CN202434510U - Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) - Google Patents
Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) Download PDFInfo
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- CN202434510U CN202434510U CN2011205218226U CN201120521822U CN202434510U CN 202434510 U CN202434510 U CN 202434510U CN 2011205218226 U CN2011205218226 U CN 2011205218226U CN 201120521822 U CN201120521822 U CN 201120521822U CN 202434510 U CN202434510 U CN 202434510U
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Abstract
The utility model relates to a full color SMD (Surface Mount Device) LED (Light-Emitting Diode) which comprises an epoxy resin packaging main body. A red wafer, a green wafer, a blue wafer and a bracket are packaged inside the packaging main body; the red wafer, the green wafer and the blue wafer are arranged on the bracket; bracket pins are arranged at the lower end of the bracket; the top side of the epoxy resin packaging main body is a light outgoing side; and the light outgoing side is of an arch structure. The full color SMD LED has the beneficial effects that the red wafer, the green wafer and the blue wafer are integrated, so integral packaging of epoxy resin is realized, and thereby the influence of expansion of an LED rubber body under heat is greatly reduced, the water prevention, moisture prevention and temperature shock resistance performance of the LED are improved. The full color SMD LED is applicable in harsh outdoor environment and is a novel semiconductor light emitting element with low cost and high reliability.
Description
Technical field
The utility model relates to a kind of light-emitting diode, particularly a kind of full-color paster type light emitting type.
Background technology
Along with the LED full color display is universal day by day, particularly outdoor display screen with its rich color and round-the-clock broadcast performance, is favored by users deeply.Marketing is more and more deep, and is also increasingly high to the pixel-intensive degree requirement of display screen.Existing outdoor display screen mainly uses oval direct insertion LED as light-emitting component, because direct insertion LED discrete component can only show a kind of color, so red, green, blue three LEDs could be formed a base pixel point, so can't realize the small pixel spacing.Though and traditional adopting surface mounted LED can be realized the small pixel spacing,, be prone to lamp body and make moist and cause failure phenomenon, thereby use in the indoor environment again because plastic shell is different with the thermal coefficient of expansion of epoxy resin.
Summary of the invention
The purpose of the utility model is to overcome deficiency of the prior art, provides a kind of three kinds of color wafers of red, green, blue are integrated, and uses the encapsulation of epoxy resin one, waterproof and dampproof full-color paster type light emitting type.
The purpose of the utility model is achieved in that it comprises the epoxy encapsulation main body; Be packaged with three wafers of red, green, blue and support in the said package main body; Three wafers of said red, green, blue are arranged on the support, and said support lower end is provided with the support pin, and its improvements are; The end face of said epoxy encapsulation main body is an exiting surface, and said exiting surface is domes;
Preferably, the quantity of said support pin is four, and wherein three support pins link to each other with three wafer gold threads of red, green, blue respectively, and the another pin is connected with support;
Preferably, said support pin is a U type structure, and excurvation is in the side of package main body;
Preferably; Said support is provided with crystal bonding area, and said crystal bonding area is the groove that rack upper surface is recessed to form downwards, and the side of said crystal bonding area is the inclined-plane that rack upper surface tilts toward crystal bonding area bottom center place; The bottom surface is the plane, and three wafers of said red, green, blue are arranged in the crystal bonding area of support;
Preferably, three wafers of described red, green, blue are arranged in a linear;
Preferably, described support is a cold stamping iron material electroplate support.
Compared with prior art; The beneficial effect of the utility model is: red, green, blue three primary colors wafer is integrated; Realized the integrated encapsulation of epoxy resin; Thereby the influence of LED colloid expanded by heating is greatly reduced, promoted LED waterproof, protection against the tide, resisting temperature impact property, can be applicable in the outdoor rugged environment and use; The utility model is a kind of low cost, the novel semiconductor light-emitting element of high reliability.
Description of drawings
Fig. 1 is the structural front view of the utility model;
Fig. 2 is the structure vertical view of the utility model;
Fig. 3 is the equivalent circuit diagram of the utility model.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is done and to be further described:
With reference to Fig. 1, shown in Figure 2; A kind of full-color paster type light emitting type of the utility model, it comprises epoxy encapsulation main body 1, said package main body 1 uses plastic mould one-body molded; The end face 11 of said epoxy encapsulation main body is an exiting surface; Said exiting surface is domes, is packaged with three wafers 3 of red, green, blue and support 2 in the said package main body, and said support 2 is provided with crystal bonding area 21; The groove that said crystal bonding area 21 is recessed to form downwards for rack upper surface; The side of said crystal bonding area 21 is the inclined-plane that rack upper surface tilts toward crystal bonding area 21 bottom center place, and the bottom surface is the plane, in the crystal bonding area that is installed on support 21 that three wafers 3 of said red, green, blue are arranged in a linear; Said support 2 lower ends are provided with 4 support pins, and wherein three support pins 4 are connected through gold thread 6 with three wafers 3 of red, green, blue respectively, and another support pin 5 is connected on the support; With support be one; And link to each other with three wafers of red, green, blue, 3 gold threads 6, described 4 support pins stretch out the bottom surface of package main body 1, are U type structure; Excurvation realizes the paster function in the side of package main body 1; Described support is a cold stamping iron material electroplate support.
Said with reference to Fig. 3, three wafers of red, green, blue in the epoxy encapsulation main body 1, each wafer all is independent drive circuit.
Adopt said structure, owing to realized the encapsulation of epoxy resin one, thus the influence of LED colloid expanded by heating is greatly reduced, promoted LED waterproof, protection against the tide, resisting temperature impact property, can be applicable in the outdoor rugged environment and use.
According to the announcement and the instruction of above-mentioned specification, the utility model those skilled in the art can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the utility model is not limited to is in the protection range of the claim that also should fall into the utility model to some modifications and the change of the utility model.In addition, although used some specific terms in this specification, these terms are explanation for ease just, the utility model is not constituted any restriction.
Claims (6)
1. full-color paster type light emitting type; Comprise the epoxy encapsulation main body; Be packaged with three wafers of red, green, blue and support in the said package main body, three wafers of said red, green, blue are arranged on the support, and said support lower end is provided with the support pin; It is characterized in that: the end face of said epoxy encapsulation main body is an exiting surface, and said exiting surface is domes.
2. a kind of full-color paster type light emitting type according to claim 1 is characterized in that: the quantity of said support pin is four, and wherein three support pins link to each other with three wafer gold threads of red, green, blue respectively, and the another pin is connected with support.
3. a kind of full-color paster type light emitting type according to claim 1 and 2 is characterized in that: said support pin is a U type structure, and excurvation is in the side of package main body.
4. a kind of full-color paster type light emitting type according to claim 1; It is characterized in that: said support is provided with crystal bonding area; Said crystal bonding area is the groove that rack upper surface is recessed to form downwards; The side of said crystal bonding area is the inclined-plane that rack upper surface tilts toward crystal bonding area bottom center place, and the bottom surface is the plane, and three wafers of said red, green, blue are arranged in the crystal bonding area of support.
5. according to claim 1 or 4 described a kind of full-color paster type light emitting types, it is characterized in that: three wafers of described red, green, blue are arranged in a linear.
6. a kind of full-color paster type light emitting type according to claim 1 is characterized in that: described support is a cold stamping iron material electroplate support.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205218226U CN202434510U (en) | 2011-12-14 | 2011-12-14 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011205218226U CN202434510U (en) | 2011-12-14 | 2011-12-14 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
Publications (1)
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CN202434510U true CN202434510U (en) | 2012-09-12 |
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CN2011205218226U Expired - Fee Related CN202434510U (en) | 2011-12-14 | 2011-12-14 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013181896A1 (en) * | 2012-06-06 | 2013-12-12 | 深圳雷曼光电科技股份有限公司 | Led bracket for surface mounting, manufacturing method thereof and led lamp |
CN103759228A (en) * | 2014-01-07 | 2014-04-30 | 江苏新广联科技股份有限公司 | Surface-mount Piranha LED lamp |
CN103779485A (en) * | 2014-01-28 | 2014-05-07 | 深圳市蓝科电子有限公司 | Outdoor SMD full-color LED lamp bead and manufacturing method thereof |
CN104124328A (en) * | 2013-04-26 | 2014-10-29 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
CN105914132A (en) * | 2016-03-14 | 2016-08-31 | 王志敏 | Paster diode gluing technology |
CN108447961A (en) * | 2018-04-17 | 2018-08-24 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
CN108735874A (en) * | 2018-08-09 | 2018-11-02 | 东莞市欧思科光电科技有限公司 | The LED and its technique of heat curing type package support and embedded communication IC integration packagings |
-
2011
- 2011-12-14 CN CN2011205218226U patent/CN202434510U/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013181896A1 (en) * | 2012-06-06 | 2013-12-12 | 深圳雷曼光电科技股份有限公司 | Led bracket for surface mounting, manufacturing method thereof and led lamp |
CN104124328A (en) * | 2013-04-26 | 2014-10-29 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
CN103759228A (en) * | 2014-01-07 | 2014-04-30 | 江苏新广联科技股份有限公司 | Surface-mount Piranha LED lamp |
CN103779485A (en) * | 2014-01-28 | 2014-05-07 | 深圳市蓝科电子有限公司 | Outdoor SMD full-color LED lamp bead and manufacturing method thereof |
CN103779485B (en) * | 2014-01-28 | 2017-01-18 | 深圳市蓝科电子有限公司 | Outdoor SMD full-color LED lamp bead and manufacturing method thereof |
CN105914132A (en) * | 2016-03-14 | 2016-08-31 | 王志敏 | Paster diode gluing technology |
CN105914132B (en) * | 2016-03-14 | 2018-11-16 | 王志敏 | A kind of photoresist coating process of stamp-mounting-paper diode |
CN108447961A (en) * | 2018-04-17 | 2018-08-24 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
CN108735874A (en) * | 2018-08-09 | 2018-11-02 | 东莞市欧思科光电科技有限公司 | The LED and its technique of heat curing type package support and embedded communication IC integration packagings |
CN108735874B (en) * | 2018-08-09 | 2024-02-13 | 东莞市欧思科光电科技有限公司 | LED (light-emitting diode) integrally packaged by thermosetting packaging bracket and embedded communication IC (integrated circuit) and process thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160426 Address after: 629000 South Road, airport, Suining economic and Technological Development Zone, Sichuan Patentee after: Innoquick Electronics Technology Co., Ltd. Address before: Tak Road Economic Development Zone Suining City, Sichuan province 629000 ship mountain Patentee before: Sichuan Bonshine Optical Electron Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120912 Termination date: 20171214 |