CN210403764U

CN210403764U - Blue light LED packaging structure, backlight module and display device

Info

Publication number: CN210403764U
Application number: CN201920716263.0U
Authority: CN
Inventors: 王金鑫; 姜攀; 周波
Original assignee: Shenzhen Mtc Optronics Co ltd
Current assignee: Jiangxi zhaochi Guangyuan Technology Co.,Ltd.
Priority date: 2019-05-17
Filing date: 2019-05-17
Publication date: 2020-04-24
Anticipated expiration: 2029-05-17

Abstract

The application discloses a blue light LED structure, which comprises a support and a flip chip, wherein the support is concave inwards to form a bowl cup, the support is a silicon material support, and the silicon material support is in a positive-negative symmetrical structure; the flip chip is arranged in the bowl cup, and the packaging layer is filled around the flip chip. The application also discloses backlight unit and display device. Through the mode, the brightness of the blue light LED can be improved.

Description

Blue light LED packaging structure, backlight module and display device

Technical Field

The application relates to the technical field of display, in particular to a blue light LED packaging structure, a backlight module and display equipment.

Background

For dealing with the high colour gamut that is shaded from the sun of jumbo size TV, the high definition, high-end market demands such as high reliability, current main application adopts ordinary blue light LED collocation QD membrane to give first place to, to the diversified customer's requirement of high-end class product in a poor light, the requirement in market then can't be satisfied to current scheme, the main problem that this scheme faces still the QD membrane arouses ordinary blue light LED's module luminance on the low side, then need satisfy through promoting drive current, or the mode that increases the diaphragm satisfies, current scheme is as follows:

1. the upstream support adopts an EMC common positive and negative electrode asymmetric structure support

2. The chip adopts a common normally-installed blue chip to package a conventional blue chip

3. QD films matched for downstream applications

However, as above, the brightness of the module is still low.

SUMMERY OF THE UTILITY MODEL

The application provides a blue light LED packaging structure, backlight unit and display device, can solve the problem that the luminance of blue light LED module is on the low side among the prior art.

In order to solve the above problem, the present application provides a blue LED structure, the LED structure comprising:

the bowl-shaped support is concave inwards to form a bowl cup, and is a silicon material support which is in a positive-negative symmetrical structure;

the flip chip is arranged in the bowl cup, and the packaging layer is filled around the flip chip.

Wherein, the silicon material support adopts no gold thread welding.

The flip chip is welded in the bowl cup by adopting a solder pad and solder ball mode through a reflow soldering process.

The packaging layer comprises a silicon dioxide layer, and the silicon dioxide layer is connected with the flip chip and the silicon material support.

The packaging layer further comprises colloid, and fluorescent powder is contained in the colloid.

In order to solve the above problem, the present application further provides a backlight module, which includes the foregoing blue LED structure.

In order to solve the above problem, the present application further provides a display device, which includes a display panel and the backlight module as before.

The blue light LED packaging structure, the backlight module and the display device are characterized in that the silicon material is directly changed into an EMC positive and negative electrode asymmetrical structure in the prior art, and the silicon material support is a positive and negative electrode symmetrical structure, so that the brightness of the blue light LED packaging structure can be enhanced.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of an LED package structure according to the present application;

fig. 2 is a schematic structural diagram of a silicon material support of an LED package structure according to the present application;

fig. 3 is a schematic structural view of a silicon material support of the LED package structure of the present application with a flip chip mounted thereon.

Detailed Description

Referring to fig. 1 to fig. 3, the LED package structure of the present application includes a frame 10, a flip chip 20 and a package layer.

The support 10 is concave inwards to form a bowl cup, the support is a silicon material support, and the silicon material support is in a positive-negative symmetrical structure.

The flip chip 20 is disposed in the bowl. Specifically, the flip chip 20 is soldered in the form of a pad and a solder ball in the bowl by a reflow soldering process, and in the present embodiment, the flip chip 20 is preferably soldered without gold wires.

The packaging layer comprises a silicon dioxide layer 31 and a colloid 32, the silicon dioxide layer 31 is connected with the flip chip 20 and the silicon material support, phosphor powder is contained in the colloid 32, and the colloid 32 is located on the upper layer of the silicon dioxide layer 31 and covers the flip chip 20.

The application also discloses a backlight module which comprises the blue light LED structure of the embodiment.

The application also discloses a display device, which comprises a display panel and the backlight module of the embodiment.

The blue light LED packaging structure, the backlight module and the display device have the following advantages:

1. the silicon material support is in a positive-negative symmetric structure, so that the brightness of the packaging structure can be increased, and the requirements of single lamp, double crystal and double color are met;

2. the flip chip is welded in the bowl cup by adopting a solder pad and solder ball mode through a reflow soldering process, the soldering process in the prior art is cancelled, the product stability and the production efficiency are improved, and the welding performance of the flip chip is improved;

3. the silicon dioxide layer is arranged to protect the silver-plated surface, so that the brightness of the product can be improved on one hand, and the vulcanization resistance can be improved on the other hand;

4. the fluorescent powder is added in the colloid, so that the brightness of the blue LED can be improved by more than 20%.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A blue LED structure, comprising:

the bowl-shaped support is concave to form a bowl cup, and is a silicon material support which is in a positive-negative symmetrical structure;

the flip chip is arranged in the bowl cup, and a packaging layer is filled around the flip chip.

2. The blue LED structure of claim 1, wherein the silicon material support is bonded by a gold-free wire.

3. The blue LED structure according to claim 1, wherein said flip chip is soldered into said bowl by a reflow soldering process in the form of a pad and a solder ball.

4. The blue LED structure of claim 1, wherein the encapsulation layer comprises a silicon dioxide layer connecting the flip chip and the silicon material support.

5. The blue LED structure according to claim 4, wherein the encapsulant layer further comprises a gel containing phosphor.

6. A backlight module, characterized in that the backlight module comprises the blue LED structure according to any one of claims 1 to 5.

7. A display device, characterized in that the display device comprises a display panel and a backlight module according to claim 6.