CN214379254U - SMD white laser packaging structure of collocation lens - Google Patents
SMD white laser packaging structure of collocation lens Download PDFInfo
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- CN214379254U CN214379254U CN202120314327.1U CN202120314327U CN214379254U CN 214379254 U CN214379254 U CN 214379254U CN 202120314327 U CN202120314327 U CN 202120314327U CN 214379254 U CN214379254 U CN 214379254U
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Abstract
The utility model discloses a white laser packaging structure of SMD of collocation lens, it includes metal substrate, locate the ceramic plate on the metal substrate, locate the sheetmetal of ceramic plate upper end, be fixed in sheetmetal upper end outlying ceramic seat, install in two inboard first in ceramic seat upper end, second laser wafer and be located first, the rabdosian mirror between the second laser wafer, be fixed in the light-passing board of ceramic seat upper end, the metal seat in ceramic seat upper end is installed in the laminating, install the lens on the metal seat, the light-emitting passageway department of metal seat is located to lens, be formed with sealed chamber between sheetmetal and the ceramic seat, it is first, the setting of second laser wafer all inclining, it is first, the light emitting area of second laser wafer all faces and is in the corner mirror. The utility model can effectively dissipate the heat generated by the first and the second laser wafers during working, so as to prolong the service life; the light of the first and second laser chips is reflected to the light-transmitting plate by the prism and then projected by the lens, so that the light-emitting surface is enlarged and the illumination intensity is enhanced.
Description
The technical field is as follows:
the utility model relates to a laser wafer encapsulation technical field refers in particular to a white laser packaging structure of SMD of collocation lens.
Background art:
laser wafers in the prior art are packaged by adopting TO TO form a laser light source, and the laser light source is inserted into a PCB (printed circuit board) through a positive pin and a negative pin and is fixed by soldering tin; in the prior art, the laser light source can only utilize the tin added at the pin ends of the positive and negative electrodes for heat dissipation, so that the heat dissipation area is small, and the service life cannot be guaranteed; moreover, the light-emitting surface of the laser light source in the prior art is small, and the use is inconvenient.
In view of the above, the present inventors propose the following.
The utility model has the following contents:
an object of the utility model is to overcome prior art's is not enough, provides the white laser packaging structure of SMD of a collocation lens.
In order to solve the technical problem, the utility model discloses a following technical scheme: the SMD white laser packaging structure matched with the lens comprises a metal base plate, a ceramic plate arranged on the metal base plate, a metal sheet arranged at the upper end of the ceramic plate and electrically connected with the metal base plate, a ceramic seat fixed at the periphery of the upper end of the metal sheet, a first laser wafer and a second laser wafer which are arranged at the two inner sides of the upper end of the ceramic seat, a rabdosis mirror which is positioned between the first laser wafer and the second laser wafer and is matched with the first laser wafer and the second laser wafer, a light-transmitting plate fixed at the upper end of the ceramic seat, a metal seat which is attached to the upper ends of the ceramic seat and the light-transmitting plate, and a lens arranged on the metal seat, wherein the metal seat is provided with a light-emitting channel, the lens is arranged at the light-emitting channel, a sealing cavity is formed between the metal sheet and the ceramic seat, the first laser wafer, the second laser wafer and the rabdosis mirror are arranged in the sealing cavity, and the first laser wafer and the second laser wafer are both obliquely arranged, the light-emitting surface of the first laser chip and the light-emitting surface of the second laser chip both face the prism.
Further, in the above technical solution, a first mounting portion and a second mounting portion are respectively formed on two sides of the upper end of the metal sheet, a first inclined surface is provided on the first mounting portion, a second inclined surface is provided on the second mounting portion, and the first laser wafer and the second laser wafer are respectively mounted on the first inclined surface and the second inclined surface.
Further, in the above technical solution, the first laser chip and the second laser chip are respectively mounted on a first substrate and a second substrate, and the first substrate and the second substrate are respectively mounted on the first inclined surface and the second inclined surface; the first laser wafer and the second laser wafer are respectively welded and conducted with the metal sheet through a plurality of first gold wires and second gold wires.
Further, in the above technical solution, the first laser wafer and the second laser wafer are symmetrically distributed in an inverted-splayed shape.
Further, in the above technical solution, the metal base plate and the metal sheet are both made of copper; the metal seat is an aluminum seat.
Further, in the above technical solution, the light-transmitting plate is any one of a transparent glass plate, a transparent sapphire plate, a transparent ceramic plate, and an acrylic plate.
Further, in the above technical scheme, the ceramic base upper end inboard is provided with the ladder groove, the light-passing board is installed in this ladder groove, and this light-passing board up end flushes with ceramic base up end.
Furthermore, in the above technical solution, two sides of the ceramic plate extend out of two side surfaces of the metal base plate and the metal sheet, and two side surfaces of the metal base plate are flush with two side surfaces of the metal sheet.
Further, in the above technical solution, a vacuum is formed inside the sealed cavity; the ceramic seat is in a square frame shape.
Further, in the above technical solution, the lens is a convex lens, and a fluorescent diaphragm is disposed at a lower end of the lens.
After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect: the utility model adopts the metal bottom plate, the ceramic plate, the metal sheet and the ceramic seat as the frame, the first laser wafer and the second laser wafer are arranged at the two inner sides of the upper end of the ceramic seat and are distributed at the two sides of the prism, the structure is convenient for effectively dissipating the heat generated by the first laser wafer and the second laser wafer during the work, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; moreover, this first laser wafer and second laser wafer all incline to set up, and this first laser wafer's light emitting area and second laser wafer's light emitting area all face this rabdosia glass to this reflects laser to the light-passing board through the rabdosia glass, and rethread lens throws away, with this expansion light emitting area, and can improve illumination intensity, guarantee the laser irradiation quality, it is more convenient to use.
Description of the drawings:
fig. 1 is a front view of the present invention.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific embodiments and accompanying drawings.
As shown in fig. 1, the SMD white laser package structure with a lens includes a metal base plate 1, a ceramic plate 2 disposed on the metal base plate 1, a metal plate 3 disposed on an upper end of the ceramic plate 2 and electrically connected to the metal base plate 1, a ceramic base 4 fixed on an upper periphery of the metal plate 3, a first laser chip 5 and a second laser chip 6 mounted on two inner sides of an upper end of the ceramic base 4, a diamond mirror 7 located between the first laser chip 5 and the second laser chip 6 and adapted to the first laser chip 5 and the second laser chip 6, a transparent plate 8 fixed on an upper end of the ceramic base 4, a metal base 9 attached to upper ends of the ceramic base 4 and the transparent plate 8, and a lens 10 mounted on the metal base 9, wherein the metal base 9 has a light emitting channel 91, the lens 10 is disposed at the light emitting channel 91, and a sealing cavity 100 is formed between the metal plate 3 and the ceramic base 4, the first laser wafer 5, the second laser wafer 6 and the rabdosia lens 7 are arranged in the sealed cavity 100, the first laser wafer 5 and the second laser wafer 6 are both obliquely arranged, and the light emitting surface of the first laser wafer 5 and the light emitting surface of the second laser wafer 6 both face the rabdosia lens 7. The utility model adopts the metal bottom plate 1, the ceramic plate 2, the metal sheet 3 and the ceramic base 4 as the frame, the first laser wafer 5 and the second laser wafer 6 are arranged at the two inner sides of the upper end of the ceramic base 4 and distributed at the two sides of the rabdosia mirror 7, the structure is convenient for effectively dissipating the heat generated by the first laser wafer 5 and the second laser wafer 6 during the work, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; moreover, this first laser wafer 5 and the equal slope setting of second laser wafer 6, the light emitting area of this first laser wafer 5 and the light emitting area of second laser wafer 6 all face this rabdosia mirror 7 to this reflects laser to light-passing board 8 through rabdosia mirror 7, and the rethread lens 9 throws away, with this expansion light emitting area, and can improve illumination intensity, guarantee the laser irradiation quality, it is more convenient to use.
The light emitting surface of the first laser chip 5 and the light emitting surface of the second laser chip 6 both face the prism 7, so that the laser is reflected to the light-transmitting plate 8 through the prism 7 to form white laser.
3 upper end both sides of sheetmetal are shaped respectively and are had first installation department 31 and second installation department 32, are provided with first inclined plane 311 on this first installation department 31, are provided with second inclined plane 321 on this second installation department 32, first laser wafer 5 and second laser wafer 6 are installed respectively on this first inclined plane 311 and second inclined plane 321, make first laser wafer 5 and second laser wafer 6 are the splayed symmetric distribution that falls, guarantee that the light emitting area of first laser wafer 5 and the light emitting area of second laser wafer 6 all face this blurry-glass 7.
The first laser wafer 5 and the second laser wafer 6 are respectively arranged on a first substrate 51 and a second substrate 61, and the first substrate 51 and the second substrate 61 are respectively arranged on the first inclined surface 311 and the second inclined surface 321; the first laser wafer 5 and the second laser wafer 6 are respectively welded and conducted with the metal sheet 3 through a plurality of first gold wires and second gold wires.
The metal base plate 1 and the metal sheet 3 are both made of copper, have strong electric conductivity and have strong heat conduction and heat dissipation functions. The metal seat 9 is an aluminum seat.
The light-transmitting plate 8 is any one of a transparent glass plate, a transparent sapphire plate, a transparent ceramic plate and an acrylic plate.
The inboard ladder groove 41 that is provided with of ceramic seat 4 upper end, light-passing board 8 is installed in this ladder groove 41, and this light-passing board 8 up end flushes with ceramic seat 4 up end.
Two sides of the ceramic plate 2 extend out of two side surfaces of the metal base plate 1 and the metal sheet 3, and two side surfaces of the metal base plate 1 are flush with two side surfaces of the metal sheet 3.
The inside of the sealed chamber 100 is formed with a vacuum, which ensures the quality of light emission.
The ceramic seat 4 is in a square frame shape.
To sum up, the utility model adopts the metal base plate 1, the ceramic plate 2, the metal sheet 3 and the ceramic base 4 as the frame, the first laser wafer 5 and the second laser wafer 6 are installed at the inner sides of the two upper ends of the ceramic base 4 and distributed at the two sides of the rabdosian mirror 7, the structure is convenient for effectively dissipating the heat generated by the first laser wafer 5 and the second laser wafer 6 during the operation, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; moreover, this first laser wafer 5 and the equal slope setting of second laser wafer 6, the light emitting area of this first laser wafer 5 and the light emitting area of second laser wafer 6 all face this rabdosia mirror 7 to this reflects laser to light-passing board 8 through rabdosia mirror 7, and the rethread lens 9 throws away, with this expansion light emitting area, and can improve illumination intensity, guarantee the laser irradiation quality, it is more convenient to use.
Of course, the above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the constructions, features, and principles of the present invention in accordance with the claims of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The utility model provides a collocation lens SMD white laser packaging structure which characterized in that: which comprises a metal base plate (1), a ceramic plate (2) arranged on the metal base plate (1), a metal sheet (3) arranged at the upper end of the ceramic plate (2) and electrically connected with the metal base plate (1), a ceramic base (4) fixed at the periphery of the upper end of the metal sheet (3), a first laser wafer (5) and a second laser wafer (6) arranged at the two inner sides of the upper end of the ceramic base (4), a prism (7) arranged between the first laser wafer (5) and the second laser wafer (6) and matched with the first laser wafer (5) and the second laser wafer (6), a light-transmitting plate (8) fixed at the upper end of the ceramic base (4), a metal base (9) attached to the upper ends of the ceramic base (4) and the light-transmitting plate (8), and a lens (10) arranged on the metal base (9), wherein the metal base (9) is provided with a light-emitting channel (91), this lens (10) set up in light-emitting channel (91) department, are formed with sealed chamber (100) between this sheetmetal (3) and ceramic seat (4), first laser wafer (5) and second laser wafer (6) and rabdosia mirror (7) are arranged in this sealed chamber (100), and this first laser wafer (5) and second laser wafer (6) all incline to set up, and the light emitting area of this first laser wafer (5) and the light emitting area of second laser wafer (6) all face this rabdosia mirror (7).
2. The SMD white laser package structure with lens of claim 1, wherein: the laser chip comprises a metal sheet (3), wherein a first installation part (31) and a second installation part (32) are formed on two sides of the upper end of the metal sheet (3) respectively, a first inclined surface (311) is arranged on the first installation part (31), a second inclined surface (321) is arranged on the second installation part (32), and a first laser chip (5) and a second laser chip (6) are installed on the first inclined surface (311) and the second inclined surface (321) respectively.
3. The SMD white laser package structure with lens of claim 2, wherein: the first laser wafer (5) and the second laser wafer (6) are respectively arranged on a first substrate (51) and a second substrate (61), and the first substrate (51) and the second substrate (61) are respectively arranged on the first inclined surface (311) and the second inclined surface (321); the first laser wafer (5) and the second laser wafer (6) are respectively welded and conducted with the metal sheet (3) through a plurality of first gold wires and second gold wires.
4. The SMD white laser package structure with lens of claim 2, wherein: the first laser wafer (5) and the second laser wafer (6) are symmetrically distributed in an inverted splayed shape.
5. The SMD white laser package structure with lens according to any one of claims 1-4, wherein: the metal bottom plate (1) and the metal sheet (3) are both made of copper; the metal seat (9) is an aluminum seat.
6. The SMD white laser package structure with lens according to any one of claims 1-4, wherein: the light-transmitting plate (8) is any one of a transparent glass plate, a transparent sapphire plate, a transparent ceramic plate and an acrylic plate.
7. The SMD white laser package structure with lens of claim 5, wherein: ceramic seat (4) upper end inboard is provided with ladder groove (41), light-passing board (8) are installed in this ladder groove (41), and this light-passing board (8) up end flushes with ceramic seat (4) up end.
8. The SMD white laser package structure with lens of claim 5, wherein: two sides of the ceramic plate (2) extend out of two side surfaces of the metal base plate (1) and the metal sheet (3), and two side surfaces of the metal base plate (1) are flush with two side surfaces of the metal sheet (3).
9. The SMD white laser package structure with lens of claim 5, wherein: a vacuum is formed inside the sealed cavity (100); the ceramic seat (4) is in a square frame shape.
10. The SMD white laser package structure with lens of claim 5, wherein: the lens (10) is a convex lens, and a fluorescent diaphragm (101) is arranged at the lower end of the lens (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120314327.1U CN214379254U (en) | 2021-02-03 | 2021-02-03 | SMD white laser packaging structure of collocation lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120314327.1U CN214379254U (en) | 2021-02-03 | 2021-02-03 | SMD white laser packaging structure of collocation lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214379254U true CN214379254U (en) | 2021-10-08 |
Family
ID=77962875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120314327.1U Active CN214379254U (en) | 2021-02-03 | 2021-02-03 | SMD white laser packaging structure of collocation lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214379254U (en) |
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2021
- 2021-02-03 CN CN202120314327.1U patent/CN214379254U/en active Active
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Address after: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan Aika Intelligent Technology Co.,Ltd. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: DONGGUAN TRUSTING SMART CARD CO.,LTD. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230112 Address after: No.6, Xinchun Road, No.5 Industrial Zone, Shangsha community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN SANCHUANG SMART CARD TECHNOLOGY CO.,LTD. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: Dongguan Aika Intelligent Technology Co.,Ltd. |