CN205350874U - LED lamp pearl with waterproof function - Google Patents
LED lamp pearl with waterproof function Download PDFInfo
- Publication number
- CN205350874U CN205350874U CN201521062349.4U CN201521062349U CN205350874U CN 205350874 U CN205350874 U CN 205350874U CN 201521062349 U CN201521062349 U CN 201521062349U CN 205350874 U CN205350874 U CN 205350874U
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- Prior art keywords
- pin
- led lamp
- pit
- lamp bead
- capillary groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The utility model discloses a LED lamp pearl with waterproof function, including encapsulation cup, LED chip and microscler pin, the upper surface of encapsulation cup is equipped with the pit of undercut, and the pin is including in opposite directions first pin group and second pin group, and first pin group includes at least one second pin including at least one first pin, second pin, and set up separately in the encapsulation cup front portion of pin, outside the encapsulation cup is stretched out to the back part of pin, and pit downwardly extending to front that first pin group and second pin were organized. The LED chip is established and is connected in the bottom of pit and with the pin electricity, and it has the encapsulation to glue to fill in the pit. The front and/or the back of the pro -moiety of pin are equipped with first capillary groove, first capillary groove around the periphery of the bottom at the pit. Implement the technical scheme of the utility model, the first capillary groove of the pin of LED lamp pearl can obstruct inside water gets into the encapsulation cup effectively, has strengthened the waterproof performance of LED lamp pearl.
Description
Technical field
This utility model relates to IC-components field, especially relates to a kind of LED lamp bead with water-proof function.
Background technology
The pin of LED lamp bead, for realizing the electrical connection of LED lamp bead internal circuit exit and outer lead, serves the function served as bridge connected with outer lead.
But generally the water resistance of LED lamp bead is poor, and it is external that the packaged pin in LED lamp bead stretches out packaging cup, if LED lamp bead meets water accidentally, water is then likely to enter in encapsulating structure along lead-in wire, affect the performance of LED, the problem such as cause LED chip luminescence abnormal.
Moreover, the encapsulation cup of LED lamp bead is combined with pin.But the surface of pin is usually flat smooth, encapsulating material is not easy to be attached on pin, so encapsulation cup is firm not with the combination of pin.Encapsulation cup separates with pin, and not still LED lamp bead structural damage also can affect the water resistance of LED lamp bead, make moisture be easily accessible inside LED lamp bead.
Utility model content
Water resistance for drawbacks described above LED lamp bead of the prior art is poor, and the technical problems to be solved in the utility model is in that, how to improve the water resistance of LED lamp bead.This utility model solves this technical problem and be the technical scheme is that a kind of LED lamp bead with water-proof function of offer, including encapsulation cup, LED chip and elongated pin, encapsulation cup has upper surface, sidewall and lower surface, the upper surface of encapsulation cup is provided with the pit of concave downward, pin includes the first pin set in opposite directions and the second pin set, first pin set includes at least one first pin, second pin includes at least one second pin, the forward part of pin is located in encapsulation cup, it is external that packaging cup is stretched out in the rear section of pin, pit extends downward the first pin set and the front of the second pin set.LED chip is located at the bottom of pit and is electrically connected with the pin and is, and is filled with packaging plastic in pit.The front of the forward part of pin and/or the back side are provided with the first capillary groove, and the first capillary groove is centered around the periphery of the bottom of pit.
Preferably, the first pin set includes three the first pins, and the second pin set includes three the second pins.
Preferably, the material encapsulating cup is filled in the first capillary groove.
Preferably, the front of the rear section of pin and/or reverse side are provided with the second capillary groove, and the second capillary groove is positioned at the side-wall outer side of encapsulation cup, and the second capillary groove is not parallel to the length direction of pin.
Preferably, the second capillary groove includes at least one second capillary groove spaced along pin length direction.
Further, encapsulating cup for drawbacks described above of the prior art firm not with the combination of pin, the technical problems to be solved in the utility model is in that, how to improve the bond strength of encapsulation cup and pin.This utility model solves this technical problem the technical scheme is that above-mentioned LED lamp bead with water-proof function and also has following characteristics.
The forward part of pin is provided with the dot matrix of depression, and dot matrix includes the part A dot matrix being located at the back side of pin.
Preferably, dot matrix includes the part B dot matrix being located at pin front, and part B dot matrix is positioned at the outside of the bottom of pit and arranges along the bottom margin of pit.
Preferably, the forward part of pin is provided with first and admittedly expects hole, and first expects that hole is positioned at the periphery of the bottom of pit admittedly, and the material of encapsulation cup is filled into first and admittedly expects in hole.
Preferably, first expects that hole is located at the outside of the first capillary groove admittedly.
Preferably, the rear section of pin is provided with second and admittedly expects hole, and second expects that hole is positioned at the outside of encapsulation cup admittedly, and the material of encapsulation cup is filled into second and admittedly expects in hole.
Implement the technical solution of the utility model, at least there is following beneficial effect: LED lamp bead the first capillary groove of pin can effectively hinder water to enter portion in packaging cup body, enhance the water resistance of LED lamp bead.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1-3 is the schematic perspective view of the LED lamp bead with water-proof function in a preferred embodiment of the present utility model.
Fig. 4 is the schematic top plan view of the LED lamp bead with water-proof function in Fig. 1.
Fig. 5 is the cross-sectional schematic of A-A position in Fig. 4.
Fig. 6 is the schematic perspective view of the pin of the LED lamp bead with water-proof function in Fig. 1.
Fig. 7 is the schematic perspective view of the LED lamp bead with water-proof function in another preferred embodiment of the present utility model.
Fig. 8 is the schematic top plan view of the LED lamp bead with water-proof function in Fig. 7.
Fig. 9 is the cross-sectional schematic of B-B position in Fig. 8.
Figure 10-11 is the schematic perspective view of the LED lamp bead with water-proof function in Fig. 7.
Wherein, 11. first pin set, 110. first pins, 12. the second pin set, 120. second pins, 13. first capillary grooves, 14. the second capillary groove, 15. dot matrix, 15a.A part dot matrix, 15b.B part dot matrix, 16. first expects hole admittedly, 17. second expect hole admittedly, 2. encapsulation cup, 21. packaging plastic, 3.LED chip.
Detailed description of the invention
In order to technical characteristic of the present utility model, purpose and effect are more clearly understood from, now comparison accompanying drawing describes detailed description of the invention of the present utility model in detail.In the description of the LED lamp bead with water-proof function of the present utility model, it will be appreciated that, "front", "rear", " on ", D score, " front ", the term such as " back side " be for only for ease of description the technical solution of the utility model, rather than the instruction device of indication or element must have specific orientation, therefore it is not intended that to restriction of the present utility model.
As shown in figs. 1-11, a kind of LED lamp bead with water-proof function in a preferred implementation of the present utility model, including encapsulation cup 2, LED chip 3 and elongated flat pin, encapsulation cup 2 has upper surface, sidewall and lower surface, the upper surface of encapsulation cup 2 is provided with the pit of concave downward, and encapsulation cup 2 defines the essential shape of LED lamp bead.Pin includes the first pin set 11 and the second pin set 12 being oppositely arranged, first pin set 11 includes at least one first pin 110, second pin 120 includes at least one second pin 120, the forward part of pin is located in encapsulation cup 2, the rear section of pin is stretched out outside encapsulation cup 2 and bends to encapsulation cup 2, pit extends downward the front of the first pin set 11 and the second pin set 12, and pin is for electrically connecting the LED chip 3 and external circuit encapsulated in cup 2.LED chip 3 is located at the bottom of pit and is electrically connected with the pin and is, and is filled with packaging plastic 21 in pit, and LED chip 3 is for being converted into luminous energy, luminescence electric energy.
The one side towards pit opening of pin is front, and contrary one side is the back side.One end that pin is located in encapsulation cup 2 is front end, and the other end is rear end.The forward part of pin just facing to the opening of pit, namely towards upper;It is outer and bend to encapsulation cup 2 that encapsulation cup 2 is stretched out in the rear section of pin, and namely the back side of the rear section of pin is towards encapsulation cup 2, bend and extend downwards.
Encapsulation cup 2 can be in cuboid, has four sidewalls.Preferably, the pit of encapsulation cup 2 upper surface is cup-shaped, and namely the openings of sizes of pit is gradually reduced from top to bottom, and namely the sidewall of pit is not orthogonal to the upper surface of encapsulation cup 2, to reflect the light sent by LED chip 3 to the direction of pit opening.The opening of pit can be rectangular, but this is not limited by this utility model, and the opening of pit can also rounded, oval, polygon or other shape.Encapsulation cup 2 can be plastics, forms encapsulation cup 2 by being injection-moulded on the nead frame of just one-step forming, it is understood that encapsulation cup 2 can also as needed for other material, this is prior art, is not repeating at this.
Specifically, the rear section of the rear section pin of pin is stretched out outside encapsulation cup 2 and downwardly extends, and its end downwardly extended goes out to bend inwards at the edge of the lower surface of encapsulation cup 2, namely bends to the pin back side.Adjacent two the first pins 110 are in the spacing of the remainder being smaller than extending back of pit, so that the pin configuration of pit is more compact, it is simple to the connection of LED chip 3 and pin in pit.
Packaging plastic 21 is transparent solid, it is preferred to epoxy resin.Packaging plastic 21 is for protecting the circuit in LED chip 3 and pit, and hinders moisture to enter;And lens or diffusing lens function can be played according to the material character of packaging plastic 21 and the shape of formation thereof, control the angle of divergence of light.The outer surface of the shape that packaging plastic 21 is formed can be parallel with the upper surface of encapsulation cup 2, but will be understood that, this is not limited by this utility model, the such as upper surface of the shape that packaging plastic 21 is formed can also be sphere, the upper surface protruding encapsulation cup 2, when the upper surface of packaging plastic 21 is shaped as the sphere of plane or projection, the irradiating angle of LED lamp bead is bigger;Such as the upper surface of the shape that packaging plastic 21 is formed can also be pointed again, then the light that LED lamp bead sends comparatively is concentrated.
First pin 110 can be equal with the quantity of the second pin 120, then preferably, the first pin 110 and the second pin 120 are oppositely arranged one by one, and the forward part of the forward part of the first pin 110 and the second pin 120 is oppositely arranged one by one.First pin 110 is intervally arranged along the width of himself, namely is intervally arranged along the width encapsulating cup 2;Second pin 120 is intervally arranged along the width of himself, namely is intervally arranged along the width encapsulating cup 2.First pin 110 can be parallel to each other, and the second pin 120 can also be parallel to each other.
First pin set 11 can include three the first pins 110, and the second pin set 12 can include three the second pins 120, then this LED lamp bead of this utility model can be white light LEDs lamp bead;Specifically, LED chip 3 includes red LED chip, green LED chip and blue-light LED chip, then HONGGUANG, green glow, blue light form white light.Understandably, the quantity of pin is not limited to this, can also be that first, second pin set 11,12 includes 110, two the second pins 120 of two the first pins respectively, the luminous quantity needing to arrange the first pin 110 and the second pin 120 or first, second pin set 12 includes first 110, second pin 120 of pin etc. respectively, according to LED lamp bead.
The front of the forward part of pin and/or the back side are provided with the first capillary groove 13, and the first capillary groove 13 is centered around the periphery of the bottom of pit, and the first capillary groove is used for hindering water to enter portion in packaging cup body.First capillary groove 13 crosses over the forward part of the first pin 110 and the second pin 120, is namely that the first capillary groove 13 is made up of be located at the first pin 110 forward part and the second pin 120 forward part each section.Preferably, the material of encapsulation cup 2 is filled in the first capillary groove 13, to form better waterproof effect.In the present embodiment, the first capillary groove 13 is located at the front of the forward part of pin, because LED chip 3 is the front being located at pin;But the position of the first capillary groove 13 is not limited to this, it is also possible to be located at the back side of pin, or be located at the front of pin, the back side simultaneously.
First capillary groove 13 around shape can with the mating shapes of pit bottom, in this utility model, pit bottom be shaped as rectangle with rounded corners, the first capillary groove 13 be shaped as rectangle.
The front of the rear section of pin and/or face, the back side can be provided with the second capillary groove 14, and the second capillary groove 14 is positioned at the side-wall outer side of encapsulation cup 2.
Preferably, each pin being designed with the second capillary groove 14, the second capillary groove 14 is not parallel to the length direction of pin, and even the second capillary groove 14 can be perpendicular to the length direction of pin, and in the direction of the width across whole pin.The quantity of the second capillary groove 14 being located on same pin does not limit, it is possible to be one, it is possible to multiple to further enhance water resistance for what be intervally arranged along pin length direction.And the material encapsulating cup 2 can be filled in second capillary groove 14 at the pin back side, to further enhance water resistance.
The forward part of pin is provided with the dot matrix 15 of depression, dot matrix 15 is preferably distributed on each pin, and the material encapsulating cup 2 is filled in dot matrix 15, to strengthen the material encapsulating cup 2 adhesive force on pin, strengthen the bond strength between encapsulation cup 2 and pin.The part A dot matrix 15a, part A dot matrix 15a that dot matrix 15 includes being located at the back side of pin can be distributed in the forward part of pin as far as possible in large area, to strengthen the bond strength of encapsulation cup 2 and pin as wide as possible.
Dot matrix 15 may also include the part B dot matrix 15b being located at pin front, part B dot matrix 15b and is positioned at the outside of the bottom of pit and arranges along the bottom margin of pit, namely is positioned at pin front with encapsulation cup 2 material part.
The forward part of pin can be provided with first and admittedly expect hole 16, and first expects that hole 16 is positioned at the periphery of the bottom of pit admittedly, and the material of encapsulation cup 2 is filled into first and admittedly expects in hole 16, for strengthening pin and encapsulating the bond strength of cup 2.First expects that the quantity in hole 16 does not limit admittedly, and in the present embodiment, first expects that the quantity in hole 16 is four, is respectively provided at the outside at four turnings of the first capillary groove 13 of rectangle admittedly.The rear section of pin can be provided with second and admittedly expect hole 17, and second expects that hole 17 is positioned at the outside of encapsulation cup 2 admittedly, and the material encapsulating cup 2 is filled into second and admittedly expects in hole 17, for strengthening pin and encapsulating the bond strength of cup 2.Second expects that the quantity in hole 17 does not limit admittedly, it is preferable that admittedly expect hole 17 on each pin at least provided with one second;In the present embodiment, its quantity be six, each pin be provided with one second material hole 17 admittedly.
First admittedly material hole 16 and second admittedly expect that the shape in hole 17 is also not limited, it is possible to for circular, oval, rectangle or irregularly shaped etc..
In sum, the pin of LED lamp bead of the present utility model is provided with the first capillary groove 13 and/or the second capillary groove 14, can effectively hinder water to enter encapsulation cup 2 internal, enhance the water resistance of LED lamp bead.It is additionally provided with the dot matrix 15 of depression, enhances the encapsulation cup 2 adhesive force on pin, enhance the bond strength of pin and encapsulation cup 2.And it is provided with first and admittedly expects that hole 17 is expected in hole 16 and/or second admittedly, further enhancing the bond strength of pin and encapsulation cup 2.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for a person skilled in the art, this utility model can have various change, combination and change.All within spirit of the present utility model and principle, any amendment of making, equivalent replacement, improvement etc., should be included within right of the present utility model.
Claims (10)
1. a LED lamp bead with water-proof function, including encapsulation cup (2), LED chip (3) and elongated pin, described encapsulation cup (2) has upper surface, sidewall and lower surface, the upper surface of described encapsulation cup (2) is provided with the pit of concave downward, it is characterized in that, described pin includes the first pin set (11) and the second pin set (12) that are oppositely arranged, described first pin set (11) includes at least one first pin (110), described second pin (120) includes at least one second pin (120), the forward part of described pin is located in encapsulation cup (2), encapsulation cup (2) is stretched out outward in the rear section of pin, described pit extends downward the front of described first pin set (11) and the second pin set (12);
Described LED chip (3) is located at the bottom of described pit and electrically connects with described pin, is filled with packaging plastic (21) in described pit;
The front of the forward part of described pin and/or the back side are provided with the first capillary groove (13), and described first capillary groove (13) is centered around the periphery of the bottom of described pit.
2. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, described first pin set (11) includes three described first pins (110), and described second pin set (12) includes three described second pins (120).
3. the LED lamp bead with water-proof function according to claim 1, it is characterised in that the material of described encapsulation cup (2) is filled in described first capillary groove (13).
4. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, the front of the rear section of described pin and/or reverse side are provided with the second capillary groove (14), described second capillary groove (14) is positioned at the side-wall outer side of described encapsulation cup (2), and described second capillary groove (14) is not parallel to the length direction of described pin.
5. the LED lamp bead with water-proof function according to claim 4, it is characterised in that described second capillary groove (14) includes at least one described second capillary groove (14) spaced along described pin length direction.
6. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, the forward part of described pin is provided with the dot matrix (15) of depression, described dot matrix (15) includes the part A dot matrix (15a) being located at the back side of described pin, and described part A dot matrix (15a) is positioned at the lower section of described pit.
7. the LED lamp bead with water-proof function according to claim 6, it is characterized in that, described dot matrix (15) includes the part B dot matrix (15b) being located at described pin front, and described part B dot matrix (15b) is positioned at the outside of the bottom of described pit and arranges along the bottom margin of described pit.
8. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, the forward part of described pin is provided with first and admittedly expects hole (16), described first expects that hole (16) is positioned at the periphery of the bottom of described pit admittedly, and the material of described encapsulation cup (2) is filled into described first and admittedly expects in hole (16).
9. the LED lamp bead with water-proof function according to claim 8, it is characterised in that described first expects that hole (16) is located at the outside of described first capillary groove (13) admittedly.
10. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, the rear section of described pin is provided with second and admittedly expects hole (17), described second expects that hole (17) is positioned at the outside of described encapsulation cup (2) admittedly, and the material of described encapsulation cup (2) is filled into described second and admittedly expects in hole (17).
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CN201521062349.4U CN205350874U (en) | 2015-12-17 | 2015-12-17 | LED lamp pearl with waterproof function |
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CN201521062349.4U CN205350874U (en) | 2015-12-17 | 2015-12-17 | LED lamp pearl with waterproof function |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107482107A (en) * | 2017-08-10 | 2017-12-15 | 广东聚科照明股份有限公司 | A kind of SMD patch supports |
CN107482108A (en) * | 2017-08-10 | 2017-12-15 | 广东聚科照明股份有限公司 | A kind of new SMD lamp beads |
WO2019148776A1 (en) * | 2018-02-02 | 2019-08-08 | 深圳市奥拓电子股份有限公司 | Led bead and led display structure |
WO2019148778A1 (en) * | 2018-02-02 | 2019-08-08 | 深圳市奥拓电子股份有限公司 | Led bead and led display structure |
CN112885819A (en) * | 2021-01-12 | 2021-06-01 | 盐城东山精密制造有限公司 | Novel RGB (Red, Green and blue) all-in-one support and preparation method thereof |
-
2015
- 2015-12-17 CN CN201521062349.4U patent/CN205350874U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107482107A (en) * | 2017-08-10 | 2017-12-15 | 广东聚科照明股份有限公司 | A kind of SMD patch supports |
CN107482108A (en) * | 2017-08-10 | 2017-12-15 | 广东聚科照明股份有限公司 | A kind of new SMD lamp beads |
WO2019148776A1 (en) * | 2018-02-02 | 2019-08-08 | 深圳市奥拓电子股份有限公司 | Led bead and led display structure |
WO2019148778A1 (en) * | 2018-02-02 | 2019-08-08 | 深圳市奥拓电子股份有限公司 | Led bead and led display structure |
CN112885819A (en) * | 2021-01-12 | 2021-06-01 | 盐城东山精密制造有限公司 | Novel RGB (Red, Green and blue) all-in-one support and preparation method thereof |
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