CN218568869U - LED support and LED packaging structure - Google Patents

Abstract

The utility model relates to a LED support and LED packaging structure, the LED support, it includes: the cup body is provided with a cup cavity and a cup bottom, and a first bonding pad and a second bonding pad; the cup body is provided with a first side surface and a second side surface which are opposite; the cup bottom is provided with a first bonding pad and a second bonding pad which are used for being respectively connected with different polarities; the first pad includes: the cup comprises a first bending part, a first bottom and a first connecting part, wherein the first connecting part is connected between the first bending part and the first bottom, and the first bending part is bent and abutted against the first side face and the cup bottom; the second pad includes: the second bending part is connected between the second bending part and the second bottom, and the second bending part is bent and abutted against the second side face and the cup bottom; an isolation strip is arranged between the first bonding pad and the second bonding pad. The utility model provides an adoption of LED support has improved the power of bending of pad with the design that two pads were bent.

Description

LED support and LED packaging structure

Technical Field

The utility model belongs to the technical field of the photoelectric technology and specifically relates to a LED support and LED packaging structure.

Background

The Light Emitting Diode (LED) lamp bead is an LED for short for English abbreviation of a Light Emitting Diode, and is widely applied to the production fields of lighting illumination, LED large screen display, traffic lights, decoration, computers, electronic toy gifts, switches, telephones, advertisements, urban Light engineering and the like.

The thick LED lamp pearl of current 2835/1.1 after the lamp area is made, often can appear: and after the lamp strip is bent, the bonding pad of the lamp bead falls off. The main reason is that the support pad of current 2835/1.1 thick LED lamp pearl is little, and thickness is thin, and the pad drops from the support very easily under the power of bending that receives external force, leads to the lamp that the lamp pearl dies.

Accordingly, there is a need for improvements and developments in the art.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the utility model provides a LED support and LED packaging structure to solve current LED lamp pearl and make the lamp area after bending, the lamp pearl pad drops from the support easily and leads to the problem of the lamp of lamp pearl dying.

The utility model discloses a following technical scheme realizes: an LED support, comprising: the cup body is provided with a cup cavity and a cup bottom, and a first bonding pad and a second bonding pad;

the cup body is provided with a first side surface and a second side surface which are opposite;

the cup bottom is provided with a first bonding pad and a second bonding pad which are used for being respectively connected with different polarities;

the first pad includes: the cup comprises a first bending part, a first connecting part and a first bottom, wherein the first connecting part is connected between the first bending part and the first bottom, and the first bending part is bent and abutted against the first side face and the cup bottom;

the second pad includes: the second bending part is connected between the second bending part and the second bottom, and the second bending part is bent and abutted against the first side face and the cup bottom;

an isolation strip is arranged between the first bonding pad and the second bonding pad.

The utility model discloses a further setting, the median includes: the projection part is respectively connected with the first isolation part and the second isolation part;

the first isolation part is connected with the first bonding pad;

the second isolation part is connected with the second bonding pad;

wherein, the middle of the convex part is raised, and two sides are step-shaped.

In a further arrangement of the utility model, the first side surface is provided with a first socket, and the first socket penetrates through the first side surface and the cup cavity;

the second side is provided with a second socket which penetrates through the second side and the cup cavity.

The utility model discloses a further setting, first connecting portion with first socket is connected.

The utility model discloses a further setting, the second connecting portion with the second socket is connected.

The utility model discloses a further setting, first pad and second pad are the heat conduction copper sheet.

The utility model discloses a further setting, the cup is the cup that the PPA plastic was made.

An LED package structure, comprising: the LED bracket and the LED chip are arranged in the cup cavity;

the positive level of the LED chip is electrically connected with the first bonding pad, and the negative pole of the LED chip is electrically connected with the second bonding pad.

The utility model has the advantages that:

the utility model discloses a two pads of LED support all have the portion of bending, adopt the design of bending two pads, improved the power of bending of pad and the laminating nature of pad and cup for the pad is difficult to drop from the support.

Drawings

Fig. 1 is a schematic structural diagram of the LED bracket of the present invention.

Fig. 2 is a schematic bottom structure view of fig. 1.

Fig. 3 is a schematic structural view of the first and second pads of fig. 1.

Fig. 4 is a side view of fig. 1.

Fig. 5 is a structural relationship diagram of the first socket of fig. 1.

Fig. 6 is a schematic structural view of the other side of fig. 1.

Fig. 7 is a structural relationship diagram of the second socket of fig. 1.

Fig. 8 is a schematic structural view of the isolation belt of fig. 1.

Fig. 9 is a schematic view of the LED package structure of the present invention.

Description of the main elements

LED support 100

Cup body 10

Cup cavity 11

Cup bottom 12

First side 13

First jack 131

Second side 14

Second socket 141

First bonding pad 20

First bent portion 21

First bottom 22

First connection portion 23

Second bonding pad 30

Second bent portion 31

Second bottom 32

Second connection part 33

Isolation belt 40

Convex part 41

First isolation portion 42

Second isolation portion 43

LED chip 50

Fluorescent glue 60

LED package structure 200

Detailed Description

The utility model provides a LED support and LED packaging structure is applicable to the photoelectric technology field, other fields such as also can be applicable to illumination, LED, for making the utility model discloses a purpose, technical scheme and effect are clearer, make clear and definite, and it is right to refer to the drawing and to lift the example below the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the embodiments and claims, the terms "a" and "an" can mean "one or more" unless the article is specifically limited.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Examples

Referring to fig. 1 to fig. 3, the present invention provides an LED bracket 100, including: a cup body 10 with a cup cavity 11 and a cup bottom 12, a first pad 20 and a second pad 30 are provided. The structural principle of the LED support 100 in this embodiment is as follows:

cup 10 has opposing first and second sides 13 and 14; the submount 12 is provided with first pads 20 and second pads 30 for accessing different polarities, respectively. The first pad 20 includes: the cup comprises a first bending part 21, a first bottom part 22 and a first connecting part 23, wherein the first connecting part 23 is connected between the first bending part 21 and the first bottom part 22, and the first bending part 21 is bent to abut against the first side surface 13 and the cup bottom 12. The second pad 30 includes: a second bending portion 31, a second bottom portion 32 and a second connecting portion 33, wherein the second connecting portion 33 is connected between the second bending portion 31 and the second bottom portion 32, and the second bending portion 31 is bent to contact the second side surface 14 and the cup bottom 12. A separation tape 40 is disposed between the first pad 20 and the second pad 30. The first bonding pad 20 and the second bonding pad 30 are respectively provided with a first bending part 21 and a second bending part 31, and the first bonding pad 20 and the second bonding pad 30 adopt a bonding pad bending design, so that the effect of improving the bending force of the two bonding pads is achieved. The two bonding pads are respectively bent and abutted to the outer surface of the support, the first bending portion 21 is bent and abutted to the first side face 13 and the cup bottom 12, and the second bending portion 31 is bent and abutted to the second side face 14 and the cup bottom 12, so that the effect of improving the attaching performance of the bonding pads and the support is achieved. Therefore, even when the LED holder 100 is bent, the first pads 20 and the second pads 30 are not easily detached from the outer surface of the cup 10.

The LED support in this embodiment may be a Surface Mounted Device (SMD) support, or may be an LED support of other packaging methods. Meanwhile, the LED lamp beads manufactured by adopting the LED support structure and the SMD packaging mode in the embodiment are particularly suitable for the LED soft lamp strip which is easy to bend due to the fact that the LED lamp beads have high strength and good structural stability.

Optionally, the cup body 10 is a cup body 10 made of PPA plastic structure.

Referring to fig. 1, fig. 2, fig. 4 and fig. 5, the first side 13 is provided with a first inserting hole 131, and the first inserting hole 131 penetrates through the first side 13 and the cup cavity 11; with continued reference to fig. 1, 2, 6 and 7, the second side 14 is provided with a second socket 141, and the second socket 141 extends through the first side 14 and the cup cavity 11. Wherein, the first bending part 21 is connected with the first socket 131; the second bent portion 31 is connected to the second socket 141. The bending parts of the two bonding pads, namely the first bending part 21 and the second bending part 31 are respectively connected with the first socket 131 and the second socket 141, so that the first bonding pad 20 and the second bonding pad 30 are not easy to fall off from the outer surface of the cup body 10, and the effect of further increasing the bonding performance of the bonding pads and the support is achieved.

The first bending part 21 is bent to abut against the first side surface 13 and the cup bottom 12, and the first connecting part 23 is connected with the first inserting hole 131, so that the first bonding pad 20 wraps most of the area of the first side surface 13 and part of the area of the base 12, the bonding property of the first bonding pad 20 and the plastic support is improved, and the effect of improving the bending force of the first bonding pad 20 is achieved; the second bending portion 31 is bent to abut against the second side surface 14 and the cup bottom 12, and the second connecting portion 33 is connected with the second inserting hole 141, so that the second bonding pad 30 wraps most of the area of the second side surface 14 and part of the area of the cup bottom 12, the adhesion between the second bonding pad 30 and the plastic support is improved, and the effect of improving the bending force of the second bonding pad 30 is achieved. Therefore, after the LED support 100 is bent, the first bonding pad 20 and the second bonding pad 30 are not easily detached from the outer surface of the cup 10, and the LED support is particularly suitable for a flexible LED strip.

In addition, with reference to fig. 2, the first bonding pad 20 and the second bonding pad 30 are heat conductive copper sheets. Therefore, the arrangement of the first bottom 22 and the second bottom 32 enables the cup bottom 12 of the LED support 10 to be provided with a bottom pad, so that the heat dissipation and welding effects can be achieved, and the effect of increasing the bending force of the pad can be achieved on the premise of maintaining the working power.

Referring to fig. 9, the present invention provides an LED package structure 200, which includes an LED support 10 and an LED chip 50 disposed in a cup cavity 11, in this embodiment, the LED chip 50 is a single LED chip, and in other embodiments, the LED chip 50 may also be a plurality of LED chips. The working principle of the LED package structure 200 is as follows:

the LED chip 50 is horizontally placed in the cup cavity 11, and the anode of the LED chip 50 is electrically connected with the first bonding pad 20; the cathode of the LED chip 50 is electrically connected to the second pad 30. Specifically, the positive stage of the LED chip 50 is wire bonded to the first pad 20, and the negative stage of the LED chip 50 is wire bonded to the second pad 30. And, the LED chip 50 is packaged in the cup cavity 11 by using fluorescent glue 60.

Referring to fig. 3, 8 and 9, the isolation strip 40 includes: the projection part 41, the first isolation part 42 and the second isolation part 43, wherein the projection part 41 is respectively connected with the first isolation part 42 and the second isolation part 43; the first isolation portion 42 is connected to the first pad 20; the second isolation portion 43 is connected to the second pad 30; wherein, the middle of the convex part 41 is raised, and the two sides are step-shaped. The isolation strip 40 is made of an insulating PPA plastic material, and the isolation strip 40 is disposed between the first pad 20 and the second pad 30 to isolate the first pad 20 from the second pad 30. The middle part of the convex part 41 of the isolation belt 40 is raised, and the two sides are designed in a step shape, so that the combination area of the LED support 100 and the fluorescent glue 60 can be increased, and the effect of increasing the combination force of the LED support 100 and the fluorescent glue 60 is achieved. The condition that the LED bracket 100 is layered with the fluorescent glue 60 to lead to a dead lamp in the using process is avoided.

To sum up, the utility model provides a pair of LED support and LED packaging structure has following beneficial effect:

the utility model discloses a two pads of LED support all have the portion of bending, adopt the design of bending two pads, improved the power of bending of pad and the laminating nature of pad and cup, reach that the pad is difficult to drop from the support, and, work as the utility model discloses a LED packaging structure makes the soft lamp area of LED of easily bending after, the effect that the pad drops in also being difficult to follow LED packaging structure, the soft lamp area of LED of specially adapted easily bending.

Further, the utility model discloses the bottom of cup of LED support is provided with the bottom pad, can reach heat dissipation and welded effect for the effect of increase pad power of bending has been reached under the prerequisite that has kept operating power.

Furthermore, the utility model discloses the median to in the LED support has adopted special design, raises the middle of the bellying of median, and both sides are the step shape. The bonding area of the cup bottom of the high LED bracket and the fluorescent glue is increased, and the effect of increasing the bonding force of the LED bracket and the fluorescent glue is achieved. Avoid in-process using, appear LED support and fluorescent glue layering, lead to the condition of dead lamp.

It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims (8)

1. An LED support, comprising: the cup body is provided with a cup cavity and a cup bottom, and a first bonding pad and a second bonding pad;

the cup body is provided with a first side surface and a second side surface which are opposite;

the cup bottom is provided with a first bonding pad and a second bonding pad which are used for being respectively connected with different polarities;

the first pad includes: the cup comprises a first bending part, a first bottom and a first connecting part, wherein the first connecting part is connected between the first bending part and the first bottom, and the first bending part is bent and abutted against the first side face and the cup bottom;

the second pad includes: the second bending part is connected between the second bending part and the second bottom, and the second bending part is bent and abutted against the second side face and the cup bottom;

an isolation strip is arranged between the first bonding pad and the second bonding pad.

2. The LED holder according to claim 1, wherein the isolation strip comprises: the projection part is respectively connected with the first isolation part and the second isolation part;

the first isolation part is connected with the first bonding pad;

the second isolation part is connected with the second bonding pad;

the middle of the protruding portion is raised, and two sides of the protruding portion are step-shaped.

3. The LED holder according to claim 1, wherein the first side is provided with a first socket that extends through the first side and the cup cavity;

the second side is provided with a second socket which penetrates through the second side and the cup cavity.

4. The LED cradle of claim 3, wherein the first connection portion connects with the first socket.

5. The LED holder according to claim 3, wherein the second connecting portion connects with the second socket.

6. The LED holder of claim 1, wherein the first and second pads are each a thermally conductive copper sheet.

7. The LED cradle of claim 1, wherein the cup is a PPA plastic cup.

8. An LED package structure, comprising: the LED support of any of claims 1 to 7, and an LED chip disposed within the cup cavity;

the positive level of the LED chip is electrically connected with the first bonding pad, and the negative pole of the LED chip is electrically connected with the second bonding pad.

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