CN203038979U - Moisture-proof full-color surface mount device - Google Patents

Moisture-proof full-color surface mount device Download PDF

Info

Publication number
CN203038979U
CN203038979U CN2012206630843U CN201220663084U CN203038979U CN 203038979 U CN203038979 U CN 203038979U CN 2012206630843 U CN2012206630843 U CN 2012206630843U CN 201220663084 U CN201220663084 U CN 201220663084U CN 203038979 U CN203038979 U CN 203038979U
Authority
CN
China
Prior art keywords
welding disk
surface mount
full
mount device
color surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012206630843U
Other languages
Chinese (zh)
Inventor
郭伦春
刘君宏
何海生
余红波
张铁钟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Jiuzhou Optoelectronics Technology Co Ltd filed Critical Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
Priority to CN2012206630843U priority Critical patent/CN203038979U/en
Application granted granted Critical
Publication of CN203038979U publication Critical patent/CN203038979U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses a moisture-proof full-color surface mount device. The moisture-proof full-color surface mount device comprises a bracket provided with a formed reflective cup, a plurality of conductive pads which are inserted into the reflective cup and are fixed together with the bracket, red, green and blue chips which are fixed on different conductive pads, and a packaging adhesive block which is filled in the reflective cup; each conductive pad includes a pad portion arranged inside the reflective cup, connecting portions which are fixed together with the bracket, pin portions which extend to the periphery of the bracket; at least one part of the pad portion is suspended relative to the bottom of the reflective cup; and the packaging adhesive block covers all surface of the suspended portion of the pad. According to the moisture-proof full-color surface mount device of the utility model, each conductive pad is designed in a manner that at least one part of the conductive pad is suspended relative to the bottom of the reflective cup, as a result, after filled in the reflective cup, the packaging adhesive block can cover a suspended bottom surface of the conductive pad, and therefore, the contact area of the pads and the bracket can be reduced. Thus, the quantity of moisture that enters a channel can be reduced, and excellent moisture-proof effect can be realized, and usage performance of a device can be improved.

Description

Moistureproof full-color surface mount device
Technical field
The utility model relates to the LED technical field, relates more specifically to a kind of moistureproof full-color surface mount device indoor LED display, that have better humidity resistance that is applicable to.
Background technology
In recent years, LED display relies on superiority such as the low price, low consumption, high brightness, long-life of its uniqueness playing the part of important role in the flat panel display field always, and is also having sizable development space in one quite long from now on period.LED display has advantages such as high brightness, sliceable use, convenient, flexible, efficient low-consume, makes it show in large tracts of land, and particularly the application in fields such as physical culture, advertisement, finance, exhibition, traffic is quite extensive.
All many-sides have the unsurpassable characteristics of straight cutting lamp and advantage to the full-color device of SMD in that color rendition, colour consistency, visual angle, picture whole structure and structure be frivolous etc. because of it, so the full-color product of SMD will become the development main flow direction of following display screen.But the indoor device of traditional SMD is because the bottom of its conductive welding disk is fitted in support (by insulating material, make as PPA) reflector bottom on, and the adhesion of conductive welding disk and insulating material (as PPA) is relatively poor, when indoors using, moisture (as steam) can enter reflector inside along the slit between conductive welding disk and the insulating material, the structure that its chip than straight cutting monochromatic burner pearl, support are wrapped up fully by colloid, its humidity resistance is very poor.Under the environment of variations in temperature, inner moisture produces steam pressure, the internal stress that produces of the different coefficients of expansion of chip, plain conductor, conductive welding disk and the various materials of packing colloid in addition, make that product occurs easily that plain conductor opens circuit, bad phenomenon such as electric leakage, chip come off, therefore, the full-color device of SMD is used less in the display screen field indoors at present.
Yet along with the development of LED technology, market is more and more stronger to the demand that indoor high definition shows, the full-color device of indoor SMD of the high moisture energy indoors widespread adoption of display screen has been inexorable trend.
The utility model content
The purpose of this utility model provides a kind ofly has the moistureproof full-color surface mount device of better humidity resistance to satisfy the demand of indoor display screen.
To achieve these goals, the technical solution adopted in the utility model is: provide a kind of protection against the tide full-color surface mount device, it comprises the support that is formed with reflector, the a plurality of conductive welding disks that intert in the reflector into and be fixed together with support, be fixed on red on the different conductive welding disks, green, blue chip and be filled in encapsulation blob of viscose in the reflector, described conductive welding disk comprises the welding disk that is positioned at reflector, the connecting portion that is fixed together with support and the pin portion that extends to the support periphery, described welding disk at least a portion is unsettled with respect to the cup end of described reflector, and described encapsulation blob of viscose coats all surface of described welding disk overhanging portion.
In a preferred embodiment of the present utility model, the single metal conducting strip that described conductive welding disk is formed in one, described metallic conduction sheet comprises the described pin of a described welding disk, two described connecting portions and two portion, and the whole welding disk of described conductive welding disk is unsettled with respect to the cup end of described reflector.
Its further technical scheme is: described connecting portion is Z-shaped bending structure.
Its further technical scheme is: the top of described conductive welding disk is straight welding disk, and the two ends of described welding disk bend out two connecting portions, and two connecting portions bend respectively and form two pin portions.
In another preferred embodiment of the present utility model, described conductive welding disk is made up of the pair of metal conducting strip, each described metallic conduction sheet comprises the described pin of a described welding disk, described connecting portion and portion, and each has different circuit polarities to connect positive and negative the two poles of the earth of same chip respectively to described metallic conduction sheet.
Its further technical scheme is: the middle part, the cup end of described reflector upwards stretches out a brace table, and two welding disks of described conductive welding disk all part are erected on the described brace table.
Its further technical scheme is: described connecting portion is Z-shaped bending structure.
Its further technical scheme is: be formed with at least one location resistance wet hole on the described connecting portion.
Its further technical scheme is: be formed with at least one resistance wet sump on described welding disk and/or the described connecting portion.
Its further technical scheme is: described resistance wet sump semicircular in shape or square.
Compared with prior art, the moistureproof full-color surface mount device that the utility model provides is designed to be the bridge structure with conductive welding disk in reflector, conductive welding disk at least a portion is unsettled with respect to the bottom of reflector, thereby after being filled in reflector, the encapsulation blob of viscose not only can coat pad end face and chip fully, but also can cover the unsettled bottom surface of conductive welding disk, thereby reduce the contact area of pad and support, and then reduce moisture enters reflector inside along the slit between conductive welding disk and the support passage, finally reach good moisture effect with the serviceability of boost device.
By following description also by reference to the accompanying drawings, it is more clear that the utility model will become, and these accompanying drawings are used for explaining embodiment of the present utility model.
Description of drawings
Fig. 1 is the generalized section of moistureproof full-color surface mount device first embodiment of the utility model.
Fig. 2 is the part-structure stereogram of the full-color surface mount device of protection against the tide shown in Figure 1.
Fig. 3 is the part-structure vertical view of the full-color surface mount device of protection against the tide shown in Figure 1.
Fig. 4 is the generalized section of moistureproof full-color surface mount device second embodiment of the utility model.
Fig. 5 is the part-structure vertical view of the full-color surface mount device of protection against the tide shown in Figure 4.
Conductive welding disk stereogram among moistureproof other embodiment of full-color surface mount device of Fig. 6 the utility model.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the embodiment is clearly and completely described, similar assembly label represents similar assembly in the accompanying drawing.Obviously, below only be the utility model part embodiment with the embodiment that describes, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 1 to Fig. 3, it has showed first embodiment of the present utility model, and the moistureproof full-color surface mount device 10 of present embodiment comprises support 11, four conductive welding disks 12, three chips 13 of red, green, blue and encapsulation blob of viscoses 14.
In the present embodiment, described support 11 by black, (for example PPA) is injection molded for white double-colored insulating material, formed structure comprises black housing 111 and white inside casing 112, wherein white inside casing 112 forms reflectors 112.Should deceive the contrast that the words spoken by an actor from offstage design can improve LED outward.
In the present embodiment, the single metal conducting strip that each conductive welding disk 12 is formed in one, it comprises the welding disk 121 that is positioned at reflector 112, the connecting portion 122 that is fixed together with support 11 and the pin portion 123 that extends to support 11 peripheries.Wherein, the whole welding disk 121 of conductive welding disk 12 is unsettled and be bridge formation formula structure with respect to the cup end of reflector 112, to be welding disk 121 with the cup end of reflector 112 do not produce directly yet contacts, after encapsulation blob of viscose 14 is filled in reflector 112, encapsulation blob of viscose 14 coats the whole welding disk 121 of conductive welding disk 12 to get up fully, thereby outside moisture can't be from the back side large tracts of land invasion of welding disk 121, only might enter along the both ends of welding disk 121 minimum areas in the reflector 112, its intrusion path reduces greatly, thereby can play good moisture effect.
Influence internal circuit in order further to prevent moisture from entering in the reflector 112, the utility model also can adopt following design: preferably, it is symmetrical that the conductive welding disk 12 of present embodiment is Shape, its top are that straight welding disk 121, middle part is to continue two pin portions 123 that bending extends out from two connecting portions 122 respectively for two connecting portion 122 bottoms that extend out from the bending of welding disk 121 two ends.Wherein, two connecting portions 122 are for roughly to be Z-shaped bending structure, for the moisture admission passage is placed obstacles; Preferably, be formed with at least one resistance wet sump 1211 on the described welding disk 121, described resistance wet sump 1211 can be semicircle, square or other shape, particularly, each place, end of the welding disk 121 of present embodiment is provided with the resistance wet sump 1211 of two semicircles and forms neck shape structure, fills up encapsulation blob of viscose 14 in this neck shape structure, thereby reduces the passage that moisture enters greatly, in other embodiments, resistance wet sump 1211 also can be arranged on the connecting portion 122 simultaneously; Equally preferably, be formed with a plurality of location resistance wet holes 1221 on the described connecting portion 122, be injection-moulded in a time-out at conductive welding disk 12 and support 11, the insulating material of making support 11 can infiltrate in the location resistance wet hole 1221 and make support 11 more firm with being connected of conductive welding disk 12, simultaneously, described location resistance wet hole 1221 also can further reduce the passage that moisture enters.
With reference to Fig. 3, four conductive welding disks 12 of present embodiment are injection-moulded in and parallel arranged on support 11 with support 11, wherein three conductive welding disks 12 have same circuits polarity, it is respectively applied to install three chips 13 of red, green, blue, another conductive welding disk 12 is public conductive welding disk, and it has the polarity opposite with other three conductive welding disks 12.Red, green, blue chip 13 firmly is fixed on the corresponding conductive welding disk 12 by crystal-bonding adhesive, and arranges in line, and it is with respect to traditional " product " font arrangement mode, and the colour cast problem reduces, and contrast increases.Particularly, according to traditional connected mode, one of them electrode of each chip 13 is communicated with its place conductive welding disk 12 by plain conductor 15, its another electrode is connected with public conductive welding disk 12 by plain conductor 15, chip 13 is fixed on after the conductive welding disk 12, carries out sealed package by described encapsulation blob of viscose 14.Preferably, the encapsulation blob of viscose 14 of present embodiment is vaporific encapsulation blob of viscose, and it forms by sneaking into the spread powder with mixed light and modifying function (absorb stress and absorb UV) in the epoxide-resin glue equably, plays the effect of stress absorption, UV absorption and even light mixing.
With reference to Fig. 4 and Fig. 5, it has showed second embodiment of the present utility model, the moistureproof full-color surface mount device 20 of present embodiment comprises support 21, conductive welding disk, red, green, blue chip 23 and encapsulation blob of viscose 24, its overall structure is roughly identical with first embodiment, and main distinction point is the particular design of support 21 and conductive welding disk 22.Particularly, present embodiment is provided with three conductive welding disks, and each conductive welding disk is made up of pair of metal conducting strip 22a and 22b, each metallic conduction sheet 22a (22b) comprises the welding disk 221a (221b) that is positioned at reflector 212, expose the 223a of pin portion (223b) of support 21 peripheries and be connected welding disk 221a (221b) and the 223a of pin portion (223b) between connecting portion 222a (222b), two metallic conduction sheet 22a and 22b be stitched together then have with first embodiment in the similar structure of single metal conducting strip 11.
Each is positioned at same straight line to metallic conduction sheet 22a and 22b in the present embodiment, and its circuit polarities is opposite, is respectively applied to connect positive and negative the two poles of the earth of same chip 23.Because the conductive welding disk 22 of said structure comprises two metallic conduction sheet 22a and 22b, disconnect and the shortage support force between two metallic conduction sheet 22a and the 22b, the support 21 of present embodiment also upwards stretches out a brace table 2121 at the cup end of reflector 212 and provides a supporting role except the same design feature with black housing 211 and white reflector 212 with first embodiment.Particularly, two welding disk 221a of described conductive welding disk 22 and the end of 221b are erected on the described brace table 2121 and the remainder of welding disk 221a and 221b keeps vacant state, thereby, the porch of moisture passage still is subjected to encapsulating stopping of blob of viscose 24, and the moistureproof full-color surface mount device 20 of this structure can be realized good moisture effect.
Similarly, in the present embodiment, also can adopt the mode identical with first embodiment, be designed to Z-shaped bending structure, resistance wet sump 2211 be set and resistance wet hole 2221 in location is further strengthened moisture-proof function by connecting portion 222a and 222b with conductive welding disk 22.
As shown in Figure 6, in other embodiments, conductive welding disk 32 also can be designed to Shape is with simplified structure, but a plurality of resistance wet sump 3211 partial design that are arranged on conductive welding disk 32 for semicircle, partial design is square.
As mentioned above, the moistureproof full-color surface mount device that the utility model provides is designed to be the bridge structure with conductive welding disk in reflector, conductive welding disk at least a portion is unsettled with respect to the bottom of reflector, thereby after being filled in reflector, the encapsulation blob of viscose not only can coat pad end face and chip fully, but also can cover the unsettled bottom surface of conductive welding disk, thereby reduce the contact area of pad and support, and then reduce moisture enters reflector inside along the slit between conductive welding disk and the support passage, finally reach good moisture effect, avoiding device inside plain conductor to occur because moisture is overweight opens circuit, electric leakage, bad phenomenon such as chip comes off, thereby the serviceability of boost device greatly.
Need to prove that other structure of the moistureproof full-color surface mount device of the utility model is well known to those skilled in the art, and does not repeat them here.
Abovely in conjunction with most preferred embodiment the utility model is described, but the utility model is not limited to the embodiment of above announcement, and should contains various modification, equivalent combinations of carrying out according to essence of the present utility model.

Claims (10)

1. full-color surface mount device of protection against the tide, comprise the support that is formed with reflector, the a plurality of conductive welding disks that intert in the reflector into and be fixed together with support, be fixed on red on the different conductive welding disks, green, blue chip and be filled in encapsulation blob of viscose in the reflector, described conductive welding disk comprises the welding disk that is positioned at reflector, the connecting portion that is fixed together with support and the pin portion that extends to the support periphery, it is characterized in that: described welding disk at least a portion is unsettled with respect to the cup end of described reflector, and described encapsulation blob of viscose coats all surface of described welding disk overhanging portion.
2. the full-color surface mount device of protection against the tide as claimed in claim 1, it is characterized in that: the single metal conducting strip that described conductive welding disk is formed in one, described metallic conduction sheet comprises the described pin of a described welding disk, two described connecting portions and two portion, and the whole welding disk of described conductive welding disk is unsettled with respect to the cup end of described reflector.
3. the full-color surface mount device of protection against the tide as claimed in claim 2, it is characterized in that: described connecting portion is Z-shaped bending structure.
4. the full-color surface mount device of protection against the tide as claimed in claim 3, it is characterized in that: the top of described conductive welding disk is straight welding disk, and the two ends of described welding disk bend out two connecting portions, and two connecting portions bend respectively and form two pin portions.
5. the full-color surface mount device of protection against the tide as claimed in claim 1, it is characterized in that: described conductive welding disk is made up of the pair of metal conducting strip, each described metallic conduction sheet comprises the described pin of a described welding disk, described connecting portion and portion, and each has different circuit polarities to connect positive and negative the two poles of the earth of same chip respectively to described metallic conduction sheet.
6. the full-color surface mount device of protection against the tide as claimed in claim 5 is characterized in that: the middle part, the cup end of described reflector upwards stretches out a brace table, and two welding disks of described conductive welding disk all part are erected on the described brace table.
7. the full-color surface mount device of protection against the tide as claimed in claim 6, it is characterized in that: described connecting portion is Z-shaped bending structure.
8. as the full-color surface mount device of each described protection against the tide of claim 1-7, it is characterized in that: be formed with at least one location resistance wet hole on the described connecting portion.
9. as the full-color surface mount device of each described protection against the tide of claim 1-7, it is characterized in that: be formed with at least one resistance wet sump on described welding disk and/or the described connecting portion.
10. the full-color surface mount device of protection against the tide as claimed in claim 9 is characterized in that: described resistance wet sump semicircular in shape or square.
CN2012206630843U 2012-12-05 2012-12-05 Moisture-proof full-color surface mount device Expired - Fee Related CN203038979U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012206630843U CN203038979U (en) 2012-12-05 2012-12-05 Moisture-proof full-color surface mount device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012206630843U CN203038979U (en) 2012-12-05 2012-12-05 Moisture-proof full-color surface mount device

Publications (1)

Publication Number Publication Date
CN203038979U true CN203038979U (en) 2013-07-03

Family

ID=48691071

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012206630843U Expired - Fee Related CN203038979U (en) 2012-12-05 2012-12-05 Moisture-proof full-color surface mount device

Country Status (1)

Country Link
CN (1) CN203038979U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103000620A (en) * 2012-12-05 2013-03-27 深圳市九洲光电科技有限公司 Damp-proof full-color surface mount device
CN105702831A (en) * 2016-01-19 2016-06-22 深圳市华天迈克光电子科技有限公司 Full-color SMD display screen support and die bonding and wire soldering method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103000620A (en) * 2012-12-05 2013-03-27 深圳市九洲光电科技有限公司 Damp-proof full-color surface mount device
CN105702831A (en) * 2016-01-19 2016-06-22 深圳市华天迈克光电子科技有限公司 Full-color SMD display screen support and die bonding and wire soldering method thereof

Similar Documents

Publication Publication Date Title
KR20180015051A (en) Novel LED Support Structure
CN103000620A (en) Damp-proof full-color surface mount device
CN105591013B (en) A kind of SMD outer packages formula LED
CN202434510U (en) Full color SMD (Surface Mount Device) LED (Light-Emitting Diode)
CN202871789U (en) Full-color surface-mounted device
CN203038979U (en) Moisture-proof full-color surface mount device
CN203771328U (en) Head band simulation connector and light-emitting diode (LED) lamp utilizing same
CN202585413U (en) Full-color surface-mounting device having front face brushed into black
CN210778582U (en) Surface mounting type LED
CN201262959Y (en) Patch type LED structure
CN216015365U (en) Lamp pearl, lamp pearl subassembly and display screen
CN204407358U (en) A kind of TOP LED support and TOP LED component thereof
CN207068923U (en) A kind of novel full color LED light source encapsulating structure and application
CN206685412U (en) A kind of LED encapsulates ruggedized construction
CN206992109U (en) A kind of outdoor big spacing LED component and LED display
CN208127237U (en) A kind of novel LED encapsulation structure
CN201053639Y (en) LED full-color surface-mounted device
CN218039258U (en) Dampproofing LED structure
CN207038551U (en) A kind of radiator and chip integrative packaging light-source structure
CN202736917U (en) LED packaging structure
CN205900591U (en) LAMP347 colloid packaging structure
CN202758928U (en) Improved LED full-color support structure
CN206904641U (en) A kind of specular removal is without dead angle LEDT8 fluorescent tubes
CN203071066U (en) Parallelly connected welding wire structure of LED lamp
CN205174075U (en) Waterproof led lamp strip

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130703

Termination date: 20131205