CN210778582U

CN210778582U - Surface mounting type LED

Info

Publication number: CN210778582U
Application number: CN201920753684.0U
Authority: CN
Inventors: 龚文; 邵鹏睿; 隆春花
Original assignee: Shenzhen Jingtai Co ltd
Current assignee: Shenzhen Jingtai Co ltd
Priority date: 2019-05-21
Filing date: 2019-05-21
Publication date: 2020-06-16
Anticipated expiration: 2029-05-21

Abstract

The utility model relates to a LED encapsulates technical field, and more specifically relates to a surface mounting type LED, including the base plate, the preparation has two-sided circuit and through electrically conductive jogged joint on the base plate, and the positive circuit of base plate is equipped with the pad, and the pad is equipped with pin and electrically conductive jogged joint, is equipped with the LED chip on the pad, and the LED chip is fixed at the pad through solid crystal glue to through electrically conductive lead wire with the electrode and the substrate connection of LED chip, the positive circuit of base plate adopts printing ink to cover, and the surface embedment of base plate has the encapsulation to glue will the LED chip carries out sealed protection. The utility model discloses utilize and be equipped with the pad at the positive circuit of base plate and be used for fixed LED chip, strengthen its connection stability, adopt printing ink to cover positive circuit simultaneously, cover the silver-colored reflection of substrate surface circuit copper foil, the embedment encapsulating glue strengthens LED's gas tightness on whole base plate at last to make SMD LED product have high contrast, high definition, high reliability.

Description

Surface mounting type LED

Technical Field

The utility model relates to a LED encapsulates technical field, and more specifically relates to a surface mounting type LED.

Background

With the continuous improvement of indoor display application technology, the traditional display product technology gradually tops, and indoor small-distance products become the main technical expansion space in the future; because the contrast of the full-color SMD provided on the market is not high enough, the full-color SMD can only be applied to the LED display screen with low definition requirement. The more transparent the SMD LED product or the more white the color of the lamp bead, the lower the contrast of the LED display screen made by the SMD LED product and the lower the definition of the displayed image. The full-color SMD of small-size that produces at present is because the colloid is transparent colour, sees the silver-colored reflection of lamp pearl surface internal copper foil from openly and has come direct influence the display effect of screen, and high definition LED display screen, and the pixel requires highly, so to the LED display screen of high definition and high contrast, current full-color SMD LED can't satisfy the requirement.

SUMMERY OF THE UTILITY MODEL

The utility model provides a solve the technical defect who exists, the utility model provides a to LED show packaging structure's improvement, realized a high contrast high definition surface mounting type LED.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a surface mounting type LED, includes the base plate, the preparation has double-sided circuit and connects through electrically conductive jogged joint on the base plate, the front circuit of base plate is equipped with the pad, the pad is equipped with pin and electrically conductive jogged joint, be equipped with the LED chip on the pad, the LED chip is fixed through solid crystal glue the pad to will through electrically conductive lead wire the electrode of LED chip with the substrate connection, the front circuit of base plate adopts printing ink to cover, the surface embedment of base plate has the encapsulating glue will the LED chip carries out sealed protection.

Further, the pad includes public pad, ruddiness pad, green glow pad and blue light pad, blue light pad and green glow pad all are equipped with the connection pad.

Further, the LED chip comprises a red light chip, a green light chip and a blue light chip, the red light chip, the green light chip and the blue light chip are respectively fixed on the red light bonding pad, the green light bonding pad and the blue light bonding pad by solid crystal glue, the anodes of the red light chip, the green light chip and the blue light chip are all connected and conducted with the common bonding pad through bonding wires, the cathode of the red light chip is connected and conducted with the red light bonding pad through the bonding wires, the cathode of the green light chip is connected and conducted with the connection bonding pad of the green light bonding pad through the bonding wires, and the cathode of the blue light chip is connected and conducted with the connection bonding pad of the blue light bonding pad through the bonding.

The number ratio of the red light chips to the green light chips to the blue light chips is 1:1: 1.

Furthermore, a circuit on the back side of the substrate is provided with a Make point, the Make point is connected with a circuit on the front side of the substrate through a conductive hole, and the Make point is designed to be rectangular or triangular.

Further, the packaging adhesive comprises epoxy resin or silicon resin.

Furthermore, the surface mount type LED composed of the substrate, the LED chip and the packaging adhesive has the length of 1.2-1.4 mm, the width of 1.2-1.4 mm and the height of 0.65-1.4 mm.

The utility model has the advantages that:

the utility model discloses utilize and be equipped with the pad at the positive circuit of base plate and be used for fixed LED chip, strengthen its connection stability, adopt printing ink to cover positive circuit simultaneously, cover the silver-colored reflection of substrate surface circuit copper foil, the embedment encapsulating glue strengthens LED's gas tightness on whole base plate at last to make SMD LED product have high contrast, high definition, high reliability.

Drawings

Fig. 1 is a schematic front structural view of a surface mount LED provided in an embodiment of the present invention;

fig. 2 is a schematic diagram of a back structure of a surface-mount LED according to an embodiment of the present invention;

fig. 3 is a schematic view of a layout structure of a surface mount LED chip according to an embodiment of the present invention;

fig. 4 is a schematic view of a surface mount LED package structure according to an embodiment of the present invention;

in the figure: the packaging structure comprises a substrate 1, a packaging adhesive 2, a conductive hole 3, a common bonding pad 4, a red bonding pad 5, a green bonding pad 6, a blue bonding pad 7, a pin 8, a connection bonding pad 9, a red chip 10, a green chip 11, a blue chip 12 and a Make point 13.

Detailed Description

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.

Example 1:

as shown in fig. 1-4, the main components of the surface mount LED of the present invention include a substrate 1, an LED chip, a die attach adhesive, and a package adhesive 2; the double-sided circuit is manufactured on the substrate 1 and connected through the conductive hole 3, the front circuit of the substrate 1 is provided with a pad, the pad comprises a common pad 4, a red pad 5, a green pad 6 and a blue pad 7, the common pad 4 is independently designed at the left lower part of the substrate 1 and connected with a pin 8, the blue pad 7 and the green pad 6 are respectively provided with two connecting pads 9 and connected with the pin 8 through the two connecting pads, the red pad 5 is an independently designed structure and connected with the corresponding pin 8, and the pin 8 is communicated with the conductive hole 3; the LED chip comprises a red light chip 10, a green light chip 11 and a blue light chip 12, wherein the red light chip 10, the green light chip 11 and the blue light chip 12 are respectively fixed on a red light pad 5, a green light pad 6 and a blue light pad 7 by adopting solid crystal glue, the anodes of the red light chip 10, the green light chip 11 and the blue light chip 12 are all connected and conducted with a common pad 4 through bonding wires, the cathode of the red light chip 10 is connected and conducted with the red light pad 5 through the bonding wires, the cathode of the green light chip 11 is connected and conducted with a connection pad 9 of the green light pad 6 through the bonding wires, and the cathode of the blue light chip 12 is connected and conducted with the connection pad 9 of the; a circuit on the back side of the substrate 1 is provided with a Make point 13, and the Make point 13 is connected with a circuit on the front side of the substrate 1 through the conductive hole 3; and finally, covering the front circuit of the substrate 1 with ink, and encapsulating the surface of the substrate 1 with an encapsulation adhesive 2 to seal and protect the LED chip.

In the present embodiment, the surface mount LED composed of the substrate 1, the LED chip, the package adhesive 2, and the like has a length of 1.42 mm, a width of 1.42 mm, and a height of 0.85 mm.

The utility model discloses be equipped with the pad at the front circuit of base plate and be used for fixed LED chip, strengthen its connection stability, adopt printing ink to cover front circuit simultaneously, cover the silver-colored reflection of substrate surface circuit copper foil, the embedment encapsulation is glued on whole base plate at last and is strengthened LED's gas tightness to make SMD LED product have high contrast, high definition, high reliability.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a surface mounting type LED, its characterized in that, includes the base plate, the preparation has two-sided circuit and connects through electrically conductive jogged joint on the base plate, the front circuit of base plate is equipped with the pad, the pad is equipped with pin and electrically conductive jogged joint, be equipped with the LED chip on the pad, the LED chip is fixed through solid crystal glue the pad to will through electrically conductive lead wire the electrode of LED chip with the substrate connection, the front circuit of base plate adopts printing ink to cover, the surface embedment of base plate has the encapsulation to glue will the LED chip carries out sealed protection.

2. The surface mount LED of claim 1, wherein the pads comprise a common pad, a red pad, a green pad, and a blue pad, the blue and green pads each having a connection pad.

3. The surface mount type LED of claim 2, wherein the LED chip comprises a red light chip, a green light chip, and a blue light chip, the red light chip, the green light chip, and the blue light chip are respectively fixed to the red light pad, the green light pad, and the blue light pad by using die attach adhesives, the anodes of the red light chip, the green light chip, and the blue light chip are all connected and conducted with the common pad through bonding wires, the cathode of the red light chip is connected and conducted with the red light pad through bonding wires, the cathode of the green light chip is connected and conducted with the connection pad of the green light pad through bonding wires, and the cathode of the blue light chip is connected and conducted with the connection pad of the blue light pad through bonding wires.

4. The surface-mount LED of claim 1, wherein the circuit on the back surface of the substrate is provided with a Make point, the Make point is connected with the circuit on the front surface of the substrate through a conductive hole, and the Make point is rectangular or triangular.

5. The surface-mount LED of claim 1, wherein the encapsulant comprises epoxy or silicone.

6. The surface-mount LED of claim 1, wherein the surface-mount LED comprising the substrate, the LED chip, and the encapsulant has a length of 1.2-1.4 mm, a width of 1.2-1.4 mm, and a height of 0.65-1.4 mm.