to accompanying drawing, wherein identical reference symbol is used to specify the same components in some accompanying drawings, and according to the present invention, shown in Fig. 1 is the first embodiment of self-power integrated circuit device 110.
Self-power integrated circuit device 110 comprises lead frame 112, chip supporting zone 114 and the multiple lead-in wires 116 around described chip supporting zone 114 with the first relative first type surface and the second first type surface 112a and 112b.In this embodiment, lead frame 112 is formed by a slice conducting metal or sheet metal, such as copper, and comprises the multiple lead-in wires 116 around central opening.Chip supporting zone 114 comprises the near-end of lead-in wire 116 and the far-end of lead-in wire 116, and it allows outside to be electrically connected to IC chip, as described below.Lead-in wire 116 can comprise that one or more bendings are with the wing shape of gull such as forming as shown in the figure.
The solar cell 118 with the first relative first type surface and the second first type surface 118a and 118b is installed to the chip supporting zone 114 of lead frame 112., the second first type surface 118b of solar cell 118 is attached to the chip supporting zone 114 of the first first type surface 112a of lead frame 112.In a preferred embodiment, solar cell 118 utilizes non-conductive epoxy resin 120 to be attached to lead frame 112, to avoid making the metal trace (not shown) short circuit on the second first type surface 118b of solar cell 118.
The first first type surface 118a is the sensitive side of solar cell 118.At least a portion of the first first type surface 118a of solar cell 118 is configured to receive light from external source 122.As everyone knows, the power conversion of the light of reception is become electric energy by solar cell 118.
Solar cell 118 can be conventional, and by monocrystalline, polycrystalline, or amorphous silicon or another kind of like semi-conducting material or suitably doping absorb for efficiency light and its of the separation of electric charge carrier and conduction is combined to form.Solar cell 118 also can comprise surface conductance trace, anti-reflection coating, metal contact pad and conventional known further feature.
Integrated circuit (IC) chip 124 is also provided as a part for device 110.IC chip 124 preferably includes the first relative first type surface and the second first type surface 124a, 124b.In this first embodiment, the first first type surface 124a of IC chip 124 at the central opening place of lead frame 112 and the second first type surface 118a of solar cell 118 in the face of arranging and being attached on it.The surface area of the first first type surface 118a of solar cell 118 is preferably more than the surface area of the first first type surface 124a of IC chip 124.In a preferred embodiment, IC chip 124 utilizes non-conductive epoxy resin, such as the non-conductive epoxy resin 120 for solar cell 118 being attached to lead frame 112, be attached to solar cell 118, to avoid making the metal trace (not shown) short circuit on the second first type surface 118b of solar cell 118.At least one first electric interconnector 126 is electrically connected the lead-in wire of lead frame 112 116 with IC chip 124.Preferably, the at least the first electric interconnector 126 comprises multiple closing lines, and it can use conventional wire bonding technique and wire-bonded equipment to be attached to the near-end of the lead-in wire 116 on the second side 112b of bond pad on the second first type surface 124b of IC chip 124 and lead frame 112.
IC chip 124 is also electrically connected to solar cell 118 to receive the electric power being generated by solar cell 118.In a preferred embodiment, multiple the second electric interconnectors 128 are coupled to solar cell 118 the first first type surface 124a of IC chip 124.In further preferred embodiment, the second electric interconnector 128 comprises closing line, and it can use conventional wire bonding technique and conventional wire-bonded equipment to be attached to chip join dish and solar cell bond pad.
Device 110 further comprises that the first sealant 130, the first sealants 130 cover IC chip 124, the first and second electric interconnectors 126,128 and part lead frame 112(, the near-end of lead-in wire 116).As known in routine.The first sealant 130 further covers at least a portion of solar cell 118.The first sealant 130 can be by ceramic material, polymeric material etc. are made as known in the art.
In the first embodiment shown in Fig. 1, on the first first type surface 118a of solar cell 118, do not cover the first sealant 130, and be therefore exposed.Because capsulation material (, the first sealant 130) is opaque to the light wavelength that is used to generate electric power by solar cell 118 conventionally, so this configuration allows the first first type surface 118a of solar cell 118 to be exposed to the light from external source 122.
In Fig. 1, IC device 110 further comprises that the second sealant 132, the second sealants 132 are at least laminated on the light receiving part of the first first type surface 118a of solar cell 118.The second sealant 132 is at least transparent or transmission for the light wavelength of described reception, makes the light receiving to convert electric energy to by solar cell 118.In further preferred embodiment, the laminated portion of the first first type surface 118a of solar cell 118 also lamination has glass (not shown).Preferably, at least laminated portion of the first first type surface 118a of solar cell 118 exposes through the first sealant 130.In the situation that the second sealant 132 exists, the first first type surface 118a of solar cell 118 is protected, and does not need the first sealant 130 for this object.
Fig. 2 shows the second embodiment according to device 210 of the present invention.The second embodiment is similar to the first above-mentioned embodiment.Except 200 serial symbols have been used to the second embodiment, similarly symbol has been used to similar components.Therefore, omitted the complete description of the second embodiment, and only described difference.
The difference of the second embodiment and the first embodiment is, the first sealant 230 is at least preferably transparent or transmission for the light wavelength being received from external source 222 by solar cell 218.Therefore, the second embodiment does not need the second sealant identical with the second sealant 132 of the first embodiment.
Fig. 3 shows the 3rd embodiment according to encapsulation 310 of the present invention.The 3rd embodiment is similar to the first above-mentioned embodiment.Except 300 serial symbols have been used to the 3rd embodiment, similarly symbol has been used to similar components.Therefore, omitted the complete description of the 3rd embodiment, and only described difference.
The difference of the 3rd embodiment and the first embodiment is, lead frame 112 comprises the tube core dish or the mark that are positioned at its central opening part.The second first type surface 118b of solar cell 118 is attached to the first side of the first side of tube core dish and the near-end of lead-in wire 116.Then, IC chip 324 is attached to the second side 112b of tube core dish, instead of is directly attached to the second first type surface 118b of solar cell 118.
Fig. 4 shows the 4th embodiment according to packaging 410 of the present invention.The 4th embodiment is similar to the first above-mentioned embodiment.Except 400 serial symbols have been used to the 4th embodiment, similarly symbol has been used to similar components.Therefore, omitted the complete description of the 4th embodiment, and only described difference.
The difference of the 4th embodiment and the first embodiment is, IC chip 424 is flip chip type tube cores, and the first electric interconnector 426 that IC chip 424 is electrically connected to lead frame 412 is comprised to conducting sphere or bulge.In addition, IC chip 424 utilizes the second electric interconnector 428 to be electrically connected to solar cell 118, the second electric interconnectors 428 also to comprise conducting sphere or bulge.It is approximately the protuberance diameter of 0.25-0.75 times of wire widths that the first electric interconnector 426 has, to be allowed for the reasonable tolerance that mounts machine in assembling process, and second electric connecting wire 428 to have be approximately the protuberance diameter doubly of 1.0-2.0 of its height, this depends on total height or the gross thickness of lead frame (substrate), non-conductive epoxy resin and connectors 426.
In the 4th embodiment, although at the opposite side that has formed chip supporting zone 414, but because solar cell 418 and IC chip 424 are all attached to the near-end of lead-in wire 416, so the surface area of the surface area of the first first type surface 418a of solar cell 418 and the first first type surface 424a of IC chip 424 is identical.
The in the situation that of device according to an embodiment of the invention 110,210,310,410, the power requirement of IC chip 124,224,324,424 can be comprised at least in part the power that the solar cell 118,218,318,418 in device 110,210,310,410 exports and meet.Therefore,, if do not eliminated, also can reduce the needs for the connection to external power source.
Referring now to Fig. 5 A1-5H, now by describe according to the first embodiment of the present invention for assembling the illustrative methods of self-power integrated circuit (IC) device.
In Fig. 5 A1, solar cell wafer 50 is provided with the multiple independent solar cell 118 forming thereon.One or more pieces sealants 132 are preferably in turn laminated to the first first type surface (not shown) of solar cell wafer 50.Pad 52 and metal trace 54 are positioned on the second first type surface 50b of solar cell wafer 50.The first first type surface 50a that Fig. 5 A2 shows solar cell wafer 50 preferably lamination has one or more pieces sealants 132.
In Fig. 5 B, after solar cell 118 is ready to cutting, solar cell wafer 50 is preferably installed to conventional cutting belt 56, and wherein the second first type surface 50b of solar cell wafer 50 outwardly.Then solar cell 118 preferably uses saw (not shown) to separate to cut off solar cell 118 along dotted line line of cut 58 with wafer 50 separately.But, also can use other cutting method, such as punch press cutting etc.In an illustrated embodiment, cut solar cell 118 comprises two pads 52 that serve as respectively anodal and negative pole separately.
With reference to Fig. 5 C, at least one lead frame 112 arranges the first relative first type surface 112a and the second first type surface (not shown), chip supporting zone 114 and the multiple lead-in wires 116 around chip supporting zone 114 that have upward.
In Fig. 5 D, the solar cell 118 of cutting is installed to lead frame 112, wherein the first first type surface 118a of solar cell 118 upward and the second first type surface (not shown) of solar cell 118 be attached to the chip supporting zone 114 of the first first type surface 112a of lead frame 112.As shown in Figure 1, solar cell 118 preferably utilizes non-conductive epoxy resin 120 to be attached to lead frame 112, to avoid making metal trace (54 shown in Fig. 5 A1) short circuit on second first type surface (50b shown in Fig. 5 A1) of solar cell 118.
In Fig. 5 E, lead frame 112 is reversed, and wherein the second first type surface 112b of lead frame 112 upward and be placed on carrier (not shown).As shown in Fig. 5 E, the central area of the chip supporting zone 114 of lead frame 112 is opened to expose the second first type surface 118b with pad 52 and metal trace 54 of solar cell 118.Then, the first first type surface (not shown) of IC chip 124 preferably uses the second first type surface 118b that non-conductive epoxy resin (not shown) is attached to solar cell 118 to avoid making metal trace 54 short circuits.
Fig. 5 F-5H is the sectional view that is shown in a series of amplifications of all the other steps of assembling self-powered IC device 110.
Fig. 5 F shows the IC device 110 of the part assembling being placed on carrier 60, and wherein the second first type surface 112b of lead frame 112 upward.Then, the lead-in wire 116 of lead frame 112 utilizes at least one first electric interconnector 126 to be electrically connected to IC chip 124.Preferably, at least the first electric interconnector 126 comprises multiple closing lines.In addition, the pad 52 on the second first type surface 118b of solar cell 118 utilizes multiple the second electric interconnectors 128 to be electrically coupled to the first first type surface 124a of IC chip 124.In a preferred embodiment, the second electric interconnector 128 comprises closing line.Pad 52 serves as respectively positive pole and the negative pole of solar cell 118.
As shown in Fig. 5 G, as known in routine, the first sealant 130 has encapsulated IC chip 124, at least one first electric interconnector 126.The further encapsulation part of the first sealant 130 is deployed at least a portion solar cell 118 on lead frame 112, and at least a portion sealant 132 exposes through the first sealant 130.The first sealant 130 can be made up of ceramic material, polymeric material etc.
In Fig. 5 H, once the first sealant 130 is set up, device 110 can be done as shown in fig. 1, and at least a portion of the first first type surface 118a of solar cell 118 is configured to receive light from external source 122, and the power conversion of the light of reception is become electric energy by solar cell 118.
Obviously, some step of the method can be changed and/or remove to form other embodiment of device.The second embodiment as shown in Figure 2, for the transparent place of light wavelength, can omit the lamination step of solar cell wafer at capsulation material.
Similarly, if the central area of the chip supporting zone of lead frame is the second first type surface with pad with exposure solar cell by part opening,, as shown in the 3rd embodiment of Fig. 3, the first first type surface of IC chip is attached to the second first type surface of lead frame instead of the second first type surface of solar cell.
In addition, the step of the lead-in wire of electrical connection solar cell or lead frame can relate to tin ball and adhere to and reflux technique configuration as shown in Fig. 4 the 4th embodiment with realization, instead of wire bonding technique.
In explanation above, with reference to the specific examples of the embodiment of the present invention, invention has been described.But, will be apparent that, various modifications and variations can be made in the case of the wide region spirit of the present invention stated in not departing from appended claims and scope.
Those skilled in the art will recognize that the boundary between the operation of foregoing description is illustrative.The operation that multiple operations one-tenth capable of being combined is single, single operation can be distributed in additional operations, and operation can partly overlap and be performed at least in time.And alternate embodiment can comprise the Multi-instance of specific operation, and the order of operation can change in various other embodiment.
Term " above " in specification and claims, " below ", " top ", " bottom ", " above ", " below " etc., if any, be for descriptive object and not necessarily for describing permanent relative position.Should be appreciated that, this usage of term be in appropriate circumstances can exchange make embodiment described in the invention for example can other direction instead of the present invention illustrated or operate in other side.
In the claims, word " comprises " or " containing " do not get rid of the existence of the step of listing in other element or claim.In addition, word " " or " one " are defined as one or more than one as used herein.And, even when same claim comprises introductory phrase " one or more " or " at least one " and during such as the indefinite article of " " or " ", should not be construed as such as the use of the introductory phrase of " at least one " and " one or more " other claim element that hint introduces by indefinite article " " or " " in the claims yet any specific rights requirement of the claim element that comprises such introduction is constrained to the invention that only comprises such element.Also be like this for the use of definite article.Except as otherwise noted, use the element of at random distinguishing such term description such as the term of " first " and " second ".Therefore, these terms are not necessarily intended to indicate time or other order of priority of such element.In mutually different claims, recording the fact of some measure does not indicate the combination of these measures can not be used to obtain advantage.

Claims (20)

1. self-power integrated circuit (IC) device, comprising:
There are lead frame, chip supporting zone and the multiple lead-in wires around described chip supporting zone of the first relative first type surface and the second first type surface;
There is the first relative first type surface and the solar cell of the second first type surface, at least a portion of described first first type surface of wherein said solar cell is configured to receive light from external source, and described second first type surface of described solar cell is attached to the described chip supporting zone of described first first type surface of described lead frame, and the power conversion of the light of reception is become electric energy by wherein said solar cell;
There is integrated circuit (IC) chip of the first relative first type surface and the second first type surface, described second first type surface of described first first type surface of described IC chip and described solar cell is in the face of arranging, and wherein said IC chip is electrically connected to described solar cell to receive the electric power being generated by described solar cell;
At least one first electric interconnector, described the first electric interconnector is electrically connected the described lead-in wire of described lead frame with described IC chip; And
The first sealant, described the first sealant has covered at least a portion of at least a portion of described lead frame, described IC chip, described at least one first electric interconnector and described solar cell.
2. IC device according to claim 1, further comprise the second sealant, described the second sealant is at least laminated on the described light receiving part of described the first first type surface of described solar cell, and wherein said the second sealant is at least transparent or transmission for the light wavelength of described reception.
3. IC device according to claim 2, the described laminated portion of described first first type surface of wherein said solar cell also lamination has glass.
4. IC device according to claim 2, wherein the described laminated portion of described first first type surface of at least described solar cell exposes through described the first sealant.
5. IC device according to claim 1, wherein said the first sealant is at least transparent or transmission for the light wavelength of described reception, and described first first type surface of described solar cell is packed together with described the first sealant.
6. IC device according to claim 1, described first first type surface of wherein said IC chip utilizes non-conductive epoxy resin to be installed on described second first type surface of described solar cell.
7. IC device according to claim 1, described first first type surface of wherein said IC chip is installed on the described chip supporting zone of described the second first type surface of described lead frame.
8. IC device according to claim 1, wherein said at least one first electric interconnector comprises multiple closing lines.
9. IC device according to claim 1, further comprises multiple the second electric interconnectors, and described the second electric interconnector is electrically coupled to described solar cell described first first type surface of described IC chip.
10. IC device according to claim 9, wherein said the second electric interconnector comprises closing line.
11. IC devices according to claim 1, the surface area of described first first type surface of wherein said solar cell is greater than the surface area of described first first type surface of described IC chip.
12. 1 kinds of self-power integrated circuits (IC) device, comprising:
There are lead frame, chip supporting zone and the multiple lead-in wires around described chip supporting zone of the first relative first type surface and the second first type surface;
There is the first relative first type surface and the solar cell of the second first type surface, described first first type surface of wherein said solar cell is configured to receive light from external source, and described second first type surface of described solar cell is attached on the described chip supporting zone of described first surface of described lead frame, and the power conversion of the light of reception is become electric energy by wherein said solar cell;
There is integrated circuit (IC) chip of the first relative first type surface and the second first type surface, described second first type surface of described first first type surface of described IC chip and described solar cell is in the face of arranging, and be arranged on described second first type surface of described lead frame, and utilize tin ball to be electrically connected to the described lead-in wire of described lead frame, and wherein said IC chip is electrically connected to described solar cell to receive the electric power being generated by described solar cell; And
The first sealant, described the first sealant covers at least a portion of described IC chip and described solar cell.
13. IC devices according to claim 12, further comprise the second sealant, described the second sealant is at least laminated on the described light receiving part of described the first first type surface of described solar cell, and wherein said the second sealant is at least transparent or transmission for the light wavelength of described reception.
14. IC devices according to claim 13, the described laminated portion of described first first type surface of wherein said solar cell also lamination has glass.
15. IC devices according to claim 14, wherein the described laminated portion of described first first type surface of at least described solar cell exposes through described the first sealant.
16. IC devices according to claim 12, wherein said the first sealant is at least transparent or transmission for the light wavelength of described reception, and described first first type surface of described solar cell is packed together with described the first sealant.
17. IC devices according to claim 12, further comprise multiple electric interconnectors, and described solar cell is electrically coupled to described IC chip by described electric interconnector.
18. IC devices according to claim 17, wherein said electric interconnector comprises tin ball.
The method of 19. 1 kinds of assembling self-power integrated circuit (IC) devices, described method comprises:
The solar cell with the first relative first type surface and the second first type surface is arranged on the first first type surface of lead frame, at least a portion of described first first type surface of wherein said solar cell is configured to receive light from external source, and wherein said solar cell converts the light of reception to electric energy;
Integrated circuit (IC) chip with the first relative first type surface and the second first type surface is arranged on described second first type surface of described solar cell, and described second first type surface of wherein said solar cell and described first first type surface of described IC chip are in the face of arranging;
Use at least one first electric interconnector described IC chip to be electrically coupled to multiple lead-in wires of described lead frame;
Described solar cell is electrically connected to described IC chip, makes described solar cell provide electric power to described IC chip; And
In capsulation material, encapsulate at least a portion of described lead-in wire and at least a portion of described solar cell of described IC chip, described at least one first electric interconnector, described lead frame.
20. methods according to claim 19, further comprise at least described light receiving part that utilizes described first first type surface of solar cell described in sealant lamination, and described sealant is at least transparent or transmission for the light wavelength of described reception.
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