CN214379247U - Laser wafer SMD packaging structure - Google Patents
Laser wafer SMD packaging structure Download PDFInfo
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- CN214379247U CN214379247U CN202120314246.1U CN202120314246U CN214379247U CN 214379247 U CN214379247 U CN 214379247U CN 202120314246 U CN202120314246 U CN 202120314246U CN 214379247 U CN214379247 U CN 214379247U
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Abstract
The utility model discloses a laser wafer SMD packaging structure, it includes the copper bottom plate, locate the ceramic plate on the copper bottom plate, locate ceramic plate upper end and with copper bottom plate electric connection's copper sheet, be fixed in copper sheet upper end outlying ceramic seat, install in the base plate at this copper sheet upper end middle part, install the laser wafer on the base plate and be located this laser wafer side and with the rabdosia mirror of laser wafer adaptation, be fixed in the diffuser plate and the laminating of ceramic seat upper end and install in the fluorescence diaphragm of ceramic seat and diffuser plate upper end, be formed with sealed chamber between this copper sheet, ceramic seat and the diffuser plate, laser wafer and rabdosia mirror are arranged in sealed chamber, and the rabdosia mirror has the plane of reflection that is 45 jiaos slope, and the light emitting area of this laser wafer is located the plane of reflection to towards this plane of reflection. The utility model can effectively dissipate the heat generated by the laser wafer during working, thereby being convenient for prolonging the service life; the laser is reflected to the diffusion plate through the reflecting surface of the prism, so that the luminous surface is enlarged, and the use is more convenient.
Description
The technical field is as follows:
the utility model relates to a laser wafer encapsulation technical field refers in particular to a laser wafer SMD packaging structure.
Background art:
laser wafers in the prior art are packaged by adopting TO TO form a laser light source, and the laser light source is inserted into a PCB (printed circuit board) through a positive pin and a negative pin and is fixed by soldering tin; in the prior art, the laser light source can only utilize the tin added at the pin ends of the positive and negative electrodes for heat dissipation, so that the heat dissipation area is small, and the service life cannot be guaranteed; moreover, the light-emitting surface of the laser light source in the prior art is small, and the use is inconvenient.
In view of the above, the present inventors propose the following.
The utility model has the following contents:
an object of the utility model is to overcome prior art not enough, provide a laser wafer SMD packaging structure.
In order to solve the technical problem, the utility model discloses a following technical scheme: this laser wafer SMD packaging structure includes the copper bottom plate, set up the ceramic plate on this copper bottom plate, set up in the ceramic plate upper end and with copper bottom plate electric connection's copper sheet, be fixed in this copper sheet upper end outlying ceramic seat, install the base plate at this copper sheet upper end middle part, install the laser wafer on the base plate and be located this laser wafer side and with this laser wafer adaptation blush the mirror, be fixed in the diffuser plate of this ceramic seat upper end and laminate and install in the fluorescence diaphragm of this ceramic seat and diffuser plate upper end, be formed with sealed chamber between this copper sheet, ceramic seat and the diffuser plate, laser wafer and blush the mirror are arranged in this sealed chamber, and this blush the mirror has the plane of reflection that is 45 jiaos slopes, and the light emitting area of this laser wafer is located the plane of reflection side to towards this plane of reflection.
Furthermore, in the above technical scheme, the inner side of the upper end of the ceramic base is provided with a stepped groove, the diffusion plate is installed in the stepped groove, and the upper end face of the diffusion plate is flush with the upper end face of the ceramic base.
Furthermore, in the above technical scheme, two sides of the ceramic plate extend out of two side surfaces of the copper base plate and the copper sheet, and two side surfaces of the copper base plate are flush with two side surfaces of the copper sheet.
Further, in the above technical solution, a vacuum is formed inside the sealed cavity.
Further, in the above technical solution, the ceramic base is in a square frame shape.
After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect: the utility model adopts the copper bottom plate, the ceramic plate, the copper sheet and the ceramic seat as the frame, the laser wafer is arranged in the middle of the upper end of the copper sheet, the structure is convenient for effectively dissipating the heat generated by the laser wafer during the operation, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; furthermore, this rabdosia glass has the plane of reflection that is 45 jiaos of slopes, and the light emitting area of this laser wafer is located the plane of reflection side to towards this plane of reflection, with this through the rabdosia glass with laser reflection to diffuser plate, with this enlarge the light emitting area, it is more convenient to use, and this diffuser plate up end is provided with the fluorescence diaphragm, changes laser colour through the fluorescence diaphragm, and can improve light quality, the order the utility model discloses extremely strong market competition has.
Description of the drawings:
fig. 1 is a front view of the present invention.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific embodiments and accompanying drawings.
As shown in figure 1, the SMD packaging structure of a laser chip comprises a copper base plate 1, a ceramic plate 2 arranged on the copper base plate 1, a copper sheet 3 arranged at the upper end of the ceramic plate 2 and electrically connected with the copper base plate 1, a ceramic base 4 fixed at the periphery of the upper end of the copper sheet 3, a substrate 9 arranged in the middle of the upper end of the copper sheet 3, a laser chip 5 arranged on the substrate 9, a prism 6 arranged at the side of the laser chip 5 and matched with the laser chip 5, a diffusion plate 7 fixed at the upper end of the ceramic base 4 and a fluorescent membrane 8 attached to the upper ends of the ceramic base 4 and the diffusion plate 7, a sealed cavity 10 formed among the copper sheet 3, the ceramic base 4 and the diffusion plate 7, the laser chip 5 and the prism 6 arranged in the sealed cavity 10, wherein the prism 6 has a reflecting surface 61 inclined at an angle of 45 degrees, and the light emitting surface of the laser chip 5 is arranged on the reflecting surface 61, and toward the reflective surface 61. The utility model adopts the copper bottom plate 1, the ceramic plate 2, the copper sheet 3 and the ceramic seat 4 as the frame, the laser wafer 5 is arranged in the middle of the upper end of the copper sheet 3, the structure is convenient for effectively dissipating the heat generated by the laser wafer 5 during the operation, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; furthermore, this rabdosia glass 6 has the plane of reflection 61 that is 45 jiaos of slopes, and the light emitting area of this laser wafer 5 is located plane of reflection 61 side to towards this plane of reflection 61, with this through rabdosia glass 6 with laser reflection to diffuser plate 7, with this enlarge the light emitting area, it is more convenient to use, and this diffuser plate 7 up end is provided with fluorescence diaphragm 8, changes the laser colour through fluorescence diaphragm 8, and can improve luminous quality, the order the utility model discloses extremely strong market competition has.
Ceramic holder 4 upper end inboard is provided with ladder groove 41, diffuser plate 7 is installed in this ladder groove 41 to this guarantees assembly structure's stability, and this diffuser plate 7 up end flushes with ceramic holder 4 up end, and it is convenient for later stage subsides dress fluorescence diaphragm 8.
Two sides of the ceramic plate 2 extend out of two side surfaces of the copper base plate 1 and the copper sheet 3, and two side surfaces of the copper base plate 1 are flush with two side surfaces of the copper sheet 3.
The inside of the sealed cavity 10 forms a vacuum, which ensures the quality of the emitted light.
The ceramic seat 4 is in a square frame shape. The substrate 9 is a ceramic plate.
To sum up, the utility model adopts the copper bottom plate 1, the ceramic plate 2, the copper sheet 3 and the ceramic seat 4 as the frame, the laser wafer 5 is arranged in the middle of the upper end of the copper sheet 3, the structure is convenient for effectively dissipating the heat generated by the laser wafer 5 during the operation, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; furthermore, this rabdosia glass 6 has the plane of reflection 61 that is 45 jiaos of slopes, and the light emitting area of this laser wafer 5 is located plane of reflection 61 side to towards this plane of reflection 61, with this through rabdosia glass 6 with laser reflection to diffuser plate 7, with this enlarge the light emitting area, it is more convenient to use, and this diffuser plate 7 up end is provided with fluorescence diaphragm 8, changes the laser colour through fluorescence diaphragm 8, and can improve luminous quality, the order the utility model discloses extremely strong market competition has.
Of course, the above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the constructions, features, and principles of the present invention in accordance with the claims of the present invention are intended to be included in the scope of the present invention.
Claims (6)
1. The utility model provides a laser wafer SMD packaging structure which characterized in that: which comprises a copper base plate (1), a ceramic plate (2) arranged on the copper base plate (1), a copper sheet (3) arranged at the upper end of the ceramic plate (2) and electrically connected with the copper base plate (1), a ceramic seat (4) fixed at the periphery of the upper end of the copper sheet (3), a substrate arranged in the middle of the upper end of the copper sheet (3), a laser wafer (5) arranged on the substrate, a rabdosis lens (6) positioned at the side of the laser wafer (5) and matched with the laser wafer (5), a diffusion plate (7) fixed at the upper end of the ceramic seat (4) and a fluorescent membrane (8) attached to the upper ends of the ceramic seat (4) and the diffusion plate (7), wherein a sealing cavity (10) is formed among the copper sheet (3), the ceramic seat (4) and the diffusion plate (7), the laser wafer (5) and the rabdosis lens (6) are arranged in the sealing cavity (10), and the rabdosis lens (6) is provided with a reflecting surface (61) inclined at an angle of 45 degrees, the light-emitting surface of the laser wafer (5) is located beside the reflecting surface (61) and faces the reflecting surface (61).
2. The SMD package structure of claim 1, wherein: ceramic seat (4) upper end inboard is provided with ladder groove (41), diffuser plate (7) are installed in this ladder groove (41), and this diffuser plate (7) up end flushes with ceramic seat (4) up end.
3. The SMD package structure of claim 1 or 2, characterized in that: the two sides of the ceramic plate (2) extend out of the two side surfaces of the copper base plate (1) and the copper sheet (3), and the two side surfaces of the copper base plate (1) are flush with the two side surfaces of the copper sheet (3).
4. The SMD package structure of claim 3, wherein: the inside of the sealed cavity (10) forms vacuum.
5. The SMD package structure of claim 3, wherein: the ceramic seat (4) is in a square frame shape.
6. The SMD package structure of claim 3, wherein: the laser wafer (5) is electrically connected with the copper sheet (3) through a gold wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120314246.1U CN214379247U (en) | 2021-02-03 | 2021-02-03 | Laser wafer SMD packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120314246.1U CN214379247U (en) | 2021-02-03 | 2021-02-03 | Laser wafer SMD packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214379247U true CN214379247U (en) | 2021-10-08 |
Family
ID=77962921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120314246.1U Active CN214379247U (en) | 2021-02-03 | 2021-02-03 | Laser wafer SMD packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214379247U (en) |
-
2021
- 2021-02-03 CN CN202120314246.1U patent/CN214379247U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan Aika Intelligent Technology Co.,Ltd. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: DONGGUAN TRUSTING SMART CARD CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230106 Address after: No.6, Xinchun Road, No.5 Industrial Zone, Shangsha community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN SANCHUANG SMART CARD TECHNOLOGY CO.,LTD. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: Dongguan Aika Intelligent Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |