CN213401196U

CN213401196U - Surface-mounted LED

Info

Publication number: CN213401196U
Application number: CN202022404944.9U
Authority: CN
Inventors: 龚文; 邵鹏睿; 隆春花
Original assignee: Suzhou Kinglight Optoelectronics Co ltd
Current assignee: Suzhou Kinglight Optoelectronics Co ltd
Priority date: 2020-10-26
Filing date: 2020-10-26
Publication date: 2021-06-08
Anticipated expiration: 2030-10-26

Abstract

The utility model relates to a surface-mounted LED, which comprises a substrate; the substrate is provided with a front circuit pad; the front circuit bonding pad is provided with an LED chip, the LED chip is fixed on the front circuit bonding pad through glue for die bonding, and an electrode of the LED chip is connected with a circuit of the substrate through a conductive lead; insulating materials are filled between the front circuit bonding pads; the height of the insulating material is l₁The height of the front circuit pad is l₂，l₁And l₂The following formula is satisfied: l₁＝l₂Or, l₁＝4/3l₂. The utility model discloses the gas tightness is good, and reliable performance is good, reduces the risk that lamp pearl became invalid at the application.

Description

Surface-mounted LED

Technical Field

The utility model relates to a LED encapsulates technical field, in particular to table pastes type LED.

Background

With the continuous improvement of indoor display application technology, the traditional display product technology gradually tops, and indoor small-distance products become the main technical expansion space in the future; because the small-spacing display screen market price is intense, the market profit is reduced, new growth points are urgently needed to be found by terminal enterprises, and the profit level is improved on the premise of meeting the product reliability.

Fig. 4 is a schematic front view, fig. 5 is a schematic cross-sectional view, and fig. 6 is a schematic back view of a conventional product. Referring to fig. 4 to 6, the conventional product includes a substrate. The substrate is provided with a front circuit pad. The front circuit bonding pad is provided with an LED chip, the LED chip is fixed on the front circuit bonding pad through glue for die bonding, and an electrode of the LED chip is connected with a circuit of the substrate through a conductive lead. However, in the conventional product, no material is filled between the front circuit pads of the substrate.

The existing product has the following defects: (1) the air tightness is poor; (2) the reliability is poor; (3) the lamp bead has a high risk of failure at the application end.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model discloses a table pastes type LED.

The utility model discloses the technical scheme who adopts as follows:

a surface-mounted LED comprises a substrate; the substrate is provided with a front circuit pad; the front circuit bonding pad is provided with an LED chip, the LED chip is fixed on the front circuit bonding pad through glue for die bonding, and an electrode of the LED chip is connected with a circuit of the substrate through a conductive lead; the front circuit bonding pads are made of insulating materialsFilling rows; the height of the insulating material is l₁The height of the front circuit pad is l₂，l₁And l₂The following formula is satisfied: l₁＝l₂Or, l₁＝4/3l₂。

The method is further technically characterized in that: the substrate is also provided with a back circuit pad; the front circuit pad and the back circuit pad are connected through a conductive hole.

The method is further technically characterized in that: the insulating material is resin.

The method is further technically characterized in that: the LED chip comprises a red light chip, a green light chip and a blue light chip; the glue for die bonding is conductive die bonding glue or die bonding insulating glue; the red light chip is fixed on the front circuit bonding pad through the conductive die bond adhesive; the green light chip and the blue light chip are fixed on the bonding pad through the die bonding insulating glue, and electrodes of the green light chip and the blue light chip are connected with a circuit of the substrate through a conductive lead.

The method is further technically characterized in that: the LED chip is further encapsulated through encapsulation glue, and the LED chip is sealed.

The method is further technically characterized in that: the surface-mounted LED is 0.6-1.0 mm in length, 0.6-1.0 mm in width and 0.5-0.8 mm in height.

The utility model has the advantages as follows:

1. the utility model discloses fill through insulating material between the positive circuit pad of base plate to height through insulating material's 1/3 that highly exceeds positive circuit pad height, be used for preventing pad metal migration and prevent the diffusion of solid crystal glue, improved the adhesion stress of LED chip and base plate.

2. The utility model discloses a embedment encapsulation is glued and is strengthened LED's gas tightness on whole base plate to make the LED product have higher reliable performance.

3. The utility model discloses the confidentiality is good, and reliable performance is good, reduces the risk that lamp pearl became invalid at the application.

Drawings

Fig. 1 is a front schematic view of the present invention.

Fig. 2 is a schematic cross-sectional view of the present invention.

Fig. 3 is a schematic back view of the present invention.

Fig. 4 is a schematic front view of a conventional product.

Fig. 5 is a schematic cross-sectional view of a conventional product.

Fig. 6 is a schematic view of the back of a conventional product.

In the figure: 1. a substrate; 2. an insulating material; 3. a front side circuit pad; 4. a conductive via; 5. glue for die bonding; 6. a red light chip; 7. a green chip; 8. a blue light chip; 9. a conductive lead; 10. packaging glue; 11. and a back circuit pad.

Detailed Description

The foregoing and other features, aspects and utilities of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Therefore, the directional terminology used is for the purpose of description and is not intended to be limiting, and moreover, like reference numerals will be used to refer to like elements throughout.

The following describes a specific embodiment of the present embodiment with reference to the drawings.

Fig. 1 is the front schematic view of the present invention, fig. 2 is the section schematic view of the present invention, and fig. 3 is the back schematic view of the present invention. Referring to fig. 1 to 3, a surface-mounted LED has a length of 0.6mm to 1.0mm, a width of 0.6mm to 1.0mm, and a height of 0.5mm to 0.8 mm. Preferably, the surface-mounted LED has the length of 1.0mm, the width of 1.0mm and the height of 0.8 mm.

A surface-mounted LED includes a substrate 1. The substrate 1 is provided with front circuit pads 3. The substrate 1 is also provided with a back surface circuit pad 11. The front circuit pads 3 and the back circuit pads 11 are connected by the conductive holes 4. The front circuit bonding pad 3 is provided with an LED chip, the LED chip is fixed on the front circuit bonding pad 3 through glue 5 for die bonding, and an electrode of the LED chip is connected with the front circuit bonding pad 3 through a conductive lead 9The circuit of the substrate 1 is connected. Insulating materials 2 are filled between the front circuit bonding pads 3, so that metal migration of the bonding pads and diffusion of die attach adhesives are prevented, and the reliability of products is improved. The height of the insulating material 2 is l₁The front circuit pad 3 has a height of l₂，l₁And l₂The following formula is satisfied: l₁＝l₂Or, l₁＝4/3l₂. In this example,/₁＝4/3l₂. The insulating material 2 is resin, and the color of the insulating material is black or green.

The LED chips include a red chip 6, a green chip 7, and a blue chip 8. The glue 5 for die bonding is conductive die bonding glue or die bonding insulating glue. The red light chip 6 is fixed on the front circuit pad 3 through conductive die bond glue. The green chip 7 and the blue chip 8 are fixed on the bonding pad through die bonding insulating glue, and the electrodes of the green chip 7 and the blue chip 8 are connected with the circuit of the substrate 1 through a conductive lead 9. The LED chip is encapsulated by encapsulation glue 10 to seal the LED chip.

The utility model discloses an installation principle as follows:

the utility model discloses fill through insulating material between positive circuit pad 3 for prevent pad metal migration and prevent the diffusion of solid crystal glue, improved the adhesion stress of chip and base plate. Meanwhile, the encapsulation glue 10 is filled and sealed on the substrate 1 to enhance the air tightness of the LED, so that the LED product has higher reliability.

In the description of the embodiments of the present invention, it should be further noted that unless explicitly stated or limited otherwise, the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The above description is for the purpose of explanation and not limitation of the invention, which is defined in the claims, and any modifications may be made without departing from the basic structure of the invention.

Claims

1. A surface-mounted LED is characterized in that: comprising a substrate (1); the substrate (1) is provided with a front circuit pad (3); the front circuit bonding pad (3) is provided with an LED chip, the LED chip is fixed on the front circuit bonding pad (3) through glue (5) for die bonding, and an electrode of the LED chip is connected with a circuit of the substrate (1) through a conductive lead (9); the front circuit pads (3) are filled with insulating materials (2); the height of the insulating material (2) is l₁The height of the front circuit pad (3) is l₂，l₁And l₂The following formula is satisfied: l₁＝l₂Or, l₁＝4/3l₂。

2. The surface-mounted LED structure of claim 1, wherein: the substrate (1) is also provided with a back circuit pad (11); the front circuit pad (3) and the back circuit pad (11) are connected through a conductive hole (4).

3. The surface-mounted LED structure of claim 1, wherein: the insulating material (2) is resin.

4. The surface-mounted LED structure of claim 1, wherein: the LED chips comprise a red light chip (6), a green light chip (7) and a blue light chip (8); the glue (5) for die bonding is conductive die bonding glue or die bonding insulating glue; the red light chip (6) is fixed on the front circuit bonding pad (3) through the conductive die bond adhesive; the green light chip (7) and the blue light chip (8) are fixed on the bonding pad through the die bonding insulating glue, and electrodes of the green light chip (7) and the blue light chip (8) are connected with a circuit of the substrate (1) through a conductive lead (9).

5. The surface-mount LED structure according to claim 1 or 4, wherein: the LED chip is further encapsulated by encapsulation glue (10) to seal the LED chip.

6. The surface-mounted LED structure of claim 1, wherein: the surface-mounted LED is 0.6-1.0 mm in length, 0.6-1.0 mm in width and 0.5-0.8 mm in height.