CN219017691U - LED support and LED packaging lamp bead - Google Patents
LED support and LED packaging lamp bead Download PDFInfo
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- CN219017691U CN219017691U CN202223120074.8U CN202223120074U CN219017691U CN 219017691 U CN219017691 U CN 219017691U CN 202223120074 U CN202223120074 U CN 202223120074U CN 219017691 U CN219017691 U CN 219017691U
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Abstract
The utility model relates to the technical field of LED (light-emitting diode) luminescence, in particular to an LED bracket and an LED packaging lamp bead, wherein the LED bracket is used for packaging an LED chip and comprises a base and a bonding pad, and the base is arranged on the bonding pad and forms a reflecting cup with an opening with the bonding pad; the bonding pad comprises an anode bonding pad and a cathode bonding pad, a spacer is arranged between the anode bonding pad and the cathode bonding pad, one face, which faces the opening, of the anode bonding pad is defined to be the front face, one face, which faces the opening, of the spacer is defined to be the spacer face, the spacer face and the front face are staggered to form a concave shape, namely, the spacer face and the anode bonding pad are separated by a distance to avoid the situation that the spacer contacts an LED chip to influence welding, good electrical isolation is achieved, short circuit or electric leakage is prevented, reliability of a product is improved, practicability of a user is improved, the LED chip is packaged by using a flip chip, electric connection is formed by welding between the flip chip and the bonding pad, bonding wires are not needed to be welded, and the problem that the bonding wires influence electric failure is avoided.
Description
[ field of technology ]
The utility model relates to the technical field of LED (light-emitting diode) lighting, in particular to an LED bracket and an LED packaging lamp bead.
[ background Art ]
Along with the increasingly mature and developed LED lighting technology, LEDs become a novel light source and are widely applied to various fields, LED chips are required to be attached to an LED bracket by a manufacturing process of an LED lamp, and are prepared into LED lamp beads through packaging, however, at present, the traditional LED lamp beads are positively mounted chips, bonding wires are required to be electrically connected, bonding failure points are more, the reliability of the LED lamp beads is easily affected, and therefore, the problem of bonding wires is solved by the flip chip packaging technology in the market. The traditional injection molding bracket is adopted in the existing flip chip packaging, but the resin of GAP between the positive electrode bonding pad and the negative electrode bonding pad in the traditional injection molding bracket is slightly higher than the bonding pad plane, so that the chip is easy to jack up, and poor welding is caused.
[ utility model ]
The utility model provides an LED bracket and an LED packaging lamp bead for solving the technical problem of poor welding between a chip and a bonding pad.
The utility model provides an LED bracket for packaging an LED chip, which comprises a base and a bonding pad, wherein the base is arranged on the bonding pad and forms a reflecting cup with an opening with the bonding pad;
the bonding pad comprises an anode bonding pad and a cathode bonding pad, a spacer is arranged between the anode bonding pad and the cathode bonding pad, one surface of the anode bonding pad and one surface of the cathode bonding pad, which faces the opening, are defined as a front surface, one surface of the spacer, which faces the opening, is defined as a spacing surface, and the spacing surface and the front surface are staggered to form a concave shape.
Preferably, the distance between the plane of the spacing surface and the plane of the front surface is 1-35um.
Preferably, the ratio of the distance between the plane where the spacing surface is located and the plane where the front surface is located to the height of the bonding pad is in the range of 1:100-7:60.
Preferably, the cross section of the spacer is in a shape of a Chinese character 'yang'.
Preferably, the reflecting cup comprises a first step and a second step, the first step is arranged at an opening of the reflecting cup far away from the front surface, one end of the reflecting cup, which faces the front surface, is defined as a bottom, and the second step is arranged at the bottom.
Preferably, a slope is formed between the first step and the second step, and the angle of the slope ranges from 40 degrees to 70 degrees.
Preferably, the length of the spacing surface coincides with the width of the bottom, and the width of the spacing surface ranges from 60 um to 230um.
Preferably, the vertical height of the reflecting cup ranges from 0.4 to 0.8mm.
The utility model provides an LED packaging lamp bead, which comprises an LED chip, a packaging adhesive layer and the LED bracket, wherein the LED chip is arranged in the reflecting cup, and the height of the LED chip is smaller than the vertical height of the reflecting cup.
Preferably, the packaging adhesive layer is filled in the reflecting cup, and the height of the packaging adhesive layer is consistent with the vertical height of the reflecting cup.
Compared with the prior art, the LED bracket and the LED packaging lamp bead provided by the utility model have the following advantages:
1. the LED bracket provided by the embodiment of the utility model is used for packaging an LED chip and comprises a base and a bonding pad, wherein the base is arranged on the bonding pad and forms a reflecting cup with an opening with the bonding pad; the bonding pad comprises an anode bonding pad and a cathode bonding pad, a spacer is arranged between the anode bonding pad and the cathode bonding pad, the surface, which faces the opening, of the spacer is defined to be the front surface, the surface, which faces the opening, of the spacer is defined to be the spacing surface, the spacing surface and the front surface are staggered to form a concave shape, namely, the heights of the anode bonding pad and the cathode bonding pad are equal, one end, which is close to the LED chip, of the spacer is sunken downwards, between the anode bonding pad and the cathode bonding pad, the spacer can be prevented from contacting the LED chip to influence the welding, good electrical isolation can be realized, short circuit or electric leakage can be prevented, the reliability of a product is improved, the practicability of a user is improved, in addition, the LED chip is packaged by using a flip chip, electric connection is formed by welding between the flip chip and the bonding pad, bonding wire is not needed to be welded, and the problem that the bonding wire influences electric failure is avoided.
2. The distance between the plane where the spacing surface is located and the plane where the front surface is located is 1-35um, the ratio of the distance between the plane where the spacing surface is located and the plane where the front surface is located and the height of the bonding pad is 1:100-7:60, the arrangement further ensures that the spacer cannot contact the chip to influence the welding, and meanwhile, the connection strength between the spacer and the bonding pad of the positive electrode and the bonding pad of the negative electrode is also ensured.
3. The cross section of the isolation piece provided by the embodiment of the utility model is in the shape of the Chinese character 'tu', the bonding area between the isolation piece and the bonding pad is increased by the arrangement, the bonding firmness between the isolation piece and the bonding pad is further ensured, the sealing performance of the LED bracket is enhanced by the design of the Chinese character 'tu', and the condition that the service life of a product is influenced due to oxidation of a welding part caused by air entering from the position of the isolation piece is avoided.
4. The reflecting cup provided by the embodiment of the utility model comprises the first step and the second step, wherein the first step is arranged at the opening of the reflecting cup far away from the front surface, one end of the reflecting cup facing the front surface is defined as the bottom, the second step is arranged at the bottom, a slope section is formed between the first step and the second step, the angle range of the slope section is 40-70 degrees, the light emitted by the LED chip is reflected to the middle part through the reflecting cup to emit light, the reflection light-emitting rate of the reflecting cup is further improved through the arrangement of the slope section, the light-emitting is more uniform, the brightness of the whole product is improved, and the visual effects of users with different angles are improved.
5. The length of the spacing surface is coincident with the width of the bottom, the width of the spacing surface ranges from 60 um to 230um, the arrangement is beneficial to the welding of the LED chip, and the production and the processing of the LED bracket are facilitated through the coincidence of the length of the spacing surface and the width of the bottom.
6. The vertical height range of the reflection cup provided by the embodiment of the utility model is 0.4-0.8mm, the bonding pad is electrically connected with the base, and the height of the reflection cup is set to be beneficial to improving the strength and stability of the LED bracket, and meanwhile, the heat dissipation area is increased, and the heat dissipation efficiency is improved.
7. The utility model also provides an LED packaging lamp bead, which comprises an LED chip, a packaging adhesive layer and the LED bracket, wherein the LED chip is arranged in the reflecting cup, the height of the LED chip is smaller than the vertical height of the reflecting cup, the LED chip is convenient to package so as to realize the protection of the LED chip, the light emitting reflection effect of the LED chip is prevented from being influenced by the vertical height of the LED chip which is larger than the vertical height of the reflecting cup, and the brightness of the whole LED packaging lamp bead is improved.
8. The packaging adhesive layer provided by the embodiment of the utility model is filled in the reflecting cup, the height of the packaging adhesive layer is consistent with the vertical height of the reflecting cup, the packaging adhesive layer is prevented from being exposed out of the reflecting cup and being influenced by external force to protect the packaging adhesive layer, the condition of influencing the structural installation except the LED packaging lamp beads is avoided, and the structural stability is improved.
[ description of the drawings ]
Fig. 1 is a schematic structural view of an LED support according to a first embodiment of the present utility model.
Fig. 2 is a schematic cross-sectional structure of a packaged LED chip of an LED holder according to a first embodiment of the present utility model.
Fig. 3 is an exemplary view of an optical path of a packaged LED chip of an LED holder according to a first embodiment of the present utility model.
Fig. 4 is a schematic top view of an LED support according to a first embodiment of the present utility model.
Fig. 5 is a schematic block diagram of an LED package lamp bead according to a second embodiment of the present utility model.
Fig. 6 is a schematic cross-sectional view of an LED package lamp bead according to a second embodiment of the present utility model.
The attached drawings are used for identifying and describing:
1. an LED bracket; 2. LED encapsulation lamp beads;
10. a base; 11. a bonding pad; 12. a reflective cup; 20. an LED chip; 21. packaging adhesive layers;
100. a notch; 110. a positive electrode pad; 111. a negative electrode pad; 112. a spacer; 120. a first step; 121. a second step; 122. a slope section;
1100. a front face; 1120. a spacer surface; 1200. and a bottom.
[ detailed description ] of the utility model
For the purpose of making the technical solution and advantages of the present utility model more apparent, the present utility model will be further described in detail below with reference to the accompanying drawings and examples of implementation. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It should be noted that the terms "first" and "second" and the like in the description and the claims of the present utility model are used for distinguishing between different objects and not for describing a particular sequential order.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present utility model will be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1 and 2, a first embodiment of the present utility model provides an LED support 1 for packaging an LED chip 20, which includes a submount 10 and a bonding pad 11, wherein the submount 10 is disposed on the bonding pad 11 and forms a reflective cup 12 with an opening with the bonding pad 11.
As an optional implementation mode, the surface of the bonding pad 11 of the LED bracket 1 is plated with tin, the arrangement meets the technological requirements of thickness and flatness, good basic conditions are provided for the subsequent welding process, the production efficiency of products can be improved, the products can be ensured to be prevented from being corroded in alkaline corrosive liquid, the product yield is increased, and the technological production cost is reduced.
Further, the bonding pad 11 includes a positive bonding pad 110 and a negative bonding pad 111, a spacer 112 is disposed between the positive bonding pad 110 and the negative bonding pad 111, a surface defining the positive bonding pad 110 and the negative bonding pad 111 facing the opening is a front surface 1100, a surface defining the spacer 112 facing the opening is a spacing surface 1120, the spacing surface 1120 is staggered with the front surface 1100 to form a concave shape, that is, one end of the spacer 112, which is close to the LED chip 20, is flush with the height of the positive bonding pad 110 and the negative bonding pad 111, and is recessed downwards, so that the spacer 112 can be prevented from contacting the LED chip 20 to affect the bonding, and better electrical isolation can be realized, short circuit or electric leakage can be prevented, the reliability of the product can be increased, and the practicability of a user can be improved.
Further, the distance h between the plane of the spacing surface 1120 and the plane of the front surface 1100 1 (h as shown in FIG. 2) 1 ) Ranging from 1 to 35um, and the distance h between the plane of the spacing surface 1120 and the plane of the front surface 1100 1 And height h of land 11 2 (h as shown in FIG. 2) 2 ) The ratio of 1:100-7:60, this arrangement further ensures that the separator 112 does not contact the LED chip 20 to affect soldering, while also ensuring the strength of the connection between the separator 112 and the positive and negative electrode pads 110 and 111.
Alternatively, the height h of the bonding pad 11 2 In the range of 0.1-0.3mm, and correspondingly, the spacing h between the plane of the spacer surface 1120 and the plane of the front surface 1100 1 Ranging from 1 um to 35um, which can define a distance h between the plane of the spacer surface 1120 and the plane of the front surface 1100 1 Height h lower than the bonding pad 11 2 The spacer 112 is prevented from lifting up the LED chip 20, causing poor soldering.
Further, the cross section of the spacer 112 is in a shape of a 'convex', the bonding area between the spacer 112 and the bonding pad 11 is increased, the bonding firmness between the spacer and the bonding pad 11 is further ensured, the sealing performance of the LED bracket 1 is enhanced through the design of the 'convex', and the condition that the service life of a product is influenced due to oxidation of a welding part caused by air entering from the position of the spacer 112 is avoided.
As an alternative embodiment, the base 10 is provided with a notch 100 for distinguishing the mounting direction of the LED support 1.
Specifically, one end of the base 10, which is close to the bonding pad 11, is relatively protruded, in the actual design process of the LED support 1, each LED chip 20 corresponds to one LED support 1 for processing, in the processing process, the LED supports 1 are connected together until the finished product is cut off, and this arrangement is beneficial to improving the production efficiency of the LED supports 1 and reducing the production cost of the process.
Referring to fig. 3, further, the reflective cup 12 includes a first step 120 and a second step 121, the first step 120 is disposed at an opening of the reflective cup 12 away from the front 1100, the end of the reflective cup 12 facing the front 1100 is defined as a bottom 1200, and the second step 121 is disposed at the bottom 1200.
Further, a slope section 122 is formed between the first step 120 and the second step 121, the angle range of the slope section 122 is 40 ° -70 °, preferably, the angle of the slope section 122 is 45 °, the arrangement makes the light emitted by the LED chip 20 reflected to the middle part to emit light through the reflecting cup 12, the reflection light-emitting rate of the reflecting cup 12 is further improved through the arrangement of the slope section 122, the light-emitting is more uniform, the brightness of the whole product is improved, and the visual effect of users with different angles is improved.
Specifically, the light emitted by the LED chip 20 corresponding to the opening of the reflective cup 12 is emitted vertically, and the light emitted by the side is reflected by the slope section 122 of the reflective cup 12 and then is concentrated to the middle part of the reflective cup 12 to be emitted, so that the brightness of the product is improved, and the user experience is improved due to the fact that the setting of the slope section 122 meets the requirements of users at different angles.
Further, the vertical height h of the reflector cup 12 3 (h as shown in FIG. 3) 3 ) In the range of 0.4-0.8mm, preferably the vertical height h of the reflector cup 12 3 For 0.6mm, this setting makes when guaranteeing electric connection between pad 11 and the base 10, can also improve the intensity and the stability of LED support 1, has increased heat radiating area simultaneously, has improved radiating efficiency.
Specifically, the heat is gathered when the LED chip 20 emits light, and the heat can be assisted to be guided to the position beyond the LED chip 20 through the arrangement of the reflecting cup 12, so that the accumulation of the heat is reduced, the heat generated when the LED chip 20 emits light can be effectively emitted, and the luminous efficiency of the product is further improved.
Please further refer to fig. 3 and 4, the length l of the spacing surface 1120 1 (l as shown in FIG. 4) 1 ) Width l of bottom 1200 2 (l as shown in FIG. 4) 2 ) Width l of the partition 1120 3 (l as shown in FIG. 4) 3 ) The dimension is in the range of 60-230um, which facilitates the soldering of the LED chip 20 by the length l of the spacer surface 1120 1 Width l of bottom 1200 2 The superposition is convenient for the production and processing of the LED bracket 1.
Referring to fig. 5 and 6, a second embodiment of the present utility model provides an LED package lamp bead 2, which includes an LED chip 20, a package adhesive layer 21, and an LED support 1 provided in the first embodiment of the present utility model, wherein the LED chip 20 is disposed in a reflective cup 12.
As an alternative embodiment, the LED chip 20 is packaged with the LED support 1 by using a flip chip, and the flip chip and the bonding pad 11 are soldered to form an electrical connection, so that bonding wires are not needed for soldering, and the problem that the bonding wires affect electrical failure is avoided.
It will be appreciated that the LED chip is soldered to the bonding pad 11 by wire bonding, the die to be connected is electrically upward, and the flip chip is electrically downward, so that electrical connection is formed between the flip chip and the bonding pad 11, and no bonding wire is required for soldering, so that the performance of the LED chip 20 is more stable.
Further, the height h of the LED chip 20 4 (h as shown in FIG. 6) 4 ) Less than the vertical height h of the reflector cup 12 3 This arrangement facilitates packaging of the LED chip 20 to achieve protection of the LED chip 20, and avoids the height h of the LED chip 20 4 Greater than the vertical height h of the reflector cup 12 3 The light-emitting reflection effect of the LED chip 20 is affected, and the brightness of the whole LED packaging lamp bead 2 is improved.
Further, the reflective cup 12 is filled with the encapsulation adhesive layer 21, and the height h of the encapsulation adhesive layer 21 5 (h as shown in FIG. 6) 5 ) Vertical height h from reflector cup 12 3 The LED packaging lamp beads are kept consistent, the packaging adhesive layer 21 is prevented from being exposed out of the reflecting cup 12 and is affected by external force to protect the packaging adhesive layer 21, the structural installation except the LED packaging lamp beads 2 is prevented from being affected, and the structural stability is improved.
Preferably, the material of the encapsulation adhesive layer 21 includes, but is not limited to, transparent adhesive, fluorescent adhesive, etc., and it is understood that the encapsulation adhesive layer 21 has the effect of preventing the oxidation of the internal structure, ensures the service life of the LED encapsulation lamp bead 2 to be longer, and can protect the LED chip 20 from external force to work normally.
Compared with the prior art, the LED bracket and the LED packaging lamp bead provided by the utility model have the following advantages:
1. the LED bracket provided by the embodiment of the utility model is used for packaging an LED chip and comprises a base and a bonding pad, wherein the base is arranged on the bonding pad and forms a reflecting cup with an opening with the bonding pad; the bonding pad comprises an anode bonding pad and a cathode bonding pad, a spacer is arranged between the anode bonding pad and the cathode bonding pad, the surface, which faces the opening, of the spacer is defined to be the front surface, the surface, which faces the opening, of the spacer is defined to be the spacing surface, the spacing surface and the front surface are staggered to form a concave shape, namely, the heights of the anode bonding pad and the cathode bonding pad are equal, one end, which is close to the LED chip, of the spacer is sunken downwards, between the anode bonding pad and the cathode bonding pad, the spacer can be prevented from contacting the LED chip to influence the welding, good electrical isolation can be realized, short circuit or electric leakage can be prevented, the reliability of a product is improved, the practicability of a user is improved, in addition, the LED chip is packaged by using a flip chip, electric connection is formed by welding between the flip chip and the bonding pad, bonding wire is not needed to be welded, and the problem that the bonding wire influences electric failure is avoided.
2. The distance between the plane where the spacing surface is located and the plane where the front surface is located is 1-35um, the ratio of the distance between the plane where the spacing surface is located and the plane where the front surface is located and the height of the bonding pad is 1:100-7:60, the arrangement further ensures that the spacer cannot contact the chip to influence the welding, and meanwhile, the connection strength between the spacer and the bonding pad of the positive electrode and the bonding pad of the negative electrode is also ensured.
3. The cross section of the isolation piece provided by the embodiment of the utility model is in the shape of the Chinese character 'tu', the bonding area between the isolation piece and the bonding pad is increased by the arrangement, the bonding firmness between the isolation piece and the bonding pad is further ensured, the sealing performance of the LED bracket is enhanced by the design of the Chinese character 'tu', and the condition that the service life of a product is influenced due to oxidation of a welding part caused by air entering from the position of the isolation piece is avoided.
4. The reflecting cup provided by the embodiment of the utility model comprises the first step and the second step, wherein the first step is arranged at the opening of the reflecting cup far away from the front surface, one end of the reflecting cup facing the front surface is defined as the bottom, the second step is arranged at the bottom, a slope section is formed between the first step and the second step, the angle range of the slope section is 40-70 degrees, the light emitted by the LED chip is reflected to the middle part through the reflecting cup to emit light, the reflection light-emitting rate of the reflecting cup is further improved through the arrangement of the slope section, the light-emitting is more uniform, the brightness of the whole product is improved, and the visual effects of users with different angles are improved.
5. The length of the spacing surface is coincident with the width of the bottom, the width of the spacing surface ranges from 60 um to 230um, the arrangement is beneficial to the welding of the LED chip, and the production and the processing of the LED bracket are facilitated through the coincidence of the length of the spacing surface and the width of the bottom.
6. The vertical height range of the reflection cup provided by the embodiment of the utility model is 0.4-0.8mm, the bonding pad is electrically connected with the base, and the height of the reflection cup is set to be beneficial to improving the strength and stability of the LED bracket, and meanwhile, the heat dissipation area is increased, and the heat dissipation efficiency is improved.
7. The utility model also provides an LED packaging lamp bead, which comprises an LED chip, a packaging adhesive layer and the LED bracket, wherein the LED chip is arranged in the reflecting cup, the height of the LED chip is smaller than the vertical height of the reflecting cup, the LED chip is convenient to package so as to realize the protection of the LED chip, the light emitting reflection effect of the LED chip is prevented from being influenced by the vertical height of the LED chip which is larger than the vertical height of the reflecting cup, and the brightness of the whole LED packaging lamp bead is improved.
8. The packaging adhesive layer provided by the embodiment of the utility model is filled in the reflecting cup, the height of the packaging adhesive layer is consistent with the vertical height of the reflecting cup, the packaging adhesive layer is prevented from being exposed out of the reflecting cup and being influenced by external force to protect the packaging adhesive layer, the condition of influencing the structural installation except the LED packaging lamp beads is avoided, and the structural stability is improved.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the utility model, but any modifications, equivalents, improvements, etc. within the principles of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. An LED support for packaging an LED chip, characterized in that: the substrate comprises a substrate and a bonding pad, wherein the substrate is arranged on the bonding pad and forms a reflecting cup with an opening together with the bonding pad;
the bonding pad comprises an anode bonding pad and a cathode bonding pad, a spacer is arranged between the anode bonding pad and the cathode bonding pad, one surface of the anode bonding pad and one surface of the cathode bonding pad, which faces the opening, are defined as a front surface, one surface of the spacer, which faces the opening, is defined as a spacing surface, and the spacing surface and the front surface are staggered to form a concave shape.
2. The LED support as set forth in claim 1, wherein: the distance between the plane where the spacing surface is located and the plane where the front surface is located is 1-35um.
3. The LED support as set forth in claim 2, wherein: the ratio of the distance between the plane where the spacing surface is located and the plane where the front surface is located to the height of the bonding pad is 1:100-7:60.
4. The LED support as set forth in claim 1, wherein: the cross section of the isolation piece is in a convex shape.
5. The LED support as set forth in claim 1, wherein: the reflecting cup comprises a first step and a second step, the first step is arranged at the opening of the reflecting cup far away from the front face, one end of the reflecting cup, which faces the front face, is defined as the bottom, and the second step is arranged at the bottom.
6. The LED cradle of claim 5, wherein: a slope section is formed between the first step and the second step, and the angle range of the slope section is 40-70 degrees.
7. The LED cradle of claim 5, wherein: the length of the spacing surface is coincident with the width of the bottom, and the width dimension of the spacing surface is in the range of 60-230um.
8. The LED support as set forth in claim 1, wherein: the vertical height of the reflecting cup ranges from 0.4 mm to 0.8mm.
9. An LED encapsulation lamp pearl, its characterized in that: the LED bracket comprises an LED chip, a packaging adhesive layer and the LED bracket as claimed in any one of claims 1-8, wherein the LED chip is arranged in the reflecting cup, and the height of the LED chip is smaller than the vertical height of the reflecting cup.
10. The LED package bead of claim 9, wherein: the packaging adhesive layer is filled in the reflecting cup, and the height of the packaging adhesive layer is consistent with the vertical height of the reflecting cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223120074.8U CN219017691U (en) | 2022-11-21 | 2022-11-21 | LED support and LED packaging lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223120074.8U CN219017691U (en) | 2022-11-21 | 2022-11-21 | LED support and LED packaging lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219017691U true CN219017691U (en) | 2023-05-12 |
Family
ID=86246395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223120074.8U Active CN219017691U (en) | 2022-11-21 | 2022-11-21 | LED support and LED packaging lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219017691U (en) |
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2022
- 2022-11-21 CN CN202223120074.8U patent/CN219017691U/en active Active
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